WP_Term Object
(
    [term_id] => 159
    [name] => Siemens EDA
    [slug] => siemens-eda
    [term_group] => 0
    [term_taxonomy_id] => 159
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 762
    [filter] => raw
    [cat_ID] => 159
    [category_count] => 762
    [category_description] => 
    [cat_name] => Siemens EDA
    [category_nicename] => siemens-eda
    [category_parent] => 157
    [is_post] => 
)
            
Q2FY24TessentAI 800X100
WP_Term Object
(
    [term_id] => 159
    [name] => Siemens EDA
    [slug] => siemens-eda
    [term_group] => 0
    [term_taxonomy_id] => 159
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 762
    [filter] => raw
    [cat_ID] => 159
    [category_count] => 762
    [category_description] => 
    [cat_name] => Siemens EDA
    [category_nicename] => siemens-eda
    [category_parent] => 157
    [is_post] => 
)

The Real Reason Siemens Bought Mentor!

The Real Reason Siemens Bought Mentor!
by Daniel Nenni on 06-26-2017 at 7:00 am

The Siemens purchase of Mentor last year for a premium $4.5B was a bit of a shock to me as I have stated before. I had an inkling a Mentor acquisition was coming but Siemens was not on my list of suitors. The reviews have been mixed and the Siemens commitment to the IC EDA market has been questioned so I spent some time on this at #54DAC.

First… Read More


Tools for Advanced Packaging Design Follow Moore’s Law, Too!

Tools for Advanced Packaging Design Follow Moore’s Law, Too!
by Tom Dillinger on 06-05-2017 at 9:00 am

There is an emerging set of advanced packaging technologies that enables unique product designs, with the capability to integrate multiple die, from potentially heterogeneous technologies. These “system-in-package” (SiP) offerings provide architects with the opportunity to optimize product performance, power, cost,… Read More


Time is Money, Especially when Testing ICs

Time is Money, Especially when Testing ICs
by Daniel Payne on 05-24-2017 at 12:00 pm

Semiconductor companies are looking for ways to keep their business profitable by managing expenses on both the design and test side of electronic products, which is quite the challenge as the trends show increases in test pattern count and therefore test costs. Scan compression is a well-known technique first created over 15… Read More


Electrothermal Analysis of an IC for Automotive Use

Electrothermal Analysis of an IC for Automotive Use
by Daniel Payne on 05-16-2017 at 12:00 pm

Automotive ICs have to operate in a very demanding environment in terms of both temperature and voltage ranges, along with the ability to withstand g-forces and be sealed from the elements. Not an easy design challenge. For many consumer ICs we see output drive currents on the IO pins measured in mA, however in automotive if you want… Read More


Dear Cadence: Calibre Didn’t Run Any Dracula Decks

Dear Cadence: Calibre Didn’t Run Any Dracula Decks
by Mitch Heins on 05-04-2017 at 2:00 pm

After reading the Cadence blog post –Dracula, Vampire, Assura, PVS: A Brief History” – Dr. Andrew Moore has written the below article where he helps readers get a sense as to what “the year of hell” was like, from one of the key individuals who lived it. Andrew also addresses and corrects some of the “urban legends”Read More


EDA CEO Outlook 2017

EDA CEO Outlook 2017
by Daniel Nenni on 04-28-2017 at 7:00 am

A long standing tradition has returned to EDA: The CEO Outlook sponsored by ESDA (formerly EDAC) which alone is worth the price of membership! Not only do you get a free meal, the event included quality networking time with the semiconductor elite. In the past, financial analysts moderated this event holding the CEO’s feet to the… Read More


IoT in the Cloud with Microsoft and Mentor

IoT in the Cloud with Microsoft and Mentor
by Daniel Payne on 04-27-2017 at 12:00 pm

I cycle for fitness five days per week and use the Strava.com site to post my rides, analyze the ride data and chat with other cyclists, however in February this year the Amazon Web Services went down which crashed Strava, making me sad and nervous at the same time. Of course, there are alternatives to Amazon Web Services and the engineers… Read More


3D Product Design Collaboration in MCAD and ECAD Platforms

3D Product Design Collaboration in MCAD and ECAD Platforms
by Tom Dillinger on 04-25-2017 at 12:00 pm

Consumer electronics demand aggressive mechanical enclosure design — product volume, weight, shape, and connector access are all critical design optimization criteria. Mechanical CAD (MCAD) software platforms are used by product engineers to develop the enclosure definition — the integration of the PCB design… Read More