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Ansys to Present Multiphysics Cloud Enablement with Microsoft Azure at DAC

Ansys to Present Multiphysics Cloud Enablement with Microsoft Azure at DAC
by Daniel Nenni on 12-01-2021 at 2:00 pm

Picture1 1

Ansys and Microsoft  collaborated extensively over the past year to optimize and test Ansys’ signoff multiphysics simulation tools on the Azure cloud. Microsoft has invited Ansys to present the joint results in Azure’s DAC booth theater in San Francisco this year.

Two presentations are planned: covering the enablement of AnsysRead More


Creative Applications of Formal at Intel

Creative Applications of Formal at Intel
by Bernard Murphy on 12-01-2021 at 6:00 am

formal image min

One of the sessions I enjoyed at the Synopsys Verification Day 2021 was a presentation on applying formal to a couple of non-traditional problem domains. I like talks of this kind because formal can sometimes be boxed into a limited set of applications, under-exploiting the potential of the technology. Intel have built a centralized… Read More


System Technology Co-Optimization (STCO)

System Technology Co-Optimization (STCO)
by Daniel Payne on 11-30-2021 at 10:00 am

An early package prototype

My first exposure to seeing multiple die inside of a single package in order to get greater storage was way back in 1978 at Intel, when they combined two 4K bit DRAM die in one package, creating an 8K DRAM chip, called the 2109. Even Apple used two 16K bit DRAM chips from Mostek to form a 32K bit DRAM, included in the Apple III computer, circa… Read More


High-Performance Natural Language Processing (NLP) in Constrained Embedded Systems

High-Performance Natural Language Processing (NLP) in Constrained Embedded Systems
by Kalar Rajendiran on 11-30-2021 at 6:00 am

Demonstrator Block Diagram

Current technology news is filled with talk of many edge applications moving processing from the cloud to the edge. One of the presentations at the recently concluded Linley Group Fall Processor Conference was about AI moving from the cloud to the edge. Rightly so, there were several sessions dedicated to discussing AI and edge… Read More


Siemens EDA will be returning to DAC this year as a Platinum Sponsor.

Siemens EDA will be returning to DAC this year as a Platinum Sponsor.
by Daniel Nenni on 11-29-2021 at 10:00 am

Siemens EDA DAC

The 38th Design Automation Conference is next week and this one is for the record books. Having been virtual the last two years, next week we will meet live once again. I think we may have all taken for granted the value of live events but now we know how important they are on both a professional and human level, absolutely.

“The… Read More


Big Data Helps Boost PDN Sign Off Coverage

Big Data Helps Boost PDN Sign Off Coverage
by Tom Simon on 11-28-2021 at 8:00 am

PDN Sign Off

The nearly unavoidable truth about dynamic voltage drop (DVD) signoff for power distribution networks (PDN) is that the quality of results depends on the quality and quantity of the vectors used to activate the circuit switching. As SOCs grow larger and are implemented on smaller nodes, the challenges of sufficient coverage … Read More


Empyrean Technology‘s Complete Design Solution for PMIC

Empyrean Technology‘s Complete Design Solution for PMIC
by Daniel Nenni on 11-28-2021 at 6:00 am

PMIC Design SemiWIki

Power management integrated circuits (PMICs) are integrated circuits for power management. Driven by the strong demand in consumer electronics, IoT, and the automobile industry, the design for PMIC is getting more challenging in terms of integration, reliability and efficiency. The design methodology needs to be updated… Read More


WEBINAR: Using Design Porting as a Method to Access Foundry Capacity

WEBINAR: Using Design Porting as a Method to Access Foundry Capacity
by Tom Simon on 11-24-2021 at 8:00 am

Schematic Porting the NanoBeacon

There have always been good reasons to port designs to new foundries or processes. These reasons have included reusing IP in new projects, moving an entire design to a smaller node to improve PPA, or second sourcing manufacturing. While there can be many potential business motivations for any of the above, in today’s environment… Read More


Bonds, Wire-bonds: No Time to Mesh Mesh It All with Phi Plus

Bonds, Wire-bonds: No Time to Mesh Mesh It All with Phi Plus
by Matt Commens on 11-23-2021 at 10:00 am

Ansys Phi Plus

Automatic adaptive meshing in HFSS is a critical component of its advanced simulation process. Guided by Maxwell’s Equations, it efficiently refines the mesh to accurately capture both the geometric and electromagnetic detail of a design. The end result is a process that guarantees accurate and reliable simulation results… Read More


Learning-Based Power Modeling. Innovation in Verification

Learning-Based Power Modeling. Innovation in Verification
by Bernard Murphy on 11-23-2021 at 6:00 am

Innovation New

Learning-Based Power Modeling. Innovation in Verification

Is it possible to automatically generate abstract power models for complex IP which can both run fast and preserve high estimation accuracy? Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO) and… Read More