Cadence has recently announced two key design-in for their Vision DSP IP family: MediaTek’s Helio P30 integrates the Tensilica Vision P5 DSP and HiSilicon has selected the Cadence® Tensilica® Vision P6 DSP for its 10nm Kirin 970 mobile application processor. The Kirin 970 being integrated into Huawei’s new Mate 10 Series mobile… Read More
Webinar: High-Capacity Power Signoff Using Big Data
Want to know how NVIDIA signs off on power integrity and reliability on mega-chips? Read on.
PPA over-design has repercussions in increased product cost and potential missed schedules with no guarantee of product success. Advanced SoCs pack more functionality and performance resulting in higher power density, but traditional… Read More
Synopsys discusses the challenges of embedded vision processing
Before the advent of convolutional neural networks (CNN), image processing was done with algorithms like HOG, SIFT and SURF. This kind of work was frequently done in data centers and server farms. To facilitate mobile and embedded processing a new class of processors was developed – the vision processor. In addition to doing a … Read More
ARM Security Update for the IoT
Despite all the enthusiastic discussion about security in the IoT and a healthy market in providers of solutions for the same, it is difficult to believe that we are doing more than falling further behind an accelerating problem. Simon Segars echoed this in his keynote speech at ARM TechCon this year. The issue may not be so much in… Read More
DSP-Based Neural Nets
You may be under the impression that anything to do with neural nets necessarily runs on a GPU. After all, NVIDIA dominates a lot of what we hear in this area, and rightly so. In neural net training, their solutions are well established. However, GPUs tend to consume a lot of power and are not necessarily optimal in inference performance… Read More
Semiconductor IP on Fortune’s 2017 100 Fastest-Growing Companies List!
The Semiconductor IP market has always been a big draw for SemiWiki readership and I expect that to continue. One of the more interesting companies we have covered over the past 6+ years is CEVA, who is now on Fortune’s 2017 100 Fastest-Growing Companies List. In fact, CEVA is the ONLY semiconductor IP company on the list and they join… Read More
What’s New with the I3C Standard
This month we’ve seen both Apple and Samsung announce their newest, flagship smart phones, and they each have an incredible number of sensors and components included like: … Read More
How to Avoid Jeopardizing SoC Security when Implementing eSIM?
Smart card business is now more than 25 years old, we can assess that the semiconductor industry is able to protect the chips used for smart card or SIM application with a very good level (unfortunately, it’s very difficult to get access to the fraud percentage linked with smart cards, as bankers really don’t like to communicate on… Read More
Webinar: Signoff for Thermal, Reliability and More in Advanced FinFET designs
In automotive applications, advanced FinFET processes are great for high levels of integration and low power. But they also present some new challenges in reliability signoff. Ansys will be hosting a webinar to highlight the challenges faced by engineers trying to ensure thermal, electromigration (EM) and electrostatic discharge… Read More
QCOM vs Apple and Everyone Else!
Having worked with Qualcomm in many different capacities during my career I can tell you there are some amazing people in and around that company. I am always positive when people I know are considering working there and QCOM people who leave are an easy reference for other jobs. Unfortunately, I lost respect for the QCOM higher ups… Read More
Making Intel Great Again!