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Data Center Energy Trends Force a Rethink of Chip Power Delivery

Data Center Energy Trends Force a Rethink of Chip Power Delivery
by Daniel Nenni on 10-08-2026 at 10:00 am

Data Center Energy Trends Force a Rethink of Chip Power Delivery

Intel Foundry published a two article series on chip power delivery that are worth reading. Here is a quick summary:

Artificial intelligence is changing the requirements for semiconductor innovation. Faster transistors and denser packaging remain essential, but their benefits increasingly depend on another engineering… Read More


Intel Foundry: AI performance now depends on the whole system

Intel Foundry: AI performance now depends on the whole system
by Daniel Nenni on 10-02-2026 at 6:00 am

AI performance now depends on the whole system

For decades, chipmakers improved computing performance largely by putting more capable circuitry on a piece of silicon. That remains important, but AI is exposing its limits. Large models demand enormous amounts of data movement, sustained power and effective cooling. A fast processor cannot deliver its full benefit if memory… Read More


ASML Has High-NA and Chipmakers Can’t Say No

ASML Has High-NA and Chipmakers Can’t Say No
by Daniel Nenni on 09-17-2026 at 6:00 am

ASML Has High NA and Some Chipmakers Can’t Say No

ASML’s grip on the most advanced corner of chip manufacturing is tightening. The Dutch company, already the sole supplier of extreme ultraviolet lithography systems, is winning broader industry support for High Numerical Aperture EUV, or High NA, its next-generation technology for printing smaller and denser circuitry.… Read More


High-NA EUV Moves From Experiment to Manufacturing

High-NA EUV Moves From Experiment to Manufacturing
by Daniel Nenni on 09-07-2026 at 11:00 pm

HNA EUV Moves into Manufacturing

Intel Foundry and ASML say high-numerical-aperture extreme-ultraviolet lithography has crossed an important boundary: it is no longer only a development tool, but a production technology. At the SPIE Photomask Technology and Extreme Ultraviolet Lithography conference, the companies reported that Intel has processed … Read More


Comparing Advanced Packaging from TSMC, Intel Foundry, and Samsung Foundry

Comparing Advanced Packaging from TSMC, Intel Foundry, and Samsung Foundry
by Daniel Nenni on 09-06-2026 at 10:00 am

Advanced Chip Packaging Comparison INtel TSMC Samsung

Advanced semiconductor packaging has become essential to improving computing performance as conventional transistor scaling grows more difficult and expensive. Instead of manufacturing an entire processor as one large monolithic die, chipmakers can divide it into smaller chiplets and combine logic, memory, input/output… Read More


Intel 18A-P Pushes RibbonFET and Backside Power Beyond the First Generation

Intel 18A-P Pushes RibbonFET and Backside Power Beyond the First Generation
by Daniel Nenni on 09-02-2026 at 10:00 am

Intel 18A P Extends Intel 18A with Significant Power and Performance Gains

Intel Foundry has a blog on LinkedIn that is worth a look. The blogs are by trusted Intel Foundry technical experts and are filled with content. I will cherry pick write a bit about them but be sure and subscribe to this, absolutely.

Intel 18A-P is not a new process node in the conventional sense. It is a performance-enhanced derivative… Read More


Intel’s 14A Is Winning the Race Against Defects

Intel’s 14A Is Winning the Race Against Defects
by Daniel Nenni on 08-31-2026 at 2:00 pm

Intel’s 14A Is Winning the Race Against Defects

Intel’s next-generation 14A manufacturing process is showing unusually strong early progress, with defect density falling faster than the company expected. The improvement gives Intel a technical boost as it attempts to restore confidence in its manufacturing operation, win foundry customers and demonstrate that years… Read More


Crescent Island: Turning Memory Capacity into Agentic AI Throughput

Crescent Island: Turning Memory Capacity into Agentic AI Throughput
by Admin on 08-27-2026 at 2:00 pm

Intel Crecesent Island Hot Chips 2026

Intel’s Crescent Island is a discrete data-center GPU designed for agentic AI inference, where performance is constrained by more than matrix arithmetic. Multi-step agents impose latency through repeated model calls and tool interactions, consume large memory capacity for weights and long-context key-value caches, and… Read More


Intel Diamond Rapids: Building Xeon Up, Out, and Through Silicon

Intel Diamond Rapids: Building Xeon Up, Out, and Through Silicon
by Admin on 08-26-2026 at 2:00 pm

Intel Diamond Rapids Hot Chips 2026

Akhilesh Kumar & Krishnakanth Sistla, Intel

Diamond Rapids is Intel’s next-generation Xeon processor, designed around the proposition that hyperscale performance increasingly depends on moving, processing, and protecting data as efficiently as executing instructions. The architecture replaces the conventional… Read More


Intel Wildcat Lake: Right-Sizing Silicon Without Sinking Performance

Intel Wildcat Lake: Right-Sizing Silicon Without Sinking Performance
by Admin on 08-25-2026 at 2:00 pm

Intel Wildcat Hot Chips 2026

Lance Hacking, Intel

Intel Core Series 3, code-named Wildcat Lake, is a mainstream client system-on-chip derived from the Panther Lake-based Core Ultra Series 3 architecture. Its design objective is not maximum feature density, but broad deployment of current-generation CPU, graphics, AI, memory, security, and connectivity… Read More