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Cadence’s Strategic Leap: Acquiring Hexagon’s Design & Engineering Business

Cadence’s Strategic Leap: Acquiring Hexagon’s Design & Engineering Business
by Admin on 09-05-2025 at 8:00 am

Key Takeaways

  • Cadence Design Systems is acquiring Hexagon AB's Design & Engineering business for approximately €2.7 billion, aiming to enhance its capabilities in physical AI and complex system design.
  • The acquisition will integrate advanced simulation technologies from Hexagon, including MSC Software, which specializes in computer-aided engineering simulations across various industries.
  • Cadence plans to fund 70% of the purchase price in cash and 30% in stock, which allows Hexagon to maintain a stake in Cadence's future success.
  • The acquisition is expected to accelerate Cadence's Intelligent System Design strategy, enabling them to offer end-to-end solutions for multidomain systems, particularly in smart manufacturing and aerospace.
  • Market analysts view the deal positively, as it is seen as a catalyst for Cadence's growth in non-traditional EDA sectors, while also presenting integration and regulatory challenges.

Cadence Hexagon

In a bold move that underscores the accelerating convergence of electronic design automation (EDA) and mechanical engineering, Cadence Design Systems announced its agreement to acquire Hexagon AB’s Design & Engineering (D&E) business for approximately €2.7 billion, equivalent to about $3.16 billion. This transaction, expected to close in the first quarter of 2026, represents a significant expansion for Cadence, integrating advanced simulation technologies into its portfolio and positioning the company at the forefront of physical AI and complex system design.

Cadence Design Systems, headquartered in San Jose, California, is a global leader in EDA software, providing tools essential for designing integrated circuits, systems-on-chips, and printed circuit boards. The company has long been a staple in the semiconductor industry, aiding giants like Intel and NVIDIA in bringing cutting-edge chips to market. Over the years, Cadence has pursued aggressive growth through acquisitions, such as its 2023 purchase of Intrinsix for aerospace and defense expertise, and the 2024 integration of BETA CAE Systems to bolster its multiphysics simulation capabilities. This latest deal with Hexagon fits seamlessly into that strategy, enhancing Cadence’s offerings in system-level analysis where electronic and mechanical domains intersect.

Hexagon AB, a Stockholm-based multinational technology group, specializes in digital reality solutions that combine sensor, software, and autonomous technologies. Its D&E business, which generated around €500 million in revenue in 2024, includes flagship products like MSC Software, a pioneer in computer-aided engineering (CAE) simulations. MSC’s tools excel in structural analysis, multibody dynamics, and acoustics, serving industries from automotive to aerospace. By divesting this unit, Hexagon aims to streamline its portfolio, focusing on its core strengths in metrology, geospatial software, and manufacturing intelligence. The sale aligns with Hexagon’s ongoing efforts to optimize operations, as stated in their press release, allowing them to invest more heavily in high-growth areas like smart manufacturing and sustainability solutions.

Under the terms of the agreement, Cadence will fund 70% of the purchase price in cash and the remaining 30% in stock, providing Hexagon with a stake in Cadence’s future success. This hybrid payment structure not only mitigates immediate cash outflow for Cadence but also signals confidence in the synergies ahead. The acquisition is poised to accelerate Cadence’s Intelligent System Design strategy, which emphasizes AI-driven workflows for faster, more efficient product development. By incorporating Hexagon’s mechanical simulation expertise, Cadence can offer end-to-end solutions for multidomain systems—think electric vehicles where battery electronics must integrate flawlessly with structural components, or drones requiring precise aerodynamics alongside embedded software.

The strategic implications are profound. In an era where products are increasingly “smart” and interconnected, the boundaries between hardware disciplines are blurring. Cadence’s CEO, Anirudh Devgan, highlighted in the announcement that this move will “accelerate our expansion in physical AI and system design and analysis,” enabling customers to tackle unprecedented complexity in product engineering. For instance, automotive manufacturers could simulate vehicle crashes with integrated electronics behavior, reducing prototyping costs and time-to-market. Aerospace firms might optimize aircraft designs for fuel efficiency while ensuring electronic systems withstand vibrations. This integration is particularly timely amid the rise of Industry 4.0, where digital twins—virtual replicas of physical assets—demand sophisticated multiphysics modeling.

Market analysts have reacted positively, viewing the deal as a catalyst for Cadence’s growth in non-traditional EDA sectors. Shares of Cadence rose modestly in after-hours trading following the announcement, reflecting investor optimism about revenue diversification. Hexagon’s stock also saw gains, as the divestiture is seen as unlocking value for shareholders. However, challenges loom: integrating Hexagon’s 2,000+ employees and ensuring cultural alignment will be key. Regulatory approvals, especially in Europe and the U.S., could pose hurdles given the deal’s size and the strategic importance of simulation technologies in defense applications.

Looking ahead, this acquisition could reshape the CAE landscape, intensifying competition with rivals like Ansys (recently acquired by Synopsys) and Siemens Digital Industries Software. Cadence’s enhanced portfolio might spur innovation in emerging fields like sustainable energy systems and biomedical devices, where precise engineering simulations are critical.

Bottom line: Cadence’s acquisition of Hexagon’s D&E business is more than a financial transaction—it’s a visionary step toward unified engineering platforms in a hyper-connected world. As industries demand faster iteration and greater reliability, this union promises to deliver tools that bridge electronic and mechanical worlds, fostering breakthroughs that could define the next decade of technological advancement.

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Streamlining Functional Verification for Multi-Die and Chiplet Designs

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