Synopsys is catalyzing the era of pervasive intelligence with comprehensive engineering solutions spanning silicon design, IP, and simulation and analysis. At this year’s Design Automation Conference (DAC), the company will showcase innovations transforming silicon and systems development for a wide range of applications… Read More
Electronic Design Automation
Enabling AI to Understand Complex Runtime Behavior for Accurate, Automated Root Cause Analysis — DAC 2026
Undo gives AI coding agents the runtime context they need to solve hard problems in complex software and system verification workflows Undo’s technology records complete program execution, allowing engineers and AI coding agents to understand exactly what happened during execution rather than inferring behavior from source… Read More
Podcast EP354: How Siemens EDA is Conquering New Lithography Challenges with Sagar Saxena
Daniel is joined by Sagar Saxena, Senior Product Engineer at Siemens EDA specializing in computational lithography, optical proximity correction (OPC), and advanced patterning solutions for leading-edge semiconductor manufacturing. Sagar has led the development and deployment of advanced OPC technologies, including… Read More
CEO Interview with Mark Ren of Agentrys
Mark Ren has 26 years of EDA and AI R&D experience spanning IBM Research and NVIDIA Research, driving design automation innovations that power modern chip design. He received the IBM Corporate Award for contributions to the design closure for high-performance microprocessors. At NVIDIA, he helped establish the company
SemiAnalysis EDA Market Primer – Market Dynamics, Cadence, Synopsys, Siemens, China EDA Rise
Electronic Design Automation, or EDA, is the software infrastructure that transforms a hardware specification into a manufacturable integrated circuit. At advanced process nodes, the problem is no longer simply drawing transistors or connecting gates. A modern system-on-chip contains billions of standard cells, hundreds… Read More
Beyond Workflow Agents: Toward Design Intelligence in Analog EDA
Over the last year, the EDA industry has started using a new vocabulary: agents, super agents, mental models, native skills, playbooks, RAG, MCP, autonomous workflows, and AI-first design.
The language is new, but the motivation is familiar to anyone who has worked in chip design.
Design complexity keeps increasing. The number… Read More
MooresLabAI at DAC 2026: Why the Future of Semiconductor Engineering Is Agentic, Not Just Generative
For decades, semiconductor innovation has been constrained not by imagination, but by engineering capacity. While transistor density has continued to advance, the process of building chips has remained fundamentally manual, fragmented across specifications, RTL, verification, debugging, coverage analysis, and signoff.… Read More
IP Lifecycle Management in the AI Era
Large design enterprises have multiple concurrent activities around IP of various types: software/firmware, blocks defined in RTL or HLS, verification IPs of multiple different types, physical implementations, scripts/files for timing, power management, etc., etc. Each of these continues to evolve and branch to serve … Read More
See Autonomous Chip Design in Action with ChipAgents at DAC 2026
Making the AI wave at DAC 2026 in Long Beach
DAC comes to Long Beach for the first time in 2026, with artificial intelligence expected to be one of the central topics across the conference program and exhibition floor.
For semiconductor design and verification teams, the discussion has moved beyond whether AI can assist engineers.… Read More
Demonstrating the EasyAI ECO Suite – An AI-Powered Functional ECO Solution at DAC 2026
Easy-Logic, a leading provider of high-performance Engineering Change Order (ECO) solutions in Electronic Design Automation (EDA), will showcase its latest innovation — the EasyAI ECO Suite — at 2026 DAC in Los Angeles, July 27–29, 2026. This intelligent ECO solution integrates AI engines into the entire ECO workflow and systematically… Read More


TSMC CoWoS versus Intel EMIB Semiconductor Packaging