For more than 65 years, the IEEE International Electron Devices Meeting (IEDM) has been the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. As I post this, the conference is underway in San Francisco… Read More
CEO Interview: David Moore of Pragmatic
David has almost 25 years of leadership experience in the semiconductor industry. Prior to joining Pragmatic, he served as Chief Strategy Officer at Micron Technology, Inc. He also spent six years at Intel Corporation in various roles, including General Manager of the Programmable Solutions Group, where he led the multi-billion-dollar… Read More
Predicting Stochastic Defectivity from Intel’s EUV Resist Electron Scattering Model
The release and scattering of photoelectrons and secondary electrons in EUV resists has often been glossed over in most studies in EUV lithography, despite being a fundamental factor in the image formation. Fortunately, Intel has provided us with a laboriously simulated electron release and scattering model, using the GEANT4… Read More
Arm Total Design Hints at Accelerating Multi-Die Activity
I confess I am reading tea leaves in this blog, but why not? Arm recently announced Arm Total Design, an expansion of their Compute Subsystems (CSS) offering which made me wonder about the motivation behind this direction. They have a lot of blue-chip partners lined up for this program yet only a general pointer to multi-die systems… Read More
Powering eMobility Through Silicon-Carbide Substrates
While writing on infotainment and ADAS I sometimes wonder about the devices that make an EV run. These have nothing to do with digital or software wizardry. While logic and software play a role, the real heart of EV power is in power electronics driving motors, regenerative braking and charger options at home and on the road. Technologies… Read More
Analog Bits Leads the Way at TSMC OIP with High-Accuracy Sensors
The 15th TSMC Open Innovation Platform® (OIP) event was held recently. This event is a focal point across the industry for cutting-edge development and industry-level collaboration. Appropriately, advanced packaging, paving the way for multi-die design was a focal point for the event. You can get a good overview of what was … Read More
FD-SOI, the technology shaping the future of automotive radars
By Philippe Flatresse, Bich-Yen Nguyen, Rainer Lutz of SOITEC
I. Introduction
Automotive radar is a key enabler for the development of advanced driver assistance systems (ADAS) and autonomous vehicles. The use of radar allows vehicles to sense their environment and make decisions based on that information, enhancing… Read More
TSMC N3E is ready for designs, thanks to IP from Synopsys
TSMC has been offering foundry services since 1987, and their first 3nm node was called N3 and debuted in 2022; now they have an enhanced 3nm node dubbed N3E that has launched. Every new node then requires IP that is carefully designed, characterized and validated in silicon to ensure that the IP specifications are being met and … Read More
Synopsys – TSMC Collaboration Unleashes Innovation for TSMC OIP Ecosystem
As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More
The True Power of the TSMC Ecosystem!
The 15th TSMC Open Innovation Platform® (OIP) was held last week. In preparation we did a podcast with one of the original members of the TSMC OIP team Dan Kochpatcharin. Dan and I talked about the early days before OIP when we did reference flows together. Around 20 years ago I did a career pivot and focused on Strategic Foundry Relationships.… Read More
AI Semiconductor Market