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Agentic EDA Panel Review Suggests Promise and Near-Term Guidance

Agentic EDA Panel Review Suggests Promise and Near-Term Guidance
by Bernard Murphy on 02-24-2026 at 6:00 am

Massive AI datacenter

NetApp recently hosted a webinar on Agentic AI as the future for EDA and implications for infrastructure. Good list of panelists including Mahesh Turaga (VP Cadence Cloud) with an intro preso on infrastructure and agentic AI at Cadence, then our own Dan Nenni (Mr. SemiWiki) moderating, Khaled Heloue (Fellow AMD, CAD CAD/Methodology/AI),… Read More


Hardware is the Center of the Universe (Again)

Hardware is the Center of the Universe (Again)
by Lauro Rizzatti on 02-23-2026 at 10:00 am

Hardware is the Center of the Universe (Again) Figure 1

The 40-Year Evolution of Hardware-Assisted Verification — From In-Circuit Emulation to AI-Era Full-Stack Validation

For more than a decade, Hardware-Assisted Verification platforms have been the centerpiece of the verification toolbox. Today, no serious semiconductor program reaches tapeout without emulation or FPGA-prototyping… Read More


Smarter ECOs: Inside Easy-Logic’s ASIC Optimization Engine

Smarter ECOs: Inside Easy-Logic’s ASIC Optimization Engine
by Daniel Nenni on 02-23-2026 at 8:00 am

Easy Logic EDA

Easy-Logic Technology Ltd. is a specialized Electronic Design Automation (EDA) company focused on solving one of the most complex and time-sensitive challenges in semiconductor design: functional Engineering Change Orders (ECOs). Founded in 2014 and headquartered in Hong Kong, the company has built its reputation around

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What is the 3nm Pessimism Wall and Why is it An Economic Crisis?

What is the 3nm Pessimism Wall and Why is it An Economic Crisis?
by Mike Gianfagna on 02-20-2026 at 8:00 am

What is the 3nm Pessimism Wall and Why is it An Economic Crisis?

Chip design is getting more difficult as technology advances. Everyone knows that. A lot of the discussion around these issues tends to focus on the demands posed by massive AI workloads and the challenges of shifting to heterogeneous multi-die design. While these create real problems, there is an underlying effect that is making… Read More


CEO Interview with Aftkhar Aslam of yieldWerx

CEO Interview with Aftkhar Aslam of yieldWerx
by Daniel Nenni on 02-20-2026 at 6:00 am

IMG 9364 3

Aftkhar Aslam is the Co-Founder and Chief Executive Officer of yieldWerx and a semiconductor industry veteran with more than 30 years of experience spanning manufacturing, test engineering, yield management, IP strategy, and enterprise digital transformation.

Under his leadership, yieldWerx has become a trusted data and… Read More


Custom IC Design using Additive Learning

Custom IC Design using Additive Learning
by Daniel Payne on 02-19-2026 at 10:00 am

Additive learning engine

Custom IC design has demanding technical requirements to produce accurate simulation results for timing and power analysis in the shortest run times. EDA vendors have been rushing to use AI and ML technology to meet these analysis requirements. I attended a webinar from Siemens on accelerating iterative design cycles with Solido… Read More


Smarter IC Layout Parasitic Analysis

Smarter IC Layout Parasitic Analysis
by Daniel Payne on 02-18-2026 at 10:00 am

ParagonX flow

IC layout parasitics dominate the performance of custom digital, analog and mixed-signal designs, so the challenge becomes how to identify the root causes and to quantify the effects of parasitics during early design stages. The old method of iterating between layout, extraction, SPICE simulation, followed by manual debug… Read More


Accelerating Static ESD Simulation for Full-Chip and Multi-Die Designs with Synopsys PathFinder-SC

Accelerating Static ESD Simulation for Full-Chip and Multi-Die Designs with Synopsys PathFinder-SC
by Kalar Rajendiran on 02-17-2026 at 10:00 am

SNPS PathFinder SC ESD Verification

As analog and mixed-signal designs become increasingly complex, parasitic effects dominate both design time and cost, consuming 30–50% of engineers’ effort in debugging and reanalyzing circuits. Addressing these multiphysics effects requires early verification strategies and reliable simulation solutions. Modern … Read More


On the high-speed digital design frontier with Keysight’s Hee-Soo Lee

On the high-speed digital design frontier with Keysight’s Hee-Soo Lee
by Don Dingee on 02-16-2026 at 10:00 am

Chiplet 3D Interconnect Designer reduces interconnect analysis in high-speed digital design from weeks to minutes

High-speed digital (HSD) design is one of the more exciting areas in EDA right now, with design practices, tools, and workflows evolving to keep pace with increasing design complexity. With the annual Chiplet Summit and DesignCon festivities right around the corner, we sat down with Keysight’s Hee-Soo Lee, HSD Segment Lead, … Read More


Bronco Debug Stress Tested Measures Up

Bronco Debug Stress Tested Measures Up
by Bernard Murphy on 02-16-2026 at 6:00 am

Automated debugger

I wrote last year about a company called Bronco, offering an agentic approach to one of the hottest areas in verification – root-cause debug. I find Bronco especially interesting because their approach to agentic is different than most. Still based on LLMs of course but emphasizing playbooks of DV wisdom for knowledge capture … Read More