Manager – Mechanical and Thermal Engineering

Job Description:

Position Overview

Join Intel’s Networking Platforms Operation as an Engineering Manager leading cutting-edge hardware design for FNIC and IPU board products. This player-coach role combines strategic leadership with hands-on technical expertise, managing a dynamic team of mechanical, thermal, and board layout engineers developing next-generation networking technology.

Key Responsibilities

Team Leadership & Strategy

• Lead and develop a cross-functional team of mechanical, thermal, and CAD engineers
• Define technology roadmaps for board design aligned with Intel’s strategic objectives
• Translate customer requirements and product architecture into executable design solutions
• Coach and mentor team members in advanced technology development and career growth

Technical Excellence & Innovation

• Drive development and implementation of innovative board product solutions
• Partner with engineering, product planning, and customer-facing teams to deliver industry-leading power, performance, and design solutions
• Establish strategic partnerships with industry leaders to foster innovation and research collaboration
• Develop long-term capability strategies for emerging technological requirements

Operational Leadership

• Manage resources and priorities to meet aggressive project timelines
• Foster cross-team collaboration to maximize operational outcomes
• Set clear performance goals and maintain accountability for team results
• Promote an inclusive, high-performance work environment

Qualifications:

The Minimum qualifications are required to be initially considered for this position.  Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• Bachelor’s degree in Mechanical/Manufacturing Engineering or in a related field and 7+ years of experience
• 5+ years of leadership experience managing engineering teams
• 5+ years of experience with server platforms and data center technologies.
• Experience with cloud enterprise and telecommunications infrastructure applications
• Experience in heat transfer, CFD analysis, and materials selection for electronics cooling
• Experience with high-density PCB layout constraints and complex PCBA assembly integration

Preferred Qualifications

• Post Graduate Degree in in Mechanical/Manufacturing Engineering or in a related field
• Proficiency in CAD software (SolidWorks preferred)
• Experience with thermal simulation tools (Ansys, FloTHERM, or equivalent)
• Background working with OEMs, ODMs, or contract manufacturing partners
• Experience in assembly and manufacturing processes

What We Offer

This role provides an exceptional opportunity to shape the future of networking technology while leading a world-class engineering team at one of the industry’s most innovative companies.