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The Siemens purchase of Mentor last year for a premium $4.5B was a bit of a shock to me as I have stated before. I had an inkling a Mentor acquisition was coming but Siemens was not on my list of suitors. The reviews have been mixed and the Siemens commitment to the IC EDA market has been questioned so I spent some time on this at #54DAC.
First… Read More
We have seen methodology shifts in our industry; emulation is going through a fundamental shift in usage, scope of the tasks, deployment, enterprise level and vertical market focus.… Read More
There is an emerging set of advanced packaging technologies that enables unique product designs, with the capability to integrate multiple die, from potentially heterogeneous technologies. These “system-in-package” (SiP) offerings provide architects with the opportunity to optimize product performance, power, cost,… Read More
Semiconductor companies are looking for ways to keep their business profitable by managing expenses on both the design and test side of electronic products, which is quite the challenge as the trends show increases in test pattern count and therefore test costs. Scan compression is a well-known technique first created over 15… Read More
Automotive ICs have to operate in a very demanding environment in terms of both temperature and voltage ranges, along with the ability to withstand g-forces and be sealed from the elements. Not an easy design challenge. For many consumer ICs we see output drive currents on the IO pins measured in mA, however in automotive if you want… Read More
After reading the Cadence blog post –“Dracula, Vampire, Assura, PVS: A Brief History” – Dr. Andrew Moore has written the below article where he helps readers get a sense as to what “the year of hell” was like, from one of the key individuals who lived it. Andrew also addresses and corrects some of the “urban legends”… Read More
A long standing tradition has returned to EDA: The CEO Outlook sponsored by ESDA (formerly EDAC) which alone is worth the price of membership! Not only do you get a free meal, the event included quality networking time with the semiconductor elite. In the past, financial analysts moderated this event holding the CEO’s feet to the… Read More
I cycle for fitness five days per week and use the Strava.com site to post my rides, analyze the ride data and chat with other cyclists, however in February this year the Amazon Web Services went down which crashed Strava, making me sad and nervous at the same time. Of course, there are alternatives to Amazon Web Services and the engineers… Read More
Consumer electronics demand aggressive mechanical enclosure design — product volume, weight, shape, and connector access are all critical design optimization criteria. Mechanical CAD (MCAD) software platforms are used by product engineers to develop the enclosure definition — the integration of the PCB design… Read More
The 4C’s of PCB Designby Tom Dillinger on 04-20-2017 at 12:00 pmCategories: EDA, Siemens EDA
The diamond jewelry industry encourages customers to focus on the 4C’s — cut, clarity, color, and carats. At the recent PCB Forum conducted by Mentor (a Siemens business) in Santa Clara, I learned that current system design flows also require an emphasis on the 4C’s — collaboration, concurrency, consistency… Read More