MZ Technologies Launches Advanced Packaging Design Video Series

In a significant move aimed at empowering semiconductor and systems-design engineers, MZ Technologies has announced the launch of a new video series focused on advanced packaging design. This initiative comes at a time when the semiconductor industry is rapidly shifting toward multi-die, 2.5D/3D integration, heterogeneous chiplets and package-level innovation, and MZ Technologies is positioning itself at the heart of that transformation.

MZ Technologies has built its reputation on offering cutting-edge co-design tools for chiplet/package integration through its GENIO family of products. The company’s solutions enable system-level exploration of packaging choices and dielectric, thermal, mechanical and interconnect tradeoffs, allowing designers to make informed decisions early in the flow. Their focus on “path-finding” for multi-die systems addresses a classic pain point in advanced packaging: which architecture to choose and how it will behave.

With the new video series, MZ Technologies aims to open the black box of advanced packaging: presenting real-world challenges, design strategies and best practices in navigating the complex world of multi-die, 3D integration, thermal/mechanical stress, interposer and heterogeneous assembly. Early episodes already highlight topics such as heterogeneous 3D integration, multi-die design and advanced packaging challenges, often featuring insights from the company’s founder and CEO, Anna Fontanelli.

The timing is notable. As traditional approaches to scaling (i.e., monolithic Moore’s Law) decelerate, system-architects and packaging engineers are increasingly required to rethink design from the package outward. MZ’s video series effectively addresses this shift by presenting the “why” and “how” of advanced packaging, not just the tool. For example, the series helps clarify how thermal gradients and mechanical stresses in 3D-packaged systems can cause warpage, delamination, or interconnect failure, a major barrier for adoption.

In practice, making multi-die designs work requires coordinated decisions — from chiplet placement and interconnect architecture to thermal path planning and substrate materials. MZ’s video series appears to take a system-level storytelling approach: detailing how to break down the complexity, weigh trade-offs, and optimize early in the engineering timeline. The value of such content is especially high for designers who must navigate the sizing of interconnects, plan for mechanical reliability, and reconcile package-PCB interactions. By sharing expert-level conversations and architectural case studies, the series helps demystify what might otherwise remain a niche specialized discipline.

Another key benefit: the series functions as a bridge between EDA tool-capabilities and real-world design problems. Instead of simply promoting software, MZ uses the video format to build thought leadership, establishing the company not only as a tool vendor but also as an educator and industry advocate for advanced packaging design. It supports a marketing strategy that emphasizes deeper engagement with potential users, who may be architects, package engineers, reliability specialists or system integrators.

For companies embarking on advanced packaging projects, the video series offers a practical resource. Engineers might use episodes as discussion starters: internal training, design-kickoff meetings, or to guide cross-discipline teams (chip, package, board) toward a shared understanding of assembly constraints and system-level goals. As 2.5D/3D heterogenous systems become increasingly common in AI, high-performance computing, and edge devices, the demand for such educational content grows.

View the first video here.

Bottom line: MZ Technologies’ launch of an advanced-packaging design video series is a strategically sound and timely move. It reflects both the evolving needs of semiconductor packaging and the company’s ambition to position itself as a thought leader. For design teams facing the paradigm shift toward multi-die and 3D integration, the series promises to be an invaluable guide, one that goes beyond tool features to address underlying architectural and process challenges.

Also Read:

Video EP4: A Deeper Look at Advanced Packaging & Multi-Die Design Challenges with Anna Fontanelli

Video EP3: A Discussion of Challenges and Strategies for Heterogeneous 3D Integration with Anna Fontanelli

2025 Outlook Anna Fontanelli MZ Technologies