The Universal Chiplet Interconnect Express (UCIe) 3.0 specification marks a decisive step in the industry’s shift from monolithic SoCs to modular, multi-die systems. Released on August 5, 2025, the new standard doubles peak link speed from 32 GT/s in UCIe 2.0 to 48 and 64 GT/s while adding a suite of manageability and efficiency
Alphawave Semi and the AI Era: A Technology Leadership Overview
The explosion of artificial intelligence (AI) is transforming the data center landscape, pushing the boundaries of compute, connectivity, and memory technologies. The exponential growth in AI workloads—training large language models (LLMs), deploying real-time inference, and scaling distributed applications—has … Read More
Podcast EP288: How Alphawave Semi Enables Next Generation Connectivity with Bharat Tailor
Dan is joined by Bharat Tailor who is responsible for the Alphawave standard connectivity products portfolio focused on DSP chipsets enabling AI data center interconnects. He is a veteran of the high-speed connectivity semiconductor industry having participated in the evolution of connectivity technologies from 10Gbps … Read More
Alphawave Semi is in Play!
We started working with Alphawave at the end of 2020 with a CEO Interview. I had met Tony Pialis before and found him to be a brilliant and charismatic leader so I knew it would be a great collaboration. Tony was already an IP legend after his company was acquired by Intel. After 4+ years at Intel Tony co-founded Alphawave in 2017. Today,… Read More
Podcast EP276: How Alphawave Semi is Fueling the Next Generation of AI Systems with Letizia Giuliano
Podcast EP276: How Alphawave Semi is Fueling the Next Generation of AI Systems with Letizia Giuliano
Dan is joined by Letizia Giuliano, Vice President of Product Marketing and Management at Alphawave Semi. She specializes in architecting cutting-edge solutions for high-speed connectivity and chiplet design architecture. Prior to her role at Alphawave Semi, Letizia held the position of Product Line Manager at Intel, where… Read More
Scaling AI Data Centers: The Role of Chiplets and Connectivity
Artificial intelligence (AI) has revolutionized data center infrastructure, requiring a reimagining of computational, memory, and connectivity technologies. Meeting the increasing demand for high performance and efficiency in AI workloads has led to the emergence of innovative solutions, including chiplets, advanced… Read More
How AI is Redefining Data Center Infrastructure: Key Innovations for the Future
Artificial intelligence (AI) is driving a transformation in data center infrastructure, necessitating cutting-edge technologies to meet the growing demands of AI workloads. As AI systems scale up and out, next-gen compute servers, switches, optical-electrical links, and flexible, redundant networking solutions are … Read More
Elevating AI with Cutting-Edge HBM4 Technology
Artificial intelligence (AI) and machine learning (ML) are evolving at an extraordinary pace, powering advancements across industries. As models grow larger and more sophisticated, they require vast amounts of data to be processed in real-time. This demand puts pressure on the underlying hardware infrastructure, particularly… Read More
Alphawave Semi Unlocks 1.2 TBps Connectivity for HPC and AI Infrastructure with 9.2 Gbps HBM3E Subsystem
In the rapidly evolving fields of high-performance computing (HPC) and artificial intelligence (AI), reducing time to market is crucial for maintaining competitive advantage. HBM3E systems play a pivotal role in this regard, particularly for hyperscaler and data center infrastructure customers. Alphawave Semi’s… Read More
Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for HPC and AI Infrastructure
In the rapidly evolving landscape of high-performance computing (HPC) and artificial intelligence (AI), the demand for increased processing power, efficiency, and scalability is ever-growing. Traditional monolithic chip designs are increasingly unable to keep pace with these demands, leading to the emergence of chiplets… Read More