Heterogeneous multi-die integration is gaining more momentum all the time. The limited roadmap offered by Moore’s Law monolithic, single-die integration has opened the door to a new era of more-than-Moore heterogeneous integration. The prospects offered by this new design paradigm are exciting and the entire ecosystem is… Read More
Electronic Design Automation
New EDA Tool for 3D Thermal Analysis
An emerging trend with IC design is the growing use of chiplets and even 3D IC designs, as the disaggregated approach has some economic and performance benefits over a single SoC. There are thermal challenges with using chiplets and 3D IC designs, so that means that thermal analysis has become more important. I just spoke with Michael… Read More
Novelty-Based Methods for Random Test Selection. Innovation in Verification
Coverage improvement effectiveness through randomized testing declines as total coverage improves. Attacking stubborn holes in coverage could be augmented through learned novel test guidance to random test selection. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former… Read More
Podcast EP230: An Overview of the Siemens EDA Calibre 3D Thermal Announcement at DAC with Dr. John Ferguson
Dan is joined by Dr. John Ferguson, senior director of marketing for the Calibre product line at Siemens EDA. John has worked extensively in physical design verification. Current activities include efforts to extend physical verification and PDK enablement for 3DIC design and silicon photonics.
Dan explores the Siemens EDA… Read More
Synopsys’ Strategic Advancement with PCIe 7.0: Early Access and Complete Solution for AI and Data Center Infrastructure
In the rapidly evolving world of high-performance computing (HPC) and artificial intelligence (AI), technological advancements must keep pace with increasing demands for speed, efficiency, and security. Synopsys recently announced the industry’s first complete PCIe 7.0 IP solution. This groundbreaking initiative addresses… Read More
System VIPs are to PSS as Apps are to Formal
In the formal world the core technology is extremely powerful, and specialist users need full access to tackle difficult problems. But for many applications, teams prefer canned solutions built on the core technology yet scalable to non-experts. A similar dynamic appears to be playing out between System VIPs and PSS. PSS, the… Read More
Breker Verification Systems at the 2024 Design Automation Conference
Breker Verification Systems will demonstrate its new RISC-V CoreAssurance™ and SoCReady™ SystemVIP™ along with its Trek Test Suite Synthesis portfolio during the 61st Design Automation Conference (DAC) in Booth #2447. DAC will be held from Monday, June 24, through Wednesday, June 26, from 10 a.m. until 6 p.m. at Moscone West… Read More
Pragmatic at the 2024 Design Automation Conference
Pragmatic is pioneering a fundamental shift in semiconductor technology, delivering lower-cost, lower-carbon intelligence to power the Internet of Everything. Its FlexIC – flexible integrated circuit – technology delivers connect, sense and compute capabilities at a fraction of the cost and carbon footprint of silicon… Read More
Empyrean at the 2024 Design Automation Conference
AMIQ EDA at the 2024 Design Automation Conference
AMIQ EDA is a pioneer in integrated development environments (IDEs) for hardware design and verification and a provider of platform-independent software tools for efficient code development and analysis. We’ve been attending DAC for many years and are pleased to do so again in 2024. We exhibit at this show for several reasons.… Read More
Weebit Nano Moves into the Mainstream with Customer Adoption