Synopsys has deepened its collaboration with TSMC certifying the Ansys portfolio of simulation and analysis tools for TSMC’s cutting-edge manufacturing processes including N3C, N3P, N2P, and A16. This partnership empowers chip designers to perform precise final checks on designs, targeting applications in AI acceleration,… Read More





Via Multipatterning Regardless of Wavelength as High-NA EUV Lithography Becomes Too Stochastic
For the so-called “2nm” node or beyond, the minimum metal pitch is expected to be 20 nm or even less, while at the same time, contacted gate pitch is being pushed to 40 nm [1]. Therefore, we expect via connections that can possibly be as narrow as 10 nm (Figure 1)! For this reason, it is natural to expect High-NA EUV lithography as the go-to
CEO Interview with Jiadi Zhu of CDimension
Jiadi Zhu is the CEO and founder of CDimension, a company rethinking chip design to shape the next generation of computing. Under his leadership, CDimension is creating the next generation of building blocks for chips, starting with materials and scaling up to full systems that can power everything from today’s AI and advanced… Read More
Podcast EP308: How Clockwork Optimizes AI Clusters with Dan Zheng
Daniel is joined by Dan Zheng, VP of Partnerships and Operations at Clockwork. Dan was the General Manager for Product and Partnerships at Urban Engines which was acquired by Google in 2016. He has also held roles at Stanford University and Google.
Dan explores the challenges of operating massive AI hardware infrastructure at … Read More
CEO Interview with Howard Pakosh of TekStart
Howard Pakosh is a serial entrepreneur and angel investor. Mr. Pakosh is also Founder & CEO of the TekStart Group, a Toronto-based boutique incubator focusing on Fractional-C business development support, as well as developing, promoting and licensing technology into markets such as blockchain, Internet-of-Things… Read More
SkyWater Technology Update 2025
SkyWater Technology, a U.S. based pure-play semiconductor foundry, has made significant strides in 2025 reinforcing its position as a leader in domestic semiconductor manufacturing. Headquartered in Bloomington, Minnesota, SkyWater specializes in advanced innovation engineering and high volume manufacturing of differentiated… Read More
TSMC’s Push for Energy-Efficient AI: Innovations in Logic and Packaging
In his keynote at the TSMC OIP Ecosystem Forum Dr. LC Lu, TSMC Senior Fellow and Vice President, Research & Development / Design & Technology Platform, highlighted the exponential rise in power demand driven by AI proliferation. AI is embedding itself everywhere, from hyperscale data centers to edge devices, fueling… Read More
Semiconductor Equipment Spending Healthy
Global spending on semiconductor manufacturing equipment totaled $33.07 billion in the 2nd quarter of 2025, according to SEMI and SEAJ. 2Q 2025 spending was up 23% from 2Q 2024. China had the largest spending at $11.36 billion, 34% of the total. However, China spending in 2Q 2025 was down 7% from 2Q 2024. Taiwan had the second largest… Read More
Yuning Liang’s Painstaking Push to Make the RISC-V PC a Reality
At Embedded World 2025 in Nuremberg, Germany, on March 11, 2025, Yuning Liang, DeepComputing Founder and CEO walked onto the stage with a mischievous smile and a challenge. “What’s the hardest product to make?” he asked rhetorically. “A laptop. It’s bloody hard… but we did it. You can swap the motherboard, you can upgrade, you can’t… Read More
Arm Lumex Pushes Further into Standalone GenAI on Mobile
When I first heard about GenAI on mobile platforms – from Arm, Qualcomm and others – I confess I was skeptical. Surely there wouldn’t be enough capacity or performance to deliver more than a proof of concept? But Arm, and I’m sure others, have been working hard to demonstrate this is more than a party trick. It doesn’t hurt that foundation… Read More
Semiconductor Equipment Spending Healthy