Bronco Webinar 800x100 1
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Webinar: Getting to Accurate Power Estimates Earlier and Faster

Webinar: Getting to Accurate Power Estimates Earlier and Faster
by Bernard Murphy on 05-24-2017 at 7:00 am

Power has become a very important metric in modern designs – for mobile and IoT devices which must live on a battery charge for days or years, for datacenters where power costs can be as significant as capital costs, and for increasingly unavoidable regulatory reasons. But accurate power estimation on a design must start from an … Read More


Webinar: Recipe to consume less than 0.5 µA in sleep mode

Webinar: Recipe to consume less than 0.5 µA in sleep mode
by Eric Esteve on 05-19-2017 at 12:00 pm

Dolphin is addressing the ultra-low-power (ULP) needs for some applications, like for example Bluetooth low energy (BLE), machine-to-machine (M2M) or IoT edge devices in general. For these applications, defining active and sleep modes is imperative, but it may not be enough to guarantee that the battery-powered system will… Read More


Webinar – Low Power Circuit Sizing for IoT

Webinar – Low Power Circuit Sizing for IoT
by Tom Simon on 05-19-2017 at 7:00 am

Optimizing analog designs has always been a difficult and tricky process. Designing for IoT applications has only made this more difficult with the added importance of minimizing power. Unlike other circuit parameters, it is not easy to specify power as a design goal when using equations. Power is a resultant property and must… Read More


Understanding ISO 26262 Compliance for Automotive Suppliers

Understanding ISO 26262 Compliance for Automotive Suppliers
by Daniel Payne on 05-18-2017 at 12:00 pm

The semiconductor, IP, Software and EDA industries are all focusing on the growing automotive market because of its electronic content, size and growth. There are long-time suppliers to the automotive industry, and also first-time vendors that are launching something new every week for electronics in automotive. So where … Read More


Webinar: Next Generation Design Data & Release Management

Webinar: Next Generation Design Data & Release Management
by Daniel Nenni on 05-12-2017 at 12:00 pm

Design Data Management (DDM) is a bit like insurance. It’s something every semiconductor company has to have, and as a result it’s probably something taken for granted. In order to make their products more useful, the DDM vendors have added more functionality to manage more of the lifecycle of design data.

Dassault’s Synchronicity… Read More


Smart & Connected Devices to Artificial Intelligence and Beyond

Smart & Connected Devices to Artificial Intelligence and Beyond
by Daniel Payne on 05-02-2017 at 12:00 pm

Last Friday I attended a breakfast seminar organized by SEMI in Hillsboro, Oregon with fascinating speakers from several high-tech companies: Qorvo, Intel, Oregon Angel Fund, Kimera, Moonshadow Mobile and Yole Development. I recalled that Qorvo was created from the merger of TriQuint Semiconductor and RF Micro Devices back… Read More


Webinar – Next Generation DDRM Needs, Solutions

Webinar – Next Generation DDRM Needs, Solutions
by Bernard Murphy on 05-02-2017 at 7:00 am

I’m a believer in product life-cycle management (PLM) for semiconductor design. It’s not an attention-grabbing topic like faster verification or improved PPA in implementation, but now massive IP-based design is routine, IP’s are sourced from multiple suppliers each cycling though multiple revisions and now that design … Read More


SEMICON Southeast Asia reflects strong equipment market

SEMICON Southeast Asia reflects strong equipment market
by Bill Jewell on 04-28-2017 at 4:00 pm

SEMICON Southeast Asia was held this week in Penang, Malaysia. Over 6500 people attended the conference to learn about the latest trends and equipment in semiconductor manufacturing.


Dr. Dan Tracy, Senior Director Industry Research and Statistics at SEMI, presented an optimistic outlook for the semiconductor equipment market… Read More


SPIE 2017 – imec papers and interview

SPIE 2017 – imec papers and interview
by Scotten Jones on 04-28-2017 at 12:00 pm

At the SPIE Advanced Lithography Conference imec published a number of papers on EUV, multi-patterning and other lithography issues. In addition to seeing several of the papers presented I had a chance to sit down with imec’s director of advanced patterning, Greg McIntyre. In this article I will summarize my discussions… Read More


EDA CEO Outlook 2017

EDA CEO Outlook 2017
by Daniel Nenni on 04-28-2017 at 7:00 am

A long standing tradition has returned to EDA: The CEO Outlook sponsored by ESDA (formerly EDAC) which alone is worth the price of membership! Not only do you get a free meal, the event included quality networking time with the semiconductor elite. In the past, financial analysts moderated this event holding the CEO’s feet to the… Read More