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Atomic layer deposition (ALD) is a thin-film deposition method that continues to enable continuous advances in semiconductor device fabrication. Essentially, it involves exposing substrates sequentially to at least two different vapor phase atmospheres in which self-limiting reactions take place on the surface: the first… Read More
The semiconductor industry’s incredible juggernaut has been powered by device innovations at its very core. Moreover, present-day enterprises encounter immense competitive pressures and innovations are a key differentiator to maintain their competitive edge1.
“It wasn’t that Microsoft was so brilliant or clever… Read More
In 2020 TSMC established its Net Zero Project with a goal of net zero emissions by 2050. I remember wondering how could this possibly be done before 2050 or at all for that matter. After working with TSMC for 20+ years I have learned never to bet against them on any topic and green manufacturing is one of them, absolutely.
TSMC presented… Read More
This is the 5th webinar in our series of webinars to explore trending topics on materials and semiconductor development. Join us to discover how digital solutions are forming new ways of operating in a fast-paced, highly demanding semiconductor industry.
With data analytics and digital tools, we are setting new standards for
Area selective processing (ASP) is assuming ever greater importance in semiconductor fabrication. ASP involves deposition and removal of materials at the molecular level¾10 nm or less. Key applications of ASP include self-aligned contacts and fully self-aligned vias (FSAVs), scaling boosters that are essential to continue… Read More
I had a follow-on discussion with Alex Yoon from our podcast last year. He is as a Head of Strategic and Emerging Technologies and partnerships at Intermolecular, part of EMD electronics.
Prior to joining EMD electronics, he was Senior Technical Director at Lam Research, led activities in emerging memory and novel materials … Read More
The ferroelectric effect in materials has been exploited to fabricate (fab) reliable Ferroelectric Random Access Memories (FRAM) Non-Volatile Memory (NVM) ICs for over 20 years. Recent years have seen have seen a breakthrough in discovering ferroelectric properties in Hafnium Oxide (HfO2 or “hafnia”), a fab-friendly… Read More
There are many unsung heroes in our industry – companies that provide unique services and expertise that enable the rapid advances in fabrication process development that we’ve come to rely upon. Some of these companies offer “back-end” services, assisting semiconductor fabs with yield diagnostic engineering and failure… Read More
Casper van Oosten is the Business Field Head and Managing Director for Intermolecular, Inc., acquired by Merck KGaA, Darmstadt, Germany in 2019. Prior to this role, Casper worked in various roles on Eyrise™ Dynamic Liquid Crystal Window in Veldhoven, the Netherlands, at an affiliate of Merck KGaA, Darmstadt, Germany. Casper… Read More
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