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The impact of AI seems to be everywhere. Products are smarter, doing more of what used to be done by the humans. Complex tasks can be completed quicker and with greater accuracy and failures can now be predicted more reliably and repaired before they even occur. The AI technologies used to make all this happen and how those technologies… Read More
Next generation electronic systems require an engineering approach incorporating a digital twin methodology for early verification with digital prototypes. Over the course of a design project, the digital twin model evolves to allow more complex interactions including analysis, simulations and validations earlier… Read More
The transformation of the vertically integrated electronics value chain to a disaggregated supply chain has brought tremendous value to the electronics industry and benefits to the consumers. This transformation has driven the various players to become highly specialized in order to support the market trends and demands … Read More
At the DesignCon 2023 event this year there was a presentation by Micron all about DDR5 design challenges like the need for a Decision Feedback Equalizer (DFE) inside the DRAM. Siemens EDA and Micron teamed up to write a detailed 25 page white paper on the topic, and I was able to glean the top points for this much shorter blog. The DDR5… Read More
Who first came up with this term shift-left ? I’d assumed Siemens EDA as they use it so widely. But their latest white paper on the productivity improvements possible with shift-left Calibre IC verification flows puts the record straight: a software engineer called Larry Smith bagged the naming rights in a 2001 paper (leapfrogging… Read More
In the fast moving world of data communications, the appetite for high speed data transfers is accompanied by a growing need for data confidentiality and integrity. The wildly popular PCIe interface standard for connectivity has not only been increasing data transfer rates but has also introduced an Integrity and Data Encryption… Read More
It was refreshing to hear a talk focused on emerging stronger from the downturn when the news and media are focused on the gloom. At the recent Siemens EDA User2User conference, Joe Sawicki, executive vice president, IC, gave an uplifting keynote talk to the audience. He highlighted a secular growth trend happening in the semiconductor… Read More
Chiplet is a hot topic in the semiconductor world these days. So much so that if one hasn’t heard that term, the person must be living on a very isolated islet. Humor aside, products built using chiplets-based methodology have been in existence for at least some years now. Companies such as Intel, AMD, Apple and others have integrated… Read More
SoC test challenges arise due to the complexity and diversity of the functional blocks integrated into the chip. As SoCs become more complex, it becomes increasingly difficult to access all of the functional blocks within the chip for testing. SoCs also can contain billions of transistors, making it extremely time-consuming… Read More
I’ve been following Solido as a start-up EDA vendor since 2005, then they were acquired by Siemens in 2017. At the recent User2User event there was a presentation by Kwonchil Kang, of Samsung Electronics on the topic, ML-enabled Statistical Circuit Verification Methodology using Solido. For high reliability circuits… Read More
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[_useReplaceInto:protected] =>
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[navigation_id] =>
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[_relations:protected] => Array
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)
[_previousValues:protected] => Array
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[_options:protected] => Array
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[_deleted:protected] =>
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[_whenSaveable:protected] => Array
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[_cascadeSave:protected] => Array
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[_previousValues:protected] => Array
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[_deleted:protected] =>
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[_whenSaveable:protected] => Array
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[_cascadeSave:protected] => Array
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[_behaviors:protected] =>
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[populated:protected] => 1
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