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Electronic Design Automation
Even with advances in AI, automation, and advanced process technology, many semiconductor test operations still rely on reports generated hours after production has occurred. This creates a significant and growing problem. By the time engineers discover a yield excursion, parametric drift, tester issue, or an increase in… Read More
Batteries, especially for electric vehicles, are very much in the news these days. This technology is vital for many aspects of our modern lives, but people often worry about things like range limitations and the possibility of overheating. The industry is responding with electronic solutions for improving battery operation.… Read More
As systems become increasingly complex across every field of science and engineering, the importance of computer simulation in design, analysis, and verification continues to increase over time. The traditional process in which a system is modeled and simulated in a single tool is called monolithic simulation. On the other… Read More
QED (Quick Error Detection) can be a powerful complementary addition to verification but can be subject to size constraints. This month’s paper looks at a fix for that limitation. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A)… Read More
For the past decade, the semiconductor industry has been moving in one direction: shift-left, specifically, shifting more validation into the pre-silicon phase. The idea was straightforward: if software ultimately determines how a system behaves, then software should become a primary vehicle for verification.
The industry… Read More
Daniel is joined by William Wang the CEO and Founder of ChipAgents.ai, the category-leading agentic AI platform for advancing agent-based AI approaches for semiconductor workflows. He is also the Mellichamp Endowed Chair Professor of AI and Designs at UC Santa Barbara, and a global leader in fundamental AI research. He founded… Read More
Embedded systems programs often fail because critical engineering documentation drifts out of alignment over time and distance. This results in a team that is correctly following the wrong instructions. All forms of engineering documentation suffer from this problem, and it really is the silent killer of many programs.
llmda.ai… Read More
What systems can accomplish by combining semiconductors, AI, and software seems at times boundless. Chiplet-based semiconductors deliver this promise, allowing a myriad of complex digital, memory, analog and photonic functions to be condensed into a single semiconductor package for higher performance, lower power consumption… Read More
Systems-in-package (SIPs) with 2.5D and 3D heterogenous integration, consisting of multiple dies and chiplets deliver 10x more functionality than traditional monolithic chips. This capability enables innovative solutions for diverse needs in scientific computing, automotive, edge computing, and aerospace/defense.… Read More
Daniel is joined by Kent Lusted, a Distinguished Architect at Synopsys and an integral part of the company’s Ethernet IP design team. He has been an active contributor and member of the IEEE 802.3 Ethernet PHY standards development leadership team for more than 15 years. Prior to Synopsys, Kent worked at Intel for 30+ years, focused… Read More
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The Packaging PDK Is the Missing Layer for Co-Packaged Optics