Changing RISC-V Verification Requirements, Standardization, InfrastructureA lively panel discussion about RISC-V and open-source…Read More
Semidynamics: A Single-Software-Stack, Configurable and Customizable RISC-V SolutionFounded with a vision to create transformative, customizable…Read More
Synopsys-Ansys 2.5D/3D Multi-Die Design Update: Learning from the Early AdoptersThe demand for high-performance computing (HPC), data centers,…Read More
Arteris Empowering Advances in Inference AcceleratorsSystolic arrays, with their ability to highly parallelize…Read More
The Convergence of Functional with Safety, Security and PPA VerificationFormal For All! “Do I need a PhD…Read More
The increasing demands of data-intensive applications necessitate more efficient storage and memory utilization. The rapid evolution of AI workloads, particularly with Generative AI (GenAI), demands infrastructure that can adapt to diverse computational needs. AI models vary widely in resource requirements, necessitating… Read More
The TSMC Technology Symposium provides a worldwide stage for TSMC to showcase its advanced technology impact and the extensive ecosystem that is part of the company’s vast reach. These events occur around the world and the schedule is winding down. TSMC covers many topics at its Technology Symposium, including industry-leading… Read More
AI requires more Silicon capacity
Deep in the supply chain, some wizards turn sand into perfect diamond-structured crystal disks of silicon, which are necessary for the entire semiconductor supply chain.
They are part of the semiconductor supply chain, making Silicon Sand almost a thousand times more valuable.
The glimmer … Read More
Dan is joined by Mark Himelstein, President of Heavenstone. Most recently, as Chief Technology Officer at RISC-V International, Mark contributed to shaping RISC-V technology through visionary leadership and industry expertise. He has a track record of executive roles at Graphite Systems, Quantum, and Infoblox.
Dan discusses… Read More
In the fast-paced world of Electronic Design Automation (EDA), the complexity of chip designs is continuously rising. With the burgeoning of systems such as 5G communication devices and Advanced Driver-Assistance Systems (ADAS) teeming with thousands of components, the demand for robust and efficient prototyping platforms… Read More
Dieter Therssen obtained his master’s degree in Electronics Engineering from KU Leuven in 1987. He started his career as a hardware design engineer, using IMEC’s visionary tools and design methodologies in the early days of silicon integration.
Since then, Dieter developed his career across many digital technologies,… Read More
At the recent User2user conference, Amit Kumar, Principal Hardware Engineer, Microsoft, shared the company’s experience from building a 3DIC SoC and highlighted Siemens EDA tools that were used. The following is a synthesis of core aspects of that talk.
Despite the numerous advantages of 3DIC technology, its… Read More
Establishing void-free fill of high aspect ratio TSVs, capped by a thin and uniform bulk layer optimized for removal by CMP, means fully optimizing each of a series of critical phases. As we will see in this 3-part series, the conditions governing outcomes for each phase vary greatly, and the complexity of interacting factors means… Read More
The difficulty of SoC integration is clearly getting more demanding. Driven by process node density, multi-chip integration and seemingly never-ending demands for more performance at lower power, the hurdles continue to increase. When you consider these challenges in the context of Arteris, it’s natural to think about hardware… Read More
Today’s advanced node chip designs are faced with many new complexities from design and verification down to manufacturing. The solutions used at every stage of chip development generate petabytes of data. Managing, analyzing, understanding, and acting upon that data is overwhelming and paralyzing. Manual interpretation… Read More
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