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Managing Service Level Risk in SoC Design

Managing Service Level Risk in SoC Design
by Bernard Murphy on 06-21-2023 at 6:00 am

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Discussion on design metrics tends to revolve around power, performance, safety, and security. All of these are important, but there is an additional performance objective a product must meet defined by a minimum service level agreement (SLA). A printer display may work fine most of the time yet will intermittently corrupt the… Read More


DDR5 Design Approach with Clocked Receivers

DDR5 Design Approach with Clocked Receivers
by Daniel Payne on 06-20-2023 at 10:00 am

DFE min

At the DesignCon 2023 event this year there was a presentation by Micron all about DDR5 design challenges like the need for a Decision Feedback Equalizer (DFE) inside the DRAM. Siemens EDA and Micron teamed up to write a detailed 25 page white paper on the topic, and I was able to glean the top points for this much shorter blog. The DDR5… Read More


Synopsys Expands Agreement with Samsung Foundry to Increase IP Footprint

Synopsys Expands Agreement with Samsung Foundry to Increase IP Footprint
by Kalar Rajendiran on 06-20-2023 at 6:00 am

Synopsys Samsung silicon wafer

Many credible market analysis firms are predicting the semiconductor market to reach the trillion dollar mark over the next six years or so. Just compare this to the more than six decades it took for the market to cross the $500 billion mark. The projected growth rate is incredible indeed and is driven by fast growing market segments… Read More


Keynote Sneak Peek: Ansys CEO Ajei Gopal at Samsung SAFE Forum 2023

Keynote Sneak Peek: Ansys CEO Ajei Gopal at Samsung SAFE Forum 2023
by Daniel Nenni on 06-19-2023 at 10:00 am

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As one of the world’s leading chip foundries, Samsung occupies a vital position in the semiconductor value chain. The annual Samsung Advanced Foundry Ecosystem (SAFE™) Forum is a must-go event for semiconductor and electronic design automation (EDA) professionals. Ajei Gopal, President and CEO of Ansys, has the honor of delivering… Read More


Application-Specific Lithography: 28 nm Pitch Two-Dimensional Routing

Application-Specific Lithography: 28 nm Pitch Two-Dimensional Routing
by Fred Chen on 06-19-2023 at 6:00 am

Brightfield (red) and darkfield (purple) sidelobes in 84 nm

Current 1a-DRAM and 5/4nm foundry nodes have minimum pitches in the 28 nm pitch range. The actual 28 nm pitch patterns are one-dimensional active area fins (for both DRAM and foundry) as well as one-dimensional lower metal lines (in the case of foundry). One can imagine that, for a two-dimensional routing pattern, both horizontal… Read More


Podcast EP168: The Extreme View of Meeting Signal Integrity Challenges at Wild River Technology with Al Neves

Podcast EP168: The Extreme View of Meeting Signal Integrity Challenges at Wild River Technology with Al Neves
by Daniel Nenni on 06-16-2023 at 10:00 am

Dan is joined by Al Neves, Founder and Chief Technology Officer at Wild River Technology. Al has 30 years of experience in design and application development for semiconductor products and capital equipment focused on jitter and signal integrity. He is involved with the signal integrity community as a consultant, high-speed… Read More


Requirements for Multi-Die System Success

Requirements for Multi-Die System Success
by Daniel Nenni on 06-16-2023 at 6:00 am

Synopsys Chiplet Report 2023

Chiplets continue to be a hot topic on SemiWiki, conferences, white papers, webinars and one of the most active chiplet enabling vendors we work with is Synopsys. Synopsys is the #1 EDA and #1 IP company so that makes complete sense.

As you may have read, I moderated a panel on Chiplets at the last SNUG which we continue to write about.

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Crypto modernization timeline starting to take shape

Crypto modernization timeline starting to take shape
by Don Dingee on 06-15-2023 at 10:00 am

CNSA Suite 2.0 crypto modernization timeline

Post-quantum cryptography (PQC) might be a lower priority for many organizations, with the specter of quantum-based cracking seemingly far off. Government agencies are fully sensitized to the cracking risks and the investments needed to mitigate them and are busy laying 10-year plans for migration to quantum-safe encryption.… Read More


S2C Accelerates Development Timeline of Bluetooth LE Audio SoC

S2C Accelerates Development Timeline of Bluetooth LE Audio SoC
by Daniel Nenni on 06-15-2023 at 6:00 am

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S2C has been shipping FPGA prototyping platforms for SoC verification for almost two decades, and many of its customers are developing SoCs and silicon IP for Bluetooth applications.  Prototyping Bluetooth designs before silicon has yielded improved design efficiencies through more comprehensive system validation, and… Read More


Semico Research Quantifies the Business Impact of Deep Data Analytics, Concludes It Accelerates SoC TTM by Six Months

Semico Research Quantifies the Business Impact of Deep Data Analytics, Concludes It Accelerates SoC TTM by Six Months
by Kalar Rajendiran on 06-14-2023 at 10:00 am

Design Costs Comparison

The semiconductor industry has been responding to increasing device complexity and performance requirements in multiple ways. To create smaller and more densely packed components, the industry is continually advancing manufacturing technology. This includes the use of new materials and processes, such as extreme ultraviolet… Read More