On July 18, 2025, Siemens EDA and Nvidia presented a compelling vision for the future of electronic design automation (EDA) at a DACtv event, emphasizing the transformative role of artificial intelligence (AI) in semiconductor and PCB design. Amit Gupta, Vice President and General Manager at Siemens EDA, and John Lynford, head… Read More
Electronic Design Automation
Materials Selection Methodology White Paper
The Granta EduPack White Paper on Materials Selection, authored by Harriet Parnell, Kaitlin Tyler, and Mike Ashby, presents a practical and educational guide to selecting materials in engineering design. Developed by Ansys and based on Ashby’s well-known methodologies, the paper outlines a four-step process to help learners… Read More
AI and Machine Learning in Chip Design: DAC Keynote Insights
In a keynote at the 62nd Design Automation Conference (#62DAC) on July 8, 2025, Jason Cong, Volgenau Chair for Engineering Excellence Professor, UCLA, reflected on over 30 years in the DAC community, highlighting the transformative role of AI and machine learning (ML) in semiconductor design. The speaker, whose first DAC paper… Read More
Enabling the AI Revolution: Insights from AMD’s DAC Keynote
In a keynote by Michaela Blott, AMD Senior Fellow, at the 62nd Design Automation Conference (DAC) on July 8, 2025, explored the trends shaping the AI revolution, emphasizing inference efficiency and hardware customization. While acknowledging AMD’s efforts in scaling GPUs and achieving energy efficiency goals (30x… Read More
AI Evolution and EDA’s Role in the Fourth Wave: William Chappell’s DAC Keynote
In a keynote at the 62nd Design Automation Conference (DAC) on July 8, 2025, William Chappell, Vice President of Mission Systems at Microsoft, reflected on the intertwined evolution of AI and semiconductor design. Drawing from his DARPA experience, Chappell traced AI’s progression from 2016 onward, highlighting its… Read More
AI-Driven ECAD Library Creation: Streamlining Semiconductor Design
On July 9, 2025, Julie Liu, PalPilot International presented for DACtv, unveiling Footprintku AI, a groundbreaking platform for automating configurable ECAD (Electronic Computer-Aided Design) library creation. This innovative solution addresses the inefficiencies of manual library generation, leveraging AI and … Read More
Modern Data Management: Overcoming Bottlenecks in Semiconductor Engineering
In a DACtv session on July 9, 2025, Pedro Pires from Keysight’s Design Engineering Software addressed the critical role of data management in modern semiconductor engineering projects. The presentation highlighted why data has become a bottleneck, how Keysight’s SOS (Save Our Source) platform mitigates these challenges,… Read More
Podcast EP301: Celebrating 20 Years on Innovation with yieldHUB’s John O’Donnell
Dan is joined by John O’Donnell, Founder and CEO of yieldHUB, a pioneering leader in advanced data analytics for the semiconductor industry. Since establishing the company in 2005 he has transformed it from a two-person startup into a trusted multinational partner that empowers some of the world’s leading semiconductor companies… Read More
AI-Powered Waveform Debugging: Revolutionizing Semiconductor Verification
On July 9, 2025, a DACtv session with Zackary Glazewski of ChipAgents AI introduced Waveform Agents, an AI-driven solution by Chip Agents designed to tackle the complex challenge of waveform debugging in semiconductor design. The speaker highlighted the difficulties of traditional waveform debugging and demonstrated how… Read More
AI-Driven Verification: Transforming Semiconductor Design
In a DACtv session on July 9, 2025, Abhi Kolpekwar, Vice-President & General Manager at Siemens EDA, illuminated the transformative role of artificial intelligence (AI) in addressing the escalating challenges of semiconductor design verification. The presentation underscored the limitations of traditional methods… Read More


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