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TSMC Banner 2023
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ASML is Strong Because TSMC is Hot!

ASML is Strong Because TSMC is Hot!
by Robert Maire on 10-15-2020 at 10:00 am

TSMC ASML EUV 2020
  • ASML has strong quarter lead by great Taiwan and EUV
  • EUV “crossed over” DUV as revenue leader- signaling new era
  • Taiwan doubles, China grows, Korea weaker, US further behind

ASML hits great numbers
ASML reported revenues of Euro 4B, with income of Euro 2.54EPS, both beating estimates handily. Ten EUV systems were … Read More


Three Things You Have Wrong About Intel!

Three Things You Have Wrong About Intel!
by Daniel Nenni on 10-09-2020 at 10:00 am

Three Things You Have Wrong About Intel

First let me tell you that I have nothing but respect for Intel. I grew up with them in Silicon Valley and have experienced firsthand their brilliance and the many contributions they have made to the semiconductor industry. In fact, I can easily say the semiconductor ecosystem would not be what it is today without Intel.

But no company… Read More


Will the U.S. and China go to War for TSMC?

Will the U.S. and China go to War for TSMC?
by Daniel Nenni on 10-05-2020 at 4:00 am

Will the U.S. and China go to War over TSMC

The semiconductor industry has never been more exciting than it is today and that is a mouthful given what we have accomplished over the last 50 years. From mainframe computers to a supercomputer in our pockets or on our wrists. Even if you don’t believe in miracles, semiconductor technology comes really close, absolutely.

U.S.Read More


5G, Hyperscaling and the Resurgence of Consumer Silicon

5G, Hyperscaling and the Resurgence of Consumer Silicon
by Ramsay Allen on 10-04-2020 at 6:00 am

TSMC 5G OIP 2020

At the recent TSMC OIP Ecosystem Forum and Technology virtual events, TSMC re-affirmed their previous prediction that 5G is going to be a multi-year silicon mega-trend with the biggest drivers being the ramp up of 5G handsets, supporting infrastructure and the continued growth of high performance computing (HPC).

We all want… Read More


Synopsys talks about their DesignWare USB4 PHY at TSMC’s OIP

Synopsys talks about their DesignWare USB4 PHY at TSMC’s OIP
by Tom Simon on 09-25-2020 at 6:00 am

USB4 operating modes

When USB initially came out it revolutionized how peripherals connect to host systems. We all remember when Apple did away with many separate connections for mouse, keyboard, audio and more with their first computers supporting USB. USB has continued to develop more flexibility and more throughput. In 2015 Apple again introduced… Read More


Highlights of the TSMC Technology Symposium – Part 3

Highlights of the TSMC Technology Symposium – Part 3
by Tom Dillinger on 09-09-2020 at 8:00 am

CoWoS features

Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time.  This article is the last of three that attempts to summarize the highlights of the presentations.  This article focuses on the technology design enablement roadmap, as described by Cliff Hou, SVP, R&D.

Key TakeawaysRead More


Dolphin Design – Delivering High-Performance Audio Processing with TSMC’s 22ULL Process

Dolphin Design – Delivering High-Performance Audio Processing with TSMC’s 22ULL Process
by Mike Gianfagna on 09-07-2020 at 10:00 am

Dolphin Design – Delivering High Performance Audio Processing with TSMCs 22ULL Process

TSMC held their very popular Open Innovation Platform event (OIP) on August 25. The event was virtual of course and was packed with great presentations from TSMC’s vast ecosystem. One very interesting and relevant presentation was from Dolphin Design, discussing the delivery of high-performance audio processing using TSMC’s… Read More


Highlights of the TSMC Technology Symposium – Part 2

Highlights of the TSMC Technology Symposium – Part 2
by Tom Dillinger on 09-07-2020 at 8:00 am

3D Fabric

Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time.  This article is the second of three that attempts to summarize the highlights of the presentations.  This article focuses on the TSMC advanced packaging technology roadmap, as described by Doug Yu, VP, R&D.

KeyRead More


In-Chip Monitoring Helps Manage Data Center Power

In-Chip Monitoring Helps Manage Data Center Power
by Tom Simon on 09-07-2020 at 6:00 am

in-chip sensing

Designers spend plenty of time analyzing the effects of process, voltage and temperature. But everyone knows it’s not enough to simply stop there. Operating environments are tough and have lots of limitations, especially when it comes to power consumption and thermal issues. Thermal protection and even over-voltage protections… Read More


Highlights of the TSMC Technology Symposium – Part 1

Highlights of the TSMC Technology Symposium – Part 1
by Tom Dillinger on 09-04-2020 at 8:00 am

A72 core high density

Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time.  This article is the first of three that attempts to summarize the highlights of the presentations.

This article focuses on the TSMC process technology roadmap, as described by the following executives:

  • Y.J. Mii, SVP,
Read More