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Siemens Provides a Complete 3D IC Solution with Innovator3D IC

Siemens Provides a Complete 3D IC Solution with Innovator3D IC
by Mike Gianfagna on 06-27-2024 at 6:00 am

Siemens Provides a Complete 3D IC Solution with Innovator3D IC

Heterogeneous multi-die integration is gaining more momentum all the time. The limited roadmap offered by Moore’s Law monolithic, single-die integration has opened the door to a new era of more-than-Moore heterogeneous integration. The prospects offered by this new design paradigm are exciting and the entire ecosystem is… Read More


New EDA Tool for 3D Thermal Analysis

New EDA Tool for 3D Thermal Analysis
by Daniel Payne on 06-26-2024 at 10:00 am

3D IC cross section min

An emerging trend with IC design is the growing use of chiplets and even 3D IC designs, as the disaggregated approach has some economic and performance benefits over a single SoC. There are thermal challenges with using chiplets and 3D IC designs, so that means that thermal analysis has become more important. I just spoke with Michael… Read More


Novelty-Based Methods for Random Test Selection. Innovation in Verification

Novelty-Based Methods for Random Test Selection. Innovation in Verification
by Bernard Murphy on 06-26-2024 at 6:00 am

Innovation New

Coverage improvement effectiveness through randomized testing declines as total coverage improves. Attacking stubborn holes in coverage could be augmented through learned novel test guidance to random test selection. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former… Read More


Podcast EP230: An Overview of the Siemens EDA Calibre 3D Thermal Announcement at DAC with Dr. John Ferguson

Podcast EP230: An Overview of the Siemens EDA Calibre 3D Thermal Announcement at DAC with Dr. John Ferguson
by Daniel Nenni on 06-25-2024 at 8:00 am

Dan is joined by Dr. John Ferguson, senior director of marketing for the Calibre product line at Siemens EDA. John has worked extensively in physical design verification. Current activities include efforts to extend physical verification and PDK enablement for 3DIC design and silicon photonics.

Dan explores the Siemens EDA… Read More


Synopsys’ Strategic Advancement with PCIe 7.0: Early Access and Complete Solution for AI and Data Center Infrastructure

Synopsys’ Strategic Advancement with PCIe 7.0: Early Access and Complete Solution for AI and Data Center Infrastructure
by Kalar Rajendiran on 06-25-2024 at 6:00 am

(From NewsRelease)Synopsys PCIe 7.0 IP Solution Infographic

In the rapidly evolving world of high-performance computing (HPC) and artificial intelligence (AI), technological advancements must keep pace with increasing demands for speed, efficiency, and security. Synopsys recently announced the industry’s first complete PCIe 7.0 IP solution. This groundbreaking initiative addresses… Read More


System VIPs are to PSS as Apps are to Formal

System VIPs are to PSS as Apps are to Formal
by Bernard Murphy on 06-24-2024 at 10:00 am

System VIP Libraries and Solutions

In the formal world the core technology is extremely powerful, and specialist users need full access to tackle difficult problems. But for many applications, teams prefer canned solutions built on the core technology yet scalable to non-experts. A similar dynamic appears to be playing out between System VIPs and PSS. PSS, the… Read More


Breker Verification Systems at the 2024 Design Automation Conference

Breker Verification Systems at the 2024 Design Automation Conference
by Daniel Nenni on 06-21-2024 at 2:00 pm

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Breker Verification Systems will demonstrate its new RISC-V CoreAssurance™ and SoCReady™ SystemVIP™ along with its Trek Test Suite Synthesis portfolio during the 61st Design Automation Conference (DAC) in Booth #2447. DAC will be held from Monday, June 24, through Wednesday, June 26, from 10 a.m. until 6 p.m. at Moscone West… Read More


Pragmatic at the 2024 Design Automation Conference

Pragmatic at the 2024 Design Automation Conference
by Daniel Nenni on 06-21-2024 at 8:00 am

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Pragmatic is pioneering a fundamental shift in semiconductor technology, delivering lower-cost, lower-carbon intelligence to power the Internet of Everything. Its FlexIC – flexible integrated circuit – technology delivers connect, sense and compute capabilities at a fraction of the cost and carbon footprint of silicon… Read More


Empyrean at the 2024 Design Automation Conference

Empyrean at the 2024 Design Automation Conference
by Daniel Nenni on 06-20-2024 at 8:00 pm

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Empyrean Technologies is excited to introduce our comprehensive and highly productive Custom IC design solutions at DAC 2024. Our suite of tools is fully integrated within a design environment tailored for AMS (Analog/Mixed-Signal) designs, covering every step from initial design specification to tape-out. These tools
Read More

AMIQ EDA at the 2024 Design Automation Conference

AMIQ EDA at the 2024 Design Automation Conference
by Daniel Nenni on 06-20-2024 at 6:00 pm

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AMIQ EDA is a pioneer in integrated development environments (IDEs) for hardware design and verification and a provider of platform-independent software tools for efficient code development and analysis. We’ve been attending DAC for many years and are pleased to do so again in 2024. We exhibit at this show for several reasons.… Read More