The global semiconductor industry sits at the foundation of modern technology, powering everything from smartphones and cloud data centers to artificial intelligence, automobiles, and national defense systems. At the center of advanced chip manufacturing are three major players: TSMC, Samsung Foundry, and Intel Foundry… Read More
TSMC Formally Sues Ex-SVP Over Alleged Transfer of Trade Secrets to Intel
The big semiconductor news this week is the legal action TSMC is taking against former Senior Vice President Wei-Jen Lo. This looks to be a serious game of 3D chess between CC Wei and Lip-Bu Tan so it is worth a look. I got this notice in my inbox early Tuesday morning:
Immediately following, there was an interesting discussion on SemiWiki… Read More
Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business
The second chapter of our book “Fabless: The Transformation of Semiconductor Industry” describes the ASIC business and how important it is. That was more than 10 years ago and the ASIC business is still at the forefront of the Semiconductor industry and is a key enabler of the AI revolution we are experiencing today.
First let’s … Read More
Yes Intel Should Go Private
Lip-Bu Tan started as Intel CEO on March 18th of this year and some very impressive changes have already taken place. Intel started the year with more than 100,000 employees and will finish the year with around 75,000. Reporting structures have been flattened and the Intel culture is being transformed back into an innovation driven… Read More
AI Revives Chipmaking as Tech’s Core Engine
A century ago, 391 San Antonio Road in Mountain View, California, housed an apricot-packing shed. Today, it’s marked by sculptures of diodes and a transistor, commemorating the 1956 founding of Shockley Semiconductor Laboratory—the birthplace of Silicon Valley. William Shockley, co-inventor of the transistor, aimed… Read More
Advancing Semiconductor Design: Intel’s Foveros 2.5D Packaging Technology
In the rapidly evolving landscape of semiconductor manufacturing, the demand for processors that handle increasing workloads while maintaining power efficiency and compact form factors has never been higher. Intel’s Foveros 2.5D packaging technology emerges as a pivotal innovation, enabling denser die integration… Read More
Revolutionizing Processor Design: Intel’s Software Defined Super Cores
In the ever-evolving landscape of computing, Intel’s patent application for “Software Defined Super Cores” (EP 4 579 444 A1) represents a groundbreaking approach to enhancing processor performance without relying solely on hardware scaling. Filed in November 2024 with priority from a U.S. application… Read More
Intel’s Commitment to Corporate Responsibility: Driving Innovation and Sustainability
Introduction by Lip-BU Tan:
I’m an engineer at heart. Nothing motivates me more than solving hard problems. Our teams across Intel are driven by this same mindset—inspired by the power of technology to enable new solutions to our customers’ toughest challenges.
I fundamentally believe this will be a catalyst for innovation throughout… Read More
Intel Unveils Clearwater Forest: Power-Efficient Xeon for the Next Generation of Data Centers
At the recent Hot Chips conference, Intel® unveiled Clearwater Forest, its next-generation Xeon® 6 processor with efficiency cores (E-cores). The unveiling was made by Don Soltis, Xeon Processor Architect and Intel Fellow with over four decades of processor design experience and a long-standing contributor to the Xeon roadmap.… Read More
Intel’s IPU E2200: Redefining Data Center Infrastructure
We are in the midst of one of the most transformative periods for data center infrastructure. The explosion of AI, cloud-scale workloads, and hyperscale networking is forcing rapid innovation not only in compute and storage, but in the very fabric that connects them. At the recent Hot Chips conference, Pat Fleming gave a talk on… Read More

