WP_Term Object
(
    [term_id] => 18
    [name] => Intel
    [slug] => intel
    [term_group] => 0
    [term_taxonomy_id] => 18
    [taxonomy] => category
    [description] => 
    [parent] => 158
    [count] => 423
    [filter] => raw
    [cat_ID] => 18
    [category_count] => 423
    [category_description] => 
    [cat_name] => Intel
    [category_nicename] => intel
    [category_parent] => 158
    [is_post] => 
)

2024 Big Race is TSMC N2 and Intel 18A

2024 Big Race is TSMC N2 and Intel 18A
by Daniel Nenni on 01-01-2024 at 6:00 am

Intel PowerVia backside power delivery

There is a lot being said about Intel getting the lead back from TSMC with their 18A process. Like anything else in the semiconductor industry there is much more here than meets the eye, absolutely.

From the surface, TSMC has a massive ecosystem and is in the lead as far as process technologies and foundry design starts but Intel is … Read More


IEDM Buzz – Intel Previews New Vertical Transistor Scaling Innovation

IEDM Buzz – Intel Previews New Vertical Transistor Scaling Innovation
by Mike Gianfagna on 12-10-2023 at 2:00 pm

IEDM Buzz – Intel Previews New Vertical Transistor Scaling Innovation

For more than 65 years, the IEEE International Electron Devices Meeting (IEDM) has been the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. As I post this, the conference is underway in San Francisco… Read More


Intel Ushers a New Era of Advanced Packaging with Glass Substrates

Intel Ushers a New Era of Advanced Packaging with Glass Substrates
by Mike Gianfagna on 09-18-2023 at 10:00 am

Intel Ushers a New Era of Advanced Packaging with Glass Substrates


Intel recently issued a press announcement that has significant implications for the future of semiconductors.  The release announces Intel’s new glass substrate technology. The headline states: Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rulesRead More


How Intel, Samsung and TSMC are Changing the World

How Intel, Samsung and TSMC are Changing the World
by Mike Gianfagna on 08-21-2023 at 10:00 am

How Intel, Samsung and TSMC are Changing the World

Given the changes in the music business, the term “Rock Star” doesn’t really have any relevance to music or its performers anymore.  Instead, we use the term to describe leaders, innovators and generally people or organizations of great significance. In the world of semiconductors, the designers of advanced chips were the rock… Read More


Intel Enables the Multi-Die Revolution with Packaging Innovation

Intel Enables the Multi-Die Revolution with Packaging Innovation
by Mike Gianfagna on 07-24-2023 at 6:00 am

Intel Enables the Multi Die Revolution with Packaging Innovation

The trend is undeniable. Highly integrated monolithic chips can no longer handle the demands of next-generation systems. The reasons for this significant shift in design are many. Much has been written on the topic; you can get a good overview of the forces at play in multi-die design here. These changes represent the next chapter… Read More


Intel Internal Foundry Model Webinar

Intel Internal Foundry Model Webinar
by Scotten Jones on 06-21-2023 at 12:00 pm

IAO Investor Webinar Slides to post on our INTC website PDF Page 07

Intel held a webinar today to discuss their IDM2.0 internal foundry model. On the call were Dave Zinsner Executive Vice President and Chief Financial Officer and Jason Grebe Corporate Vice President and General Manager of the Corporate Planning Group.

On a humorous note, the person moderating the attendee questions sounded … Read More


The Updated Legacy of Intel CEOs

The Updated Legacy of Intel CEOs
by Daniel Nenni on 06-21-2023 at 10:00 am

Intel HQ 2023

(First published December 24, 2014)

A list of the best and worst CEOs in 2014 was recently published. The good news is that none of our semiconductor CEOs were on the worst list. The bad news is that none of our semiconductor CEOs were on the best list either. I will be writing about the CEOs that made our industry what it is today starting… Read More


VLSI Symposium – Intel PowerVia Technology

VLSI Symposium – Intel PowerVia Technology
by Scotten Jones on 06-12-2023 at 6:00 am

Slide4

At the 2023 VLSI Symposium on Technology and Circuits, Intel presented two papers on their PowerVia technology. We received a pre-conference briefing on the technology embargoed until the conference began and received the papers.

Traditionally all interconnects have taken place on the front side of devices with signal and … Read More


IEDM 2022 – Ann Kelleher of Intel – Plenary Talk

IEDM 2022 – Ann Kelleher of Intel – Plenary Talk
by Scotten Jones on 12-06-2022 at 10:00 am

Ann 2022 IEDM Plenary Dec. 5 Roadmap Slide

Ann Kelleher is Intel’s Executive Vice President, General Manager, Technology Development, and she gave the first plenary talk to kick off the 2022 IEDM, “Celebrating 75 Years of the Transistor A Look at the Evolution of Moore’s Law Innovation”. I am generally not a fan of plenary talks because I think they are often too broad and… Read More


Intel Foundry Services Forms Alliance to Enable National Security, Government Applications

Intel Foundry Services Forms Alliance to Enable National Security, Government Applications
by Daniel Nenni on 10-24-2022 at 6:30 am

USMAG Alliance

This will be the year of the semiconductor foundry ecosystem, absolutely. Right in between the Samsung SAFE Forum and the TSMC OIP Open Ecosystem Forum, Intel Foundry Services (IFS) just announced a United States Military, Aerospace, and Government (USMAG) Alliance.

Brilliant move, of course, due to the US Government now being… Read More