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During a recent LinkedIn webcast, Dr. Ian Cutress, Chief Analyst at More than Moore and Host at TechTechPotato, and Priyank Shukla, Principal Product Manager at Synopsys, shared their thoughts regarding the industry drivers, design considerations, and critical advancements in compute interconnects enabling data center… Read More
Dan is joined by Robert Ruiz, a product management director responsible for strategy and business growth of several verification products at Synopsys. Robert has held various marketing and technical positions for leading functional verification and test automation products at various companies including Synopsys, Novas… Read More
Part 1 of this 4-part series introduces the complexities of developing and bringing up the entire software stack on a System on Chip (SoC) or Multi-die system. It explores various approaches to deployment, highlighting their specific objectives and the unique challenges they address.
As the saying goes, it’s… Read More
Dan is joined by Mike O’Brien. Mike was recently the vice president of aerospace and government at Synopsys, He has 40 years of experience in the semiconductor, software and computer industries. In his 27 years in EDA and IP at Synopsys and Cadence, Mike helped build new lines of business including outsourced design services, research… Read More
As the complexity of modern System-on-Chip (SoC) designs continues to rise, achieving energy efficiency measured as performance per watt has become a crucial design goal. With the increasing demand for powerful, multifunctional chips, balancing performance with power consumption has become essential. Realistic workloads… Read More
In the rapidly evolving world of high-performance computing (HPC) and artificial intelligence (AI), technological advancements must keep pace with increasing demands for speed, efficiency, and security. Synopsys recently announced the industry’s first complete PCIe 7.0 IP solution. This groundbreaking initiative addresses… Read More
Introduction of 2.5D and 3D multi-die based products are helping extend the boundaries of Moore’s Law, overcoming limitations in speed and capacity for high-end computational tasks. In spite of its critical function within the 3DIC paradigm, the interposer die’s role and related challenges are often neither fully comprehended… Read More
Peter was running late for two reasons. First, he encountered unexpected heavy traffic and arrived ten minutes late for a crucial meeting with a customer to run a compliance test of his new 6G phone design prototyped on FPGAs. This prototype’s success was pivotal, as it could secure a significant purchase order.… Read More
Today’s advanced node chip designs are faced with many new complexities from design and verification down to manufacturing. The solutions used at every stage of chip development generate petabytes of data. Managing, analyzing, understanding, and acting upon that data is overwhelming and paralyzing. Manual interpretation… Read More
We all know that making advanced semiconductors is a team sport. TSMC can innovate the best processes, but without the right design flows, communication schemes and verified IP it becomes difficult to access those processes. Synopsys recently announced some details on this topic. It covers a lot of ground. The graphic at the top… Read More
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