The latest advanced driver-assistance systems (ADAS) like Mercedes’ Drive Pilot and Tesla’s FSD perform SAE Level 3 self-driving, with the driver ready to take back control if the vehicle calls for it. Reaching Level 5 – full, unconditional autonomy – means facing a new class of challenges unsolvable with existing technology… Read More



WEBINAR: Scalable, On-Demand (by the Minute) Verification to Reach Coverage Closure
Verification has long been the most time-consuming and often resource-intensive part of chip development. Building out the infrastructure to tackle verification can be a costly endeavor, however. Emerging and even well-established semiconductor companies must weigh the Cost-of-Results (COR) against Time-to-Results
Connecting SystemC to SystemVerilog
Siemens EDA is clearly on a mission to help verifiers get more out of their tools and methodologies. Recently they published a white paper on UVM polymorphism. Now they have followed with a paper on using UVM Connect, re-introducing how to connect between SystemC and SystemVerilog. I’m often mystified by seemingly overlapping… Read More
Truechip: Customer Shipment of CXL3 VIP and CXL Switch Model
The tremendous amount of data generated by AI/ML driven applications and other hyperscale computing applications have forced the age old server architecture to change. The new architecture is driven by the resource disaggregation paradigm, wherein memory and storage are decoupled from the host CPU and managed independently… Read More
WEBINAR: Unlock your Chips’ Full Data Transfer Potential with Interlaken
Way back in the early 2000s when XAUI was falling short on link flexibility a search for an alternative chip-to-chip data transfer interface with SPI like features lead Cisco Systems and Cortina System to put forward the proposal for the Interlaken standard. The new standard married the best of XAUI’s serialized data and SPI’s … Read More
GM Buyouts: Let’s Get Small!
“I sell new cars to legitimize my used car business.” – Wes Lutz, president Extreme Chrysler/Dodge/Jeep, RAM Inc., Jackson, Mich. National Automobile Dealer Association board member
Since taking over at General Motors, CEO Mary Barra has made many radical adjustments in the company’s international footing in the interest… Read More
Podcast: Intel’s RISC-V Ecosystem initiative with Junko Yoshida
Welcome to our Podcast on Intel’s RISC-V Ecosystem initiative. I’m Junko Yoshida, Editor in Chief of the Ojo-Yoshida Report. Joining me today to discuss the topic are Vijay Krishnan, general manager of RISC-V Ventures at Intel Corp. and Emerson Hsiao, chief operating officer of Andes Technologies USA
The views,… Read More
CEO Interview: Jan Peter Berns from Hyperstone
Since 2012, Dr. Jan Peter Berns is the CEO of Hyperstone, a producer of Flash Memory Controllers for Industrially Embedded Storage Solutions. Before that, he held a Senior Manager Position at Toshiba Electronics for several years. Jan Peter brings more than 20 years of management and executive experience in the semiconductor… Read More
WEBINAR The Rise of the SmartNIC
A recent live discussion between experts Scott Schweitzer, Director of SmartNIC Product Planning with Achronix, and Jon Sreekanth, CTO of Accolade Technology, looked at the idea behind the rise of the SmartNIC and ran an “ask us anything” session fielding audience questions about the technology and its use cases.
Three phases
… Read MoreApplication-Specific Lithography: 5nm Node Gate Patterning
It has recently been revealed that the N5 node from TSMC has a minimum gate pitch of 51 nm [1,2] with a channel length as small as 6 nm [2]. Such a tight channel length entails tight CD control in the patterning process, well under 0.5 nm. What are the possible lithography scenarios?
Blur Limitations for EUV Exposure
A state-of-the-art
Should Intel be Split in Half?