After the leadership transition at the top, Synopsys had just a little more than two months before the company’s flagship event, the Synopsys User Group (SNUG) conference. The Synopsys user community and entire ecosystem were waiting to hear new CEO Sassine Ghazi’s keynote to learn where the company is going and its strategic … Read More
2024 DVCon US Panel: Overcoming the challenges of multi-die systems verification
2024 DVCon was very busy this year. Bernard Murphy and I were in attendance for SemiWiki, he has already written about it. Multi die and chiplets was again a popular topic. Lauro Rizzatti, a consultant specializing in hardware-assisted verification, moderated an engaging panel, sponsored by Synopsys, focusing on the intricacies… Read More
Synopsys Enhances PPA with Backside Routing
Complexity and density conspire to make power delivery very difficult for advanced SoCs. Signal integrity, power integrity, reliability and heat can seem to present unsolvable problems when it comes to efficient power management. There is just not enough room to get it all done with the routing layers available on the top side… Read More
Complete 1.6T Ethernet IP Solution to Drive AI and Hyperscale Data Center Chips
The demand for high-bandwidth, low-latency networking solutions has never been greater. As artificial intelligence (AI) workloads continue to grow exponentially, and hyperscale data centers become the backbone of our digital infrastructure, the need for faster and more efficient communication technologies becomes imperative.… Read More
2024 Signal & Power Integrity SIG Event Summary
It was a dark and stormy night here in Silicon Valley but we still had a full room of semiconductor professionals. I emceed the event. In addition to demos, customer and partner presentations, we did a Q&A which was really great. One thing I have to say is that Intel really showed up for both DesignCon and the Chiplet Summit. Quite… Read More
Navigating the 1.6Tbps Era: Electro-Optical Interconnects and 224G Links
In the relentless pursuit of ever-increasing data speeds, the 1.6 Terabits per second (Tbps) era looms on the horizon, promising unprecedented levels of connectivity and bandwidth within data centers. As data-intensive applications proliferate and the demand for real-time processing escalates, the need for robust and efficient… Read More
Why Did Synopsys Really Acquire Ansys?
Mergers and acquisitions have been a big part of EDA since the beginning. We keep an EDA/IP Mergers and Acquisitions Wiki, it is 13 years old now and has more than one million views. Personally, I have been involved with dozens of acquisitions over my 40 year career, some good, some bad, all are interesting and are an important part … Read More
Synopsys Geared for Next Era’s Opportunity and Growth
As semiconductor industry folks know, Synopsys is a behemoth of a company. At $5.84B in FY2023 revenue (FY Nov-Oct), approximately 20,000 employees and a market cap of about $74B, it leads the silicon-to-systems design solutions space within the industry. From humble beginnings in 1986 as a disruptive startup, the company has… Read More
Automated Constraints Promotion Methodology for IP to Complex SoC Designs
In the world of semiconductor design, constraints are essentially specifications and requirements that guide the implementation of a specific hardware or software component within a larger system. They dictate timing, area, power, performance, and of course functionality of a design, playing a crucial role in ensuring that… Read More
UCIe InterOp Testchip Unleashes Growth of Open Chiplet Ecosystem
Intel recently made headlines when CEO Pat Gelsinger unveiled the world’s first UCIe interoperability test chip demo at Innovation 2023. The test chip built using advanced packaging technology is codenamed Pike Creek and is used to demonstrate interoperability across chiplets designed by Intel and Synopsys. More details … Read More