At Huawei Connect 2025, held in Shanghai, Eric Xu, the Rotating Chairman of Huawei, delivered a keynote speech that laid out the company’s ambitious roadmap for AI infrastructure, computing power, and ecosystem development. His speech reflected Huawei’s growing focus on building high-performance systems that can support… Read More
Webinar – IP Design Considerations for Real-Time Edge AI SystemsIt is well-known that semiconductor growth is driven…Read More
WEBINAR: Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation ToolsWhy should high frequency circuit designers consider stability…Read More
Visualizing hidden parasitic effects in advanced IC design By Omar Elabd As semiconductor designs move below…Read More
Statically Verifying RTL Connectivity with SynopsysMany years ago, not long after we first…Read More
Assertion IP (AIP) for Improved Design VerificationOver the years design reuse methodology created a…Read MoreGlobal Semiconductor Industry Outlook 2026
PwC’s comprehensive report, “Semiconductor and Beyond,” released in 2026, provides a strategic outlook on the global semiconductor industry amid rapid transformations driven by AI, geopolitical tensions, and supply chain shifts. Structured into four sections—Foreword, Demand Analysis, Supply Analysis,… Read More
SiFive Launches Second-Generation Intelligence Family of RISC-V Cores
SiFive, founded by the original creators of the RISC-V instruction set, has become the leading independent supplier of RISC-V processor IP. More than two billion devices already incorporate SiFive designs, ranging from camera controllers and SSDs to smartphones and automotive systems. The company no longer sells its own chips,… Read More
Simulating Gate-All-Around (GAA) Devices at the Atomic Level
Transistor fabrication has spanned the gamut from planar devices o FinFET to Gate-All-Around (GAA) as silicon dimensions have decreased in the quest for higher density, faster speeds and lower power. Process development engineers use powerful simulation tools to predict and even optimize transistor performance for GAA devices.… Read More
AI Revives Chipmaking as Tech’s Core Engine
A century ago, 391 San Antonio Road in Mountain View, California, housed an apricot-packing shed. Today, it’s marked by sculptures of diodes and a transistor, commemorating the 1956 founding of Shockley Semiconductor Laboratory—the birthplace of Silicon Valley. William Shockley, co-inventor of the transistor, aimed… Read More
The IO Hub: An Emerging Pattern for System Connectivity in Chiplet-Based Designs
In chiplet-based design we continue the march of Moore’s Law by scaling what we can put in a semiconductor package beyond the boundaries of what we can build on a single die. This style is already gaining traction in AI applications, high performance computing, and automotive, each of which aims to scale out to highly integrated … Read More
Future Horizons Industry Update Webinar IFS 2025
The Future Horizons Industry Update Webinar, presented today by Malcolm Penn, provides a comprehensive analysis of the semiconductor industry’s current state and future trajectory. Founded in 1989, Future Horizons leverages over 300 man-years of experience, emphasizing impartial insights from facts (e.g., IMF … Read More
Something New in Analog Test Automation
Digital design engineers have used DFT automation technologies like scan and ATPG for decades now, however, analog blocks embedded within SoCs have historically required that a test engineer write tests that require specialized expertise and that can take man-months to debug. Siemens has a long history in the DFT field, SPICE… Read More
MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency
MediaTek’s first chipset using 2nm technology expected in late 2026
MediaTek, a global leader in fabless semiconductor design, has announced a groundbreaking achievement in its partnership with TSMC. The company has successfully developed a flagship system-on-chip (SoC) utilizing TSMC’s cutting-edge 2nm process technology,… Read More
Advancing Semiconductor Design: Intel’s Foveros 2.5D Packaging Technology
In the rapidly evolving landscape of semiconductor manufacturing, the demand for processors that handle increasing workloads while maintaining power efficiency and compact form factors has never been higher. Intel’s Foveros 2.5D packaging technology emerges as a pivotal innovation, enabling denser die integration… Read More


The AI PC: A New Category Poised to Reignite the PC Market