IMGTC Webinar SemiWIki
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FD-SOI is Worth More Than Two Cores

FD-SOI is Worth More Than Two Cores
by Paul McLellan on 01-20-2013 at 10:00 pm

This is the second blog entry about an ST Ericsson white-paper on multiprocessors in mobile. The first part was here.

The first part of the white-paper basically shows that for mobile the optimal number of cores is two. It is much better to use process technology (and good EDA) to run the processor at higher frequency rather than add… Read More


OTP @ 2013 Common Platform Technology Forum

OTP @ 2013 Common Platform Technology Forum
by Daniel Nenni on 01-06-2013 at 9:00 pm

Sidense will be exhibiting at the Common Platform Technology Forum in Santa Clara, California on February 5, during which time they will be discussing their one-transistor, one-time programmable (1T-OTP) memory IP products. Based on their patented 1T-Fuse™ bit cell, Sidense antifuse-based 1T-OTP macros offer a secure, reliable,… Read More


ST Microelectronics: Strategic Options

ST Microelectronics: Strategic Options
by Paul McLellan on 12-01-2012 at 5:11 pm

ST Microelectronics announced yesterday that it would have a conference call on December 10th to announce its strategy going forward. ST has been struggling the last couple of years, with revenues down year to year. From 2010-2012 (the last an estimate of course) it did $10.3B, $9.6B and $8.4B so it has shrunk nearly 20% in 3 years.… Read More


Tanner EDA Tops 1,200 Active Customers!

Tanner EDA Tops 1,200 Active Customers!
by Daniel Nenni on 11-22-2012 at 8:33 pm

It is always nice to see when an EDA company grows organically, versus inorganically by acquiring friends and foes. It is also nice to see when an EDA company invests in the fabless semiconductor ecosystem because, as we know, we are all in this together.

Tanner EDA celebrated its 25th anniversary this year by adding 149 new customers… Read More


EDA Solutions at Ultra Low Power Developer Forum Demonstrates Mixed-Signal Flow including Tools from Tanner EDA, Incentia and Aldec

EDA Solutions at Ultra Low Power Developer Forum Demonstrates Mixed-Signal Flow including Tools from Tanner EDA, Incentia and Aldec
by Daniel Payne on 10-04-2012 at 4:49 pm

EDA Solutions, sole representative in Europe for Tanner EDA and Incentia Design Systems, is exhibiting at the ‘Design & Elektronik’ Developer Forum on Ultra Low Power in Munich, Germany, on October 10, 2012, at the Holiday Inn (Munich – City Centre).

EDA Solutions will be presenting its complete analog, digital and… Read More


Schematic Capture, Analog Fast SPICE, and Analysis Update

Schematic Capture, Analog Fast SPICE, and Analysis Update
by Daniel Payne on 09-20-2012 at 1:10 pm

At the DAC show in June I met with folks at Berkeley DA and heard about their Analog Fast SPICE simulator being used inside of the Tanner EDA tools. With the newest release from Tanner called HiPer Silicon version 15.23 you get a tight integration between:… Read More


SpringSoft Laker vs Tanner EDA L-Edit

SpringSoft Laker vs Tanner EDA L-Edit
by Daniel Nenni on 08-26-2012 at 7:00 pm

Daniel Payne recently blogged some of the integration challenges facing Synopsys with their impending acquisition of SpringSoft. On my way back from San Diego last week I stopped by Tanner EDA to discuss an alternative tool flow for users who find themselves concerned about the Laker Custom Layout road map.

Design of the analog… Read More


IC Design at Novocell Semiconductor

IC Design at Novocell Semiconductor
by Daniel Payne on 07-05-2012 at 12:09 pm

In my circuit design past I did DRAM work at Intel, so I was interested in learning more about Novocell Semiconductor and their design of One Time Programmable (OTP) IP. Walter Novosell is the President/CTO of Novocell and talked with me by phone on Thursday.… Read More


Designing a Wafer-Scale Image Sensor for use in X-Rays

Designing a Wafer-Scale Image Sensor for use in X-Rays
by Daniel Payne on 06-22-2012 at 1:32 pm

At Intel we mused about designing wafer-scale integration (WSI) back in the 70’s however I just learned about how Dr.Renato Turchetta at the Science and Technology Facilities Council (STFC) designed a wafer-scale imaging sensor chip for X-Ray applications. I was also able to interview Dr. Turchetta to learn more about… Read More