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The Changing Foundry Landscape: Trends and Challenges!

The Changing Foundry Landscape: Trends and Challenges!
by Daniel Nenni on 04-05-2015 at 4:00 am

This will be a year of change for the fabless semiconductor ecosystem, absolutely. Last year we were wondering how Samsung Mobile was going to compete with the China clones and other low end smart phones. We now know the answer to that question thanks to the Chipworks tear down of the Galaxy S6. SemiWiki IP expert Dr. Eric Esteve blogged… Read More


Verification IP for PCIe and AXI4

Verification IP for PCIe and AXI4
by Daniel Payne on 03-26-2015 at 2:00 pm

Engineers love acronyms and my latest blog post has three acronyms in the title alone, so hopefully you are doing or considering SoC designs with the AMBA AXI4(Advanced eXtensible Interface 4) interface specification along with PCI Express (Peripheral Component Interconnect Express). One big motivation for using semiconductor… Read More


Open Source Software Platform Fuels Automotive Innovation

Open Source Software Platform Fuels Automotive Innovation
by Pawan Fangaria on 03-23-2015 at 1:00 pm

These days, most of the innovative concepts in our cars are driven by electronics; not only infotainment systems, but also instrument clusters, safety systems including ADAS (Advanced Driver Assistance Systems), information displays, night vision, airbags, backup camera, stability control, and so on. The upcoming connected… Read More


Full Spectrum Analog FastSPICE Useful for RF Designs on Bulk CMOS

Full Spectrum Analog FastSPICE Useful for RF Designs on Bulk CMOS
by Tom Simon on 03-19-2015 at 1:00 pm

It has been about a year since the acquisition of Berkeley Design Automation by Mentor Graphics. Berkeley was doing quite well in the somewhat crowded SPICE simulator market. In many respects they broke new ground for high speed and accurate SPICE simulators. Since the acquisition we know that former Berkeley executives are now… Read More


Lake Tahoe: The Center of ESD Innovation

Lake Tahoe: The Center of ESD Innovation
by glforte on 03-15-2015 at 1:00 pm

Almost anyone that is active in IC design will be “in touch” with Electrostatic Discharge (ESD) at some time (pun intended). Preventing ESD related IC failures remains something like black magic—at least it’s easy to get that feeling when you are trying to debug ESD failures. I/O and ESD layouts that resulted in excellent robustness… Read More


Mentor 2014 Results

Mentor 2014 Results
by Paul McLellan on 02-27-2015 at 7:25 pm

Yesterday Mentor announced their quarterly results. Since their financial year is not aligned with the calendar year, this was also the end of their fiscal 2015. The quarter was an all-time record with revenues of $439M and (non-GAAP) EPS of $1.09. The year was also an all-time record with revenues of $1.24B and EPS of $1.77. Half… Read More


Mentor and ASSET Intertech Do a DFT World Tour

Mentor and ASSET Intertech Do a DFT World Tour
by Beth Martin on 02-19-2015 at 1:01 pm

The Mentor Graphics test folks and ASSET Intertech have teamed up to provide a series of free DFT seminars in the US, Europe, and Asia. The first one is in Austin, TX on February 19, 2015, and the last is in Tokyo on April 24. Hereis the full list of locations and dates.

The morning session covers IJTAG. The new IEEE 1687 Internal JTAG (IJTAG)… Read More


MEMS Require 3D Field Solver for Accurate Cap Values

MEMS Require 3D Field Solver for Accurate Cap Values
by Tom Simon on 02-18-2015 at 9:00 am

MEMS devices have become extremely important and common. Freescale last year reported its combined MEMS shipments exceeded 2 billion units. If we just examine how many accelerometers we each probably own today, it is easy to see why the market for these products is growing so rapidly. The first and most obvious device is our cell… Read More


What’s Hot at SPIE Advanced Lithography

What’s Hot at SPIE Advanced Lithography
by Beth Martin on 02-04-2015 at 10:00 pm

The 40[SUP]th[/SUP] SPIE Advanced Lithography conference will be at the San Jose Convention Center 22-26 February. Over the past few years, this conference has grown in scope to include emerging patterning technologies, like directed self-assembly (DSA) and design-process-technology co-optimization.

Underlying all … Read More


Semiconductor Design: Chips to Systems!

Semiconductor Design: Chips to Systems!
by Daniel Nenni on 01-12-2015 at 8:00 pm

This is the 20[SUP]th[/SUP] year of DesignCon and I’m really looking forward to it. While I haven’t attended all 20 I certainly have attended the majority of them. Now it is like a college reunion for me seeing all sorts of friends and former coworkers. One of them is even a keynote but more on that later. This year there are 14 conference… Read More