Events EDA2025 esig 2024 800X100
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IEDM Buzz – Intel Previews New Vertical Transistor Scaling Innovation

IEDM Buzz – Intel Previews New Vertical Transistor Scaling Innovation
by Mike Gianfagna on 12-10-2023 at 2:00 pm

IEDM Buzz – Intel Previews New Vertical Transistor Scaling Innovation

For more than 65 years, the IEEE International Electron Devices Meeting (IEDM) has been the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. As I post this, the conference is underway in San Francisco… Read More


CEO Interview: David Moore of Pragmatic

CEO Interview: David Moore of Pragmatic
by Daniel Nenni on 12-01-2023 at 6:00 am

PIC BY STEWART TURKINGTON www.stphotos.co.uk

David has almost 25 years of leadership experience in the semiconductor industry. Prior to joining Pragmatic, he served as Chief Strategy Officer at Micron Technology, Inc. He also spent six years at Intel Corporation in various roles, including General Manager of the Programmable Solutions Group, where he led the multi-billion-dollar… Read More


Predicting Stochastic Defectivity from Intel’s EUV Resist Electron Scattering Model

Predicting Stochastic Defectivity from Intel’s EUV Resist Electron Scattering Model
by Fred Chen on 11-22-2023 at 6:00 am

Predicting Stochastic Defectivity from Intel's EUV Resist Electron Scattering Model

The release and scattering of photoelectrons and secondary electrons in EUV resists has often been glossed over in most studies in EUV lithography, despite being a fundamental factor in the image formation. Fortunately, Intel has provided us with a laboriously simulated electron release and scattering model, using the GEANT4… Read More


Arm Total Design Hints at Accelerating Multi-Die Activity

Arm Total Design Hints at Accelerating Multi-Die Activity
by Bernard Murphy on 11-02-2023 at 6:00 am

multi die

I confess I am reading tea leaves in this blog, but why not? Arm recently announced Arm Total Design, an expansion of their Compute Subsystems (CSS) offering which made me wonder about the motivation behind this direction. They have a lot of blue-chip partners lined up for this program yet only a general pointer to multi-die systems… Read More


Powering eMobility Through Silicon-Carbide Substrates

Powering eMobility Through Silicon-Carbide Substrates
by Bernard Murphy on 10-25-2023 at 6:00 am

SOITEC SEPTEMBRE 2023

While writing on infotainment and ADAS I sometimes wonder about the devices that make an EV run. These have nothing to do with digital or software wizardry. While logic and software play a role, the real heart of EV power is in power electronics driving motors, regenerative braking and charger options at home and on the road. Technologies… Read More


Analog Bits Leads the Way at TSMC OIP with High-Accuracy Sensors

Analog Bits Leads the Way at TSMC OIP with High-Accuracy Sensors
by Mike Gianfagna on 10-18-2023 at 6:00 am

Analog Bits Leads the Way at TSMC OIP with High Accuracy Sensors

The 15th TSMC Open Innovation Platform® (OIP) event was held recently. This event is a focal point across the industry for cutting-edge development and industry-level collaboration. Appropriately, advanced packaging, paving the way for multi-die design was a focal point for the event. You can get a good overview of what was Read More


FD-SOI, the technology shaping the future of automotive radars

FD-SOI, the technology shaping the future of automotive radars
by admin on 10-16-2023 at 6:00 am

White paper Figure 3

By Philippe Flatresse, Bich-Yen Nguyen, Rainer Lutz of SOITEC

    I.          Introduction

Automotive radar is a key enabler for the development of advanced driver assistance systems (ADAS) and autonomous vehicles. The use of radar allows vehicles to sense their environment and make decisions based on that information, enhancing… Read More


TSMC N3E is ready for designs, thanks to IP from Synopsys

TSMC N3E is ready for designs, thanks to IP from Synopsys
by Daniel Payne on 10-12-2023 at 10:00 am

synopsys ucie phy ip min

TSMC has been offering foundry services since 1987, and their first 3nm node was called N3 and debuted in 2022; now they have an enhanced 3nm node dubbed N3E that has launched.  Every new node then requires IP that is carefully designed, characterized and validated in silicon to ensure that the IP specifications are being met and … Read More


Synopsys – TSMC Collaboration Unleashes Innovation for TSMC OIP Ecosystem

Synopsys – TSMC Collaboration Unleashes Innovation for TSMC OIP Ecosystem
by Kalar Rajendiran on 10-10-2023 at 10:00 am

L.C. OIP 2023

As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More


The True Power of the TSMC Ecosystem!

The True Power of the TSMC Ecosystem!
by Daniel Nenni on 10-02-2023 at 6:00 am

logo chart 092623

The 15th TSMC Open Innovation Platform® (OIP) was held last week. In preparation we did a podcast with one of the original members of the TSMC OIP team Dan Kochpatcharin. Dan and I talked about the early days before OIP when we did reference flows together. Around 20 years ago I did a career pivot and focused on Strategic Foundry Relationships.… Read More