Intel Foundry Gathers Customers and Partners, Outlines Priorities (Intel Connect Live)
- Thread starter Daniel Nenni
- Start date
UMC is a teaching partner.
I do not believe TSMC works with PDF internally. UMC used to for sure as it is all about yield. A partnership with PDF is a good thing for Intel Foundry, absolutely.
Yes. Sassine emphasize it is synopsys when he started speaking.Did you notice that Lip-Bu called him Sassine Gaza CEO of Cadence?
Perhaps LipBu knows something we don't
I guess 10 years of leading cadence have that imprinted in LipBu mind deeply.
It is interesting to note that Intel will have two versions of 14A, EUV and HNA-EUV. My guess is that HNA-EUV will not have the throughput for HVM in that time frame so Intel can use HNA-UEV for internal products while offering 14 EUV for customers. Since TSMC A16 and A14 are EUV this should not be a competitive problem for IFS.
MKWVentures
Moderator
Great Info thanks
18A high volume in Q4 2025, correct? any idea how high the volume is? 10K per month?
So the Tapeouts to date on 18A are Government? those are actual products Taped out already?
18A high volume in Q4 2025, correct? any idea how high the volume is? 10K per month?
So the Tapeouts to date on 18A are Government? those are actual products Taped out already?
Yes. Sassine emphasize it is synopsys when he started speaking.
Perhaps LipBu knows something we don't
No, the only IFS tape-out to date is MediaTek. The US Government will use 18A for AI chips is my guess but that will be 18AP. I'm wondering how many 18A customers will push it out to 18AP for the extra performance? Intel 18AP was due to customer demand, right?
Is it really necessary to call Intel the "embattled chipmaker"? How low can Reuters go?
By Max A. Cherney, Stephen Nellis
SAN JOSE, California (Reuters) -Intel said on Tuesday that several of its contract manufacturing customers planned to build test chips for a forthcoming advanced manufacturing process, which the company still has in development.
The embattled chipmaker indicated it had received interest from customers at its Direct Connect conference on Tuesday for its contract chip business, or foundry. Intel's attempt to build a foundry unit has hit snags, but ultimately the goal has been to rival TSMC.
By Max A. Cherney, Stephen Nellis
SAN JOSE, California (Reuters) -Intel said on Tuesday that several of its contract manufacturing customers planned to build test chips for a forthcoming advanced manufacturing process, which the company still has in development.
The embattled chipmaker indicated it had received interest from customers at its Direct Connect conference on Tuesday for its contract chip business, or foundry. Intel's attempt to build a foundry unit has hit snags, but ultimately the goal has been to rival TSMC.
hist78
Well-known member
To make matters even more confusing, Apple iPhones utilize the Apple A* series SoCs. The iPhone 16 Pro and Pro Max, released in 2024, are powered by the Apple A18 and A18 Pro SoCs, which were designed by Apple and manufactured using TSMC's N3E process.
The Apple A18 outperforms the A17, which in turn surpasses the A16, A15, and A14. Based on Apple’s naming convention, a larger number indicates a more advanced and powerful SoC compared to those with smaller numbers while TSMC is going the opposite way.
Additionally, it’s possible that we may soon see Apple A21 SoCs manufactured using TSMC's A14 process and Apple A23 SoCs produced with TSMC's A10 process. This naming evolution seems confusing between Apple and TSMC.
jorgequinonez
Member
Thank Apple too for their uncreative AP names (A17, A18, A19....).