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EDA

Electronic Design Automation

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ANSYS Tools Shine at FinFET Nodes!

ANSYS Tools Shine at FinFET Nodes!
by Pawan Fangaria on 09-30-2014 at 4:00 pm
Categories: Ansys, Inc., EDA, FinFET

In the modern semiconductor ecosystem we are seeing rapid advancement in technology breaking past once perceived limits; 28nm, 20nm, 16-14nm, 10nm and we are foreseeing 7nm now. Double and multi-patterning are already being seen along with complex FinFET structures in transistors to gain the ultimate advantages in PPA from… Read More

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Designing SmartCar ICs

Designing SmartCar ICs
by Daniel Payne on 09-30-2014 at 7:00 am
Categories: EDA, Synopsys

When I upgraded cars from a 1988 to 1998 Acura it seemed like my car had become much smarter with a security chip in the key, security codes in the radio and a connector for computer diagnosis, however in today’s modern auto there’s a lot more mixed-signal design content. Micronasand Synopsysgot together and hosted … Read More

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Place & Route with FinFETs and Double Patterning

Place & Route with FinFETs and Double Patterning
by Paul McLellan on 09-29-2014 at 8:00 am
Categories: EDA, FinFET

Place & route in the 16/14nm era requires a new approach since it is significantly more complex. Of course, every process generation is more complex than the one before and the designs are bigger. But modern processes have new problems. The two biggest changes are FinFETs and double patterning.

FinFETs, as I assume you know,… Read More

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A Complete Timing Constraints Solution – Creation to Signoff

A Complete Timing Constraints Solution – Creation to Signoff
by Pawan Fangaria on 09-28-2014 at 10:00 pm
Categories: EDA

With the unprecedented increase in semiconductor design size and complexity design teams are required to accommodate multiple design constraints such as multiple power domains for low power design, multiple modes of operation, many clocks running, and third party IPs with different SDCs. As a result timing closure has become… Read More

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Mentor at TSMC OIP, 16nm, and 10nm

Mentor at TSMC OIP, 16nm, and 10nm
by Beth Martin on 09-26-2014 at 4:46 pm
Categories: Siemens EDA

On Tuesday, September 30, TSMC hosts another Open Innovation Platform Ecosystem forum at the San Jose Convention Center. Have you registered? This year includes 30 technical sessions from TSMC’s ecosystem partners, divided into three separate tracks. I’ll be hanging out in the EDA track, listening to various takes on 16nm FinFET… Read More

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Synopsys Verification Continuum

Synopsys Verification Continuum
by Paul McLellan on 09-26-2014 at 4:00 pm
Categories: EDA, Synopsys

Verification spans a number of different technologies, from virtual platforms, RTL simulation, formal techniques, emulation and FPGA prototyping. Going back a few years, most of these technologies came from separate companies and one effect of this was that moving the design from one verification environment to another required… Read More

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Dominating FPGA clock domains and CDCs

Dominating FPGA clock domains and CDCs
by Don Dingee on 09-26-2014 at 7:00 am
Categories: Aldec, EDA, FPGA

Multiple clock domains in FPGAs have simplified some aspects of designs, allowing effective partitioning of logic. As FPGA architectures get more flexible in how clock domains, regions, or networks are available, the probability of signals crossing clock domains has gone way up.… Read More

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Coverage Driven Verification for Analog?

Coverage Driven Verification for Analog?
by Pawan Fangaria on 09-26-2014 at 1:00 am
Categories: EDA, Siemens EDA

We know there is a big divide between analog and digital design methodologies, level of automation, validation and verification processes, yet they cannot stay without each other because any complete system on a chip (SoC) demands them to be together. And therefore, there are different methodologies on the floor to combine analog… Read More

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Electro-Thermal Simulation of Power Transistors

Electro-Thermal Simulation of Power Transistors
by Daniel Payne on 09-25-2014 at 4:00 pm
Categories: EDA, Magwel

Power transistors are commonly used in applications like: hybrid vehicles, electric vehicles, automotive, home appliances, LED lighting, TVs, power and energy. In the old days an engineering team could build their device with power transistors, then after production run some thermal testing to see if they guessed the proper… Read More