On July 18, 2025, a DACtv session titled “From Atoms to Tokens” explored the semiconductor supply chain’s transformation, as presented in the YouTube video. The speaker tackled the challenges and innovations from the atomic level of chip fabrication to the tokenized ecosystems of AI-driven data centers, emphasizing the critical… Read More





Siemens EDA and Nvidia: Pioneering AI-Driven Chip Design
On July 18, 2025, Siemens EDA and Nvidia presented a compelling vision for the future of electronic design automation (EDA) at a DACtv event, emphasizing the transformative role of artificial intelligence (AI) in semiconductor and PCB design. Amit Gupta, Vice President and General Manager at Siemens EDA, and John Lynford, head… Read More
Materials Selection Methodology White Paper
The Granta EduPack White Paper on Materials Selection, authored by Harriet Parnell, Kaitlin Tyler, and Mike Ashby, presents a practical and educational guide to selecting materials in engineering design. Developed by Ansys and based on Ashby’s well-known methodologies, the paper outlines a four-step process to help learners… Read More
AI and Machine Learning in Chip Design: DAC Keynote Insights
In a keynote at the 62nd Design Automation Conference (#62DAC) on July 8, 2025, Jason Cong, Volgenau Chair for Engineering Excellence Professor, UCLA, reflected on over 30 years in the DAC community, highlighting the transformative role of AI and machine learning (ML) in semiconductor design. The speaker, whose first DAC paper… Read More
Enabling the AI Revolution: Insights from AMD’s DAC Keynote
In a keynote by Michaela Blott, AMD Senior Fellow, at the 62nd Design Automation Conference (DAC) on July 8, 2025, explored the trends shaping the AI revolution, emphasizing inference efficiency and hardware customization. While acknowledging AMD’s efforts in scaling GPUs and achieving energy efficiency goals (30x… Read More
AI Evolution and EDA’s Role in the Fourth Wave: William Chappell’s DAC Keynote
In a keynote at the 62nd Design Automation Conference (DAC) on July 8, 2025, William Chappell, Vice President of Mission Systems at Microsoft, reflected on the intertwined evolution of AI and semiconductor design. Drawing from his DARPA experience, Chappell traced AI’s progression from 2016 onward, highlighting its… Read More
AI-Driven ECAD Library Creation: Streamlining Semiconductor Design
On July 9, 2025, Julie Liu, PalPilot International presented for DACtv, unveiling Footprintku AI, a groundbreaking platform for automating configurable ECAD (Electronic Computer-Aided Design) library creation. This innovative solution addresses the inefficiencies of manual library generation, leveraging AI and … Read More
Modern Data Management: Overcoming Bottlenecks in Semiconductor Engineering
In a DACtv session on July 9, 2025, Pedro Pires from Keysight’s Design Engineering Software addressed the critical role of data management in modern semiconductor engineering projects. The presentation highlighted why data has become a bottleneck, how Keysight’s SOS (Save Our Source) platform mitigates these challenges,… Read More
Formal Verification: Why It Matters for Post-Quantum Cryptography
Formal verification is becoming essential in the design and implementation of cryptographic systems, particularly as the industry prepares for post-quantum cryptography (PQC). While traditional testing techniques validate correctness over a finite set of scenarios, formal verification uses mathematical proofs to guarantee… Read More
CEO Interview with Bob Fung of Owens Design
Bob Fung is the CEO of Owens Design, a Silicon Valley company specializing in the design and build of complex equipment that powers high-tech manufacturing. Over his 22-year tenure, Bob has led the development of more than 200 custom systems for world-class companies across the semiconductor, biomedical, energy, and emerging… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet