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Electronic Design Automation
At lower frequencies with simpler modulation, RF power amplifier (PA) designers could safely concentrate on a few primary metrics – like gain and bandwidth – and rely on relaxed margins to ensure proper operation in a range of conditions. Today’s advanced RF PA design is a different story. mmWave and sub-THz frequencies introduce… Read More
As computing expands from data centers to edge devices, semiconductor designers face increasing pressure to optimize both performance and energy efficiency. Advanced process nodes continue to provide transistor-level improvements, but scaling alone cannot meet the demands of hyperscale AI infrastructure or ultra-low-power… Read More
At the 2026 Chiplet Summit, Synopsys presented a bold vision for the future of semiconductor innovation: AI-driven multi-die design powered by agentic intelligence. As the semiconductor industry shifts rapidly toward chiplet-based architectures and 3D stacking, the complexity of design, verification, and system integration… Read More
In a break from our academic-centric picks, here we look at an agentic verification flow developed within a semiconductor company. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A) and I continue our series on research ideas.… Read More
Siemens has strengthened its position in EDA and manufacturing by acquiring ASTER Technologies, a specialist in test and reliability solutions for printed circuit boards. The acquisition represents a strategic step in Siemens’ broader vision to deliver a fully integrated, end-to-end digital thread for electronics design,… Read More
NetApp recently hosted a webinar on Agentic AI as the future for EDA and implications for infrastructure. Good list of panelists including Mahesh Turaga (VP Cadence Cloud) with an intro preso on infrastructure and agentic AI at Cadence, then our own Dan Nenni (Mr. SemiWiki) moderating, Khaled Heloue (Fellow AMD, CAD CAD/Methodology/AI),… Read More
The 40-Year Evolution of Hardware-Assisted Verification — From In-Circuit Emulation to AI-Era Full-Stack Validation
For more than a decade, Hardware-Assisted Verification platforms have been the centerpiece of the verification toolbox. Today, no serious semiconductor program reaches tapeout without emulation or FPGA-prototyping… Read More
Easy-Logic Technology Ltd. is a specialized Electronic Design Automation (EDA) company focused on solving one of the most complex and time-sensitive challenges in semiconductor design: functional Engineering Change Orders (ECOs). Founded in 2014 and headquartered in Hong Kong, the company has built its reputation around
Chip design is getting more difficult as technology advances. Everyone knows that. A lot of the discussion around these issues tends to focus on the demands posed by massive AI workloads and the challenges of shifting to heterogeneous multi-die design. While these create real problems, there is an underlying effect that is making… Read More
Aftkhar Aslam is the Co-Founder and Chief Executive Officer of yieldWerx and a semiconductor industry veteran with more than 30 years of experience spanning manufacturing, test engineering, yield management, IP strategy, and enterprise digital transformation.
Under his leadership, yieldWerx has become a trusted data and… Read More
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Unraveling Dose Reduction in Metal Oxide Resists via Post-Exposure Bake Environment