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Notes from Common Platform: Collaborate or Die

Notes from Common Platform: Collaborate or Die
by Beth Martin on 02-07-2013 at 2:16 pm

FinFETs are hot, carbon nanotubes are cool, and collaboration is the key to continued semiconductor scaling. These were the main messages at the 2013 Common Platform Technology Forum in Santa Clara.

The collaboration message ran through most presenations, like the afternoon talk by Subi Kengeri of GLOBALFOUNDRIES and Joe Sawicki… Read More


Advanced Technology-Design-Manufacturing Co-optimization

Advanced Technology-Design-Manufacturing Co-optimization
by Daniel Nenni on 01-31-2013 at 7:00 pm

I spent some quality time with Subi Kengeri, Vice President, Technology Architecture, Office of the CTO, GLOBALFOUNDRIES in Las Vegas during CES. Great guy, he worked at Silicon Access, Virage and TSMC before GF. One thing you should know about embedded memory guys, SRAM is the first thing that goes through a new process so they … Read More


How GLOBALFOUNDRIES is Differentiating in 2013

How GLOBALFOUNDRIES is Differentiating in 2013
by Daniel Nenni on 01-27-2013 at 7:00 pm

GLOBALFOUNDRIES changed the landscape of the foundry business in 2009 with a simple but ambitious plan to become the world’s first truly global foundry. At the Common Platform Technology Forum February 5th in the Santa Clara Convention Center GF Executive Vice President Michael Noonen will give an update on how that is … Read More


The First 14nm FinFET Wafer Sighting!

The First 14nm FinFET Wafer Sighting!
by Daniel Nenni on 01-11-2013 at 12:10 pm

Incredibly exciting! Even my beautiful wife was impressed by the rainbow of colors it reflected. From left to right: 28nm, 20nm, and 14nm wafers. The 20nm and 14nm wafers are from the GLOBALFOUNDRIES NY fab, made in the USA! GF also announced another $3-4B CAPEX for 2013 to increase capacity of all three of their 300mm fabs (Singapore,… Read More


Celebrity Electronics Show 2013 (CES)

Celebrity Electronics Show 2013 (CES)
by Daniel Nenni on 01-06-2013 at 4:00 pm

Time to pack up for the 2013 Consumer Electronics Show in Las Vegas, I will be driving down with my beautiful wife Shushana because she does not like to fly. The drive takes the better part of a day so we will leave early and see the sunrise over the desert. She is great company, the time will fly by. We will be 2 of the more than 150,000 people… Read More


Tech Forum, February 5, features 32/28-, 20-, 14-, and 10-nanometer processes

Tech Forum, February 5, features 32/28-, 20-, 14-, and 10-nanometer processes
by Daniel Nenni on 01-04-2013 at 7:00 pm

The Common Platform Alliance — IBM, Samsung Electronics, Co., Ltd., and GLOBALFOUNDRIES — continues to redefine the landscape of the semiconductor industry with its groundbreaking collaboration. Join us at our 2013 Common Platform Technology Forumon Tuesday, February 5, 2013 at the Santa Clara Convention Center as we showcaseRead More


GLOBALFOUNDRIES and Mentor Develop Methods to Identify Critical Features in IC Designs

GLOBALFOUNDRIES and Mentor Develop Methods to Identify Critical Features in IC Designs
by glforte on 11-28-2012 at 3:00 pm

Since the beginning of the semiconductor industry, improving the rate of yield learning has been a critical factor in the success silicon manufacturing. Each fab has dedicated yield teams that look at the yield of wafers manufactured the previous day and attempt to find the root cause of any unexpected “excursions.” In earlier… Read More


GLOBALFOUNDRIES and ARM!

GLOBALFOUNDRIES and ARM!
by Daniel Nenni on 10-02-2012 at 8:30 pm


Clearly the key to success in the foundry business is partnerships. Easy to say, harder to do, here is an excellent example of one that works: GLOBALFOUNDRIES and ARM announced in August 2012 a multi-year agreement to jointly deliver optimized system-on-chip (SoC) solutions for ARM® processor designs on GLOBALFOUNDRIES’ 20-nanometer… Read More


Variation at 28-nm with Solido and GLOBALFOUNDRIES

Variation at 28-nm with Solido and GLOBALFOUNDRIES
by Kris Breen on 09-27-2012 at 9:00 pm

At DAC 2012 GLOBALFOUNDRIES and Solido presented a user track poster titled “Understanding and Designing for Variation in GLOBALFOUNDRIES 28-nm Technology” (as was previously announced here). This post describes the work that we presented.

We set out to better understand the effects of variation on design at 28-nm. In particular,… Read More


GlobalFoundries Announces 14nm Process

GlobalFoundries Announces 14nm Process
by Paul McLellan on 09-20-2012 at 8:00 am

Today GlobalFoundries announced a 14nm process that will be available for volume production in 2014. They are explicitly trying to match Intel’s timeline for the introduction of 14nm. The process is called 14XM for eXtreme Mobility since it is especially focused on mobile. The process will be introduced just one year after… Read More