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Intel Enables the Multi-Die Revolution with Packaging Innovation

Intel Enables the Multi-Die Revolution with Packaging Innovation
by Mike Gianfagna on 07-24-2023 at 6:00 am

Intel Enables the Multi Die Revolution with Packaging Innovation

The trend is undeniable. Highly integrated monolithic chips can no longer handle the demands of next-generation systems. The reasons for this significant shift in design are many. Much has been written on the topic; you can get a good overview of the forces at play in multi-die design here. These changes represent the next chapter… Read More


Intel Internal Foundry Model Webinar

Intel Internal Foundry Model Webinar
by Scotten Jones on 06-21-2023 at 12:00 pm

IAO Investor Webinar Slides to post on our INTC website PDF Page 07

Intel held a webinar today to discuss their IDM2.0 internal foundry model. On the call were Dave Zinsner Executive Vice President and Chief Financial Officer and Jason Grebe Corporate Vice President and General Manager of the Corporate Planning Group.

On a humorous note, the person moderating the attendee questions sounded … Read More


The Updated Legacy of Intel CEOs

The Updated Legacy of Intel CEOs
by Daniel Nenni on 06-21-2023 at 10:00 am

Intel HQ 2023

(First published December 24, 2014)

A list of the best and worst CEOs in 2014 was recently published. The good news is that none of our semiconductor CEOs were on the worst list. The bad news is that none of our semiconductor CEOs were on the best list either. I will be writing about the CEOs that made our industry what it is today starting… Read More


VLSI Symposium – Intel PowerVia Technology

VLSI Symposium – Intel PowerVia Technology
by Scotten Jones on 06-12-2023 at 6:00 am

Slide4

At the 2023 VLSI Symposium on Technology and Circuits, Intel presented two papers on their PowerVia technology. We received a pre-conference briefing on the technology embargoed until the conference began and received the papers.

Traditionally all interconnects have taken place on the front side of devices with signal and … Read More


IEDM 2022 – Ann Kelleher of Intel – Plenary Talk

IEDM 2022 – Ann Kelleher of Intel – Plenary Talk
by Scotten Jones on 12-06-2022 at 10:00 am

Ann 2022 IEDM Plenary Dec. 5 Roadmap Slide

Ann Kelleher is Intel’s Executive Vice President, General Manager, Technology Development, and she gave the first plenary talk to kick off the 2022 IEDM, “Celebrating 75 Years of the Transistor A Look at the Evolution of Moore’s Law Innovation”. I am generally not a fan of plenary talks because I think they are often too broad and… Read More


Intel Foundry Services Forms Alliance to Enable National Security, Government Applications

Intel Foundry Services Forms Alliance to Enable National Security, Government Applications
by Daniel Nenni on 10-24-2022 at 6:30 am

USMAG Alliance

This will be the year of the semiconductor foundry ecosystem, absolutely. Right in between the Samsung SAFE Forum and the TSMC OIP Open Ecosystem Forum, Intel Foundry Services (IFS) just announced a United States Military, Aerospace, and Government (USMAG) Alliance.

Brilliant move, of course, due to the US Government now being… Read More


Intel and TSMC do not Slow 3nm Expansion

Intel and TSMC do not Slow 3nm Expansion
by Daniel Nenni on 08-09-2022 at 10:00 am

Pat Gelsinger and CC Wei SemiWiki

The media has gone wild over a false report that Intel and TSMC are slowing down 3nm. It is all about sensationalism and getting clicks no matter what damage is done to the hardworking semiconductor people, companies and industry as a whole. And like lemmings jumping off a cliff, other less reputable media outlets perpetuated this… Read More


How TSMC Contributed to the Death of 450mm and Upset Intel in the Process

How TSMC Contributed to the Death of 450mm and Upset Intel in the Process
by Craig Addison on 08-05-2022 at 6:00 am

450mm wafer

Pinpointing exactly when 450mm died is tricky. Intel’s pullback in 2014 has been cited as a pivotal moment because it was the main backer of the proposed transition, as it had been for the shift to 150mm (6-inch) wafers in the early 1980s.

However, the participation of global foundry leader TSMC was also seen as crucial if 450mm wafers… Read More


Intel Lands Top TSMC Customer

Intel Lands Top TSMC Customer
by Daniel Nenni on 07-25-2022 at 2:30 am

Intel Foundry and MediaTek

Most people will be surprised by this but after working in Taiwan for many years I quite expected it. Intel Announced that MediaTek will use Intel Foundry Services for FinFET based smart edge device chips. MediaTek will start with Intel 16nm technology which originated from the legendary 22nm, the first commercial FinFET process.… Read More


3D Device Technology Development

3D Device Technology Development
by Tom Dillinger on 07-13-2022 at 6:00 am

CFET cross section v2

The VLSI Symposium on Technology and Circuits provides a deep dive on recent technical advances, as well as a view into the research efforts that will be transitioning to production in the near future.  In a short course presentation at the Symposium, Marko Radosavljevic, from the Components Research group at Intel, provided … Read More