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Scaling AI as a Service Demands New Server Hardware

Scaling AI as a Service Demands New Server Hardware
by Bernard Murphy on 03-14-2023 at 6:00 am

NLP min

While I usually talk about AI inference on edge devices, for ADAS or the IoT, in this blog I want to talk about inference in the cloud or an on-premises datacenter (I’ll use “cloud” below as a shorthand to cover both possibilities). Inference throughput in the cloud is much higher today than at the edge. Think about support in financial… Read More


MIPI D-PHY IP brings images on-chip for AI inference

MIPI D-PHY IP brings images on-chip for AI inference
by Don Dingee on 03-13-2023 at 10:00 am

Perceive Ergo 2 brings images on-chip for AI inference with Mixel MIPI D-PHY IP

Edge AI inference is getting more and more attention as demand grows for AI processing across an increasing number of diverse applications, including those requiring low-power chips in a wide range of consumer and enterprise-class devices. Much of the focus has been on optimizing the neural network processing engine for these… Read More


SPIE Advanced Lithography Conference 2023 – AMAT Sculpta® Announcement

SPIE Advanced Lithography Conference 2023 – AMAT Sculpta® Announcement
by Scotten Jones on 03-13-2023 at 8:00 am

Applied Materials Sculpta Presentation for Media Page 06

The SPIE Advanced Lithography Conference is the semiconductor industries premier conference on lithography. The 2023 conference was held the week of February 27th and at the conference Applied Materials announced their Sculpta® pattern shaping tool. Last week I had an opportunity to interview Steven Sherman the Managing … Read More


Podcast EP147: CachQ’s Harnessing of Heterogeneous Compute with Clay Johnson

Podcast EP147: CachQ’s Harnessing of Heterogeneous Compute with Clay Johnson
by Daniel Nenni on 03-10-2023 at 10:00 am

Dan is joined by Clay Johnson, CEO and co-founder of CacheQ Systems. Clay has more than 25 years of executive management experience across a broad spectrum of technologies including computing, security, semiconductors and EDA tools.

Dan discusses the CacheQ QCC development platform with Clay. This platform enables software… Read More


Cadence Hosts ESD Alliance Seminar on New Export Regulations Affecting EDA and SIP March 28

Cadence Hosts ESD Alliance Seminar on New Export Regulations Affecting EDA and SIP March 28
by Bob Smith on 03-10-2023 at 6:00 am

ESD Alliance Export Seminar 2023

Anyone interested in learning about general trade compliance concepts or how export control and sanction regulations affect the electronic systems design ecosystem will want to attend the upcoming ESD Alliance export seminar. It will be hosted by Ada Loo, chair of the ESD Alliance Export Committee and Cadence’s Group Director… Read More


AAA Hypes Self-Driving Car Fears

AAA Hypes Self-Driving Car Fears
by Roger C. Lanctot on 03-09-2023 at 10:00 am

AAA Hypes Self Driving Car Fears

The AAA (U.S. auto club) must have AGHD (attention-getting deficit disorder). The headline from the organization’s latest research is: “Fear of Self-Driving Cars is on the Rise.” That should straighten things out, right?

The survey was conducted across a representative sample of U.S. households, according to the reported… Read More


Deep thinking on compute-in-memory in AI inference

Deep thinking on compute-in-memory in AI inference
by Don Dingee on 03-09-2023 at 6:00 am

Compute-in-memory for AI inference uses an analog matrix to instantaneously multiply an incoming data word

Neural network models are advancing rapidly and becoming more complex. Application developers using these new models need faster AI inference but typically can’t afford more power, space, or cooling. Researchers have put forth various strategies in efforts to wring out more performance from AI inference architectures,… Read More


DSP Innovation Promises to Boost Virtual RAN Efficiency

DSP Innovation Promises to Boost Virtual RAN Efficiency
by Bernard Murphy on 03-08-2023 at 6:00 am

DSP multi threading min

5G is already real, though some of us are wondering why our phone connections aren’t faster. That perspective misses the real intent of 5G – to extend high throughput (and low latency) communication to a vast number and variety of edge devices beyond our phones. One notable application is Fixed Wireless Access (FWA), promising … Read More


Multi-Die Systems Key to Next Wave of Systems Innovations

Multi-Die Systems Key to Next Wave of Systems Innovations
by Kalar Rajendiran on 03-07-2023 at 10:00 am

Shift to Multi Die Systems is Happening Now

These days, the term chiplets is referenced everywhere you look, in anything you read and in whatever you hear. Rightly so because the chiplets or die integration wave is taking off. Generally speaking, the tipping point that kicked off the move happened around the 16nm process technology when large monolithic SoCs started facing… Read More