Webinar: Step-by-Step Guide for Your UCIe Design Verification
Webinar: Step-by-Step Guide for Your UCIe Design Verification
Synopsys Webinar | Thursday, August 10, 2023 | 9-10 a.m. Pacific As traditional Moore’s law scaling approaches its physical limits, the industry is moving towards multi-die solutions for higher electronics system densities. Multi-die designs present one way for engineers to pack more functionality into silicon chips and improve yield without affecting fabrication feasibility or project …
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