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Sidense is an interesting company in a very important market segment. Sidense was founded in 2004 and their 1T-OTP memory macros are now used in hundreds of chips from 180nm to 16nm for code storage, secure encryption keys, analog and sensor trimming and calibration, ID tags, and chip and processor configuration.
If you are designing… Read More
As I mentioned in my previous post, the TSMC investor call this month was very interesting and Morris Chang was in fine form during the Q&A. As a semiconductor professional I think some of the questions are ridiculous but maybe they have value to the financial people. This one question from Randy, who I think is very astute, is … Read More
In my office there are plenty of LED displays for me to look at throughout the day: three 24″ displays from Viewsonic, a 15″ display from Apple, an iPad, a Samsung Galaxy Note 4, a Nexus tablet, a Garmin 520 bike computer, and a temperature display. LED and OLED displays are ubiquitous in all sorts of consumer electronics,… Read More
I caught up with John Ferguson of Mentor Graphics this week to learn more about a recent announcement that TSMC has extended its collaboration with Mentor in the area of Fan-Out Wafer Level Processing (FOWLP).
In March of last year Mentor and TSMC announced that they were collaborating on a design and verification flow for TSMC’s… Read More
It had to happen. We’ve read about hacking deep learning / machine learning, so now there is a discipline emerging around studying and defending against potential attacks. Of course, the nature of attacks isn’t the same; you can’t really write an algorithmic attack against a non-algorithmic analysis (or at least a non-standard… Read More
Recently an autonomous car company highlighted some plans to keep their vehicles safe from hacking. Yet their plans won’t actually make them secure. Such gaffs highlight issues across many different industries where cybersecurity is not sufficiently understood by manufacturers to deliver products hardened against attack.… Read More
IP development strategy and hockeyby Tom Dillinger on 01-19-2017 at 7:00 amCategories: Analog Bits, FinFET, IP, TSMC
One of the greatest hockey players of all time, Wayne Gretzky, provided a quote that has also been applied to the business world — “I skate to where the puck will be, not to where it has been.” It strikes me that this philosophy directly applies to IP development, as well. Engineering firms providing IP must anticipate… Read More
CES 2017 wrapped up last week in Las Vegas. The show had over 175,000 attendees and over 3,800 exhibiting companies, according to the organizer, the Consumer Technology Association (CTA). The U.S. had the most companies exhibiting at CES with 1,755. China was close behind at 1,575 companies according to Benjamin Joffe’s article… Read More
There’s an article published in InfoWorld on jobs trends in several emerging tech areas. The trends are based on analysis of job postings and job-seeker searches from the beginning of 2014, sourced by Indeed.com. I would have liked to dig deeper into Inded.com, to get more info on jobs in our industry but unfortunately it seems you… Read More
The Year of the eFPGAby Tom Dillinger on 01-17-2017 at 12:00 pmCategories: eFPGA, Flex Logix, FPGA, IP
The start of the new year is typically a time for annual predictions. Prognostications are especially difficult in our industry, due to the increasing difficulty in Moore’s Law technology scaling and greater design complexity challenges. There is one sure prediction, however — this year will see the emergence … Read More
Should Intel be Split in Half?