At the recent Semicon West, Michel Haond of ST Microelectronics had a presentation on 14nm FD-SOI, or what they more lengthily call UTBB FD-SOI (which when you expand it all out comes to Ultra Thin Body and Buried-Oxide Fully Depleted Silicon on Insulator). When Chenming Hu (or whoever in his group) came up with the term FinFET it … Read More
When TSMC advocates FD-SOI…
I found a patent recently (May,14 2013) granted to TSMC “Planar Compatible FDSOI Design Architecture”, the following sentences, directly extracted from this patent, advertise FDSOI design better than a commercial promotion! “Devices formed on SOI substrates offer many advantages over their bulk counterparts, including… Read More
Analog Model Equivalence Checking Accelerates SoC Verification
In the race to reduce verification time for ever growing sizes of SoCs, various techniques are being adopted at different levels in the design chain, functional verification being of utmost priority. In an analog-digital mixed design, which is the case with most of the SoCs, the Spice simulation of analog components is the limiting… Read More
How Much Power to Allocate to IoT Connectivity?
Ensigma is in fact the low-power radio processing unit (RPU) architecture, completing Imagination Technologies (IMG) port-folio, the well-known graphic processing unit (GPU) PowerVR family and MIPS CPU core products. If we take a look at the block diagram “Ensigma Series4 Explorer RPU”, we can easily identifies the Radio … Read More
Wipe that smile off your device
Privacy is a tough enough question when using a device – but what about when we’re done with it? In a world of two year service agreements with device upgrades and things being attached to long-life property like cars and homes, your data could fall into the hands of the next owner way too easily.
“Oh, it’s OK, I wiped the phone with a factory… Read More
FD-SOI: 20nm Performance at 28nm Cost
There has been a lot of controversy about whether FD-SOI is or is not cheaper to manufacture than FinFET. Since right now FinFET is a 16nm process (22nm for Intel) and FD-SOI is, for now, a 28nm process it is not entirely clear how useful a comparison this is. Scotten Jones has very detailed process cost modeling software (that is what… Read More
Taking a leap forward from TCAD
We all know that Technology Computer Aided Design (TCAD) simulations are essential in developing processes for semiconductor manufacturing. From the very nature of these simulations (involving physical structure and corresponding electrical characteristics of a transistor or device), they are predominantly finite-element… Read More
Improve Your Memory the Sonics Way
There is never enough memory bandwidth. Well, occasionally there is but many SoCs have lots of blocks that communicate through memory, typically off-chip DRAM. In 2001 Sonics created their first solution to this problem with MemMax technology that was incorporated into their SonicsSX product. This has been used in over 100 designs… Read More
New Release of Semulator3D at #semiconwest
One of Coventor’s flagship products is SEMulator3D, and at Semicon West they announced a new version, 2014.100.
SEMulator3D is a powerful 3D semiconductor and MEMS process modeling platform. It uses highly efficient physics-driven voxel modeling technology. It models the physical effects of process steps, which is… Read More
Keywords: FD-SOI, Cost, FinFET
How to synthesize a pretty good article Is SOI Really Less Expensive, and even more important the impressive amount of comments (56) generated? Let’s start with the initial article. Pretty good, but slightly biased, when you carefully dissect it, like I did in one of the comments (you can find it in-extenso at the end of this post).… Read More