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The press release about ONFI 3.0 support was launched by Cadence at the beginning of this year. It was a good illustration of Denali, then Cadence, long term commitment to Nand Flash Controller IP support. The ONFI 3 specification simplifies the design of high-performance computing platforms, such as solid state drives and enterprise… Read More
Recently I was researching the keynote speeches of isQED (International Society for Quality Electronic Design) Symposium 2012 and saw the very first, great presentation, “Taming the Challenges in Advanced Node Design” by Tom Beckley, Sr. VP at Cadence. I know Tom very well as I have worked with him and I admire his knowledge, authority… Read More
EDPS: 3D ICs, part Iby Paul McLellan on 04-10-2012 at 10:00 pmCategories: EDA, Events
The second day (more like a half-day) of EDPS was devoted to 3D ICs. There was a lot of information, too much to summarize in a few hundred words. The keynote was by Riko Radojcic of Qualcomm, who has been a sort of one-man-band attempting to drive the EDA and manufacturing industries towards 3D. Of course it helps if you don’t … Read More
This morning I attended a webinar about MEMS and IC co-design from a company called SoftMEMS along with Tanner EDA. I learned that you can co-design MEMS and IC either in a bottom-up or top-down methodology, and that this particular flow has import/export options to fit in with your mechanical simulation tools (Ansys, Comsol, Open… Read More
Oasys announced that it closed its series B funding round with investments from Intel Capital and Xilinx. The fact that any EDA company has closed a funding round is newsworthy these days; companies running out of cash and closing the doors seems to be a more common story.
Oasys has been relatively quiet, which some people have taken… Read More
EDPS: Parallel EDAby Paul McLellan on 04-08-2012 at 10:00 pmCategories: EDA, Events
EDPS was last Thursday and Friday in Monterey. I think that this is a conference that more people would benefit from attending. Unlike some other conferences, it is almost entirely focused around user problems rather than doing a deep dive into things of limited interest. Most of the presentations are more like survey papers and… Read More
Analyzing the operation of a modern SoC, especially analyzing its power distribution network (PDN) is getting more and more complex. Today’s SoCs no longer operate on a continuous basis, instead functional blocks on the IC are only powered up to execute the operation that is required and then they go into a standby mode, … Read More
It was an honor to see DR. Chenming Huspeak and to learn more about FinFets, a technology he has championed since 1999. Chenming is considered an expert on the subject and is currently a TSMC Distinguished Professor of Microelectronics at University of California, Berkeley. Prior to that he was the Chief Technology Officer of TSMC.… Read More
Will the launch of ARC based complete sound system IP by Synopsys ring the bell for the opening of a new IP market segment, the “Subsystem IP”? If you look at the IP market evolution, starting from standard cell libraries and memory compiler offering in the 1990’s, moving to commodity functions like UART or I2C in the late 1990’s to … Read More
DAC Pavilion Panelsby Paul McLellan on 04-05-2012 at 12:00 amCategories: EDA, Events
Once again DAC has a full program of panel sessions that take place on the exhibit floor at the DAC pavilion, aka booth 310.
Gary Smith kicks off the program with his annual “What’s Hot at DAC” presentation on Monday, June 4th, from 9:15-10:15am. The rest of Monday’s pavilion panels are:
- “Low power to the people,” a panel discussing
…
Read More
Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business