Keysight Technologies is opening a new route for artificial intelligence into radio frequency engineering. Announced on October 6, 2026, its latest software capabilities let engineers connect their own AI agents and large language models to Advanced Design System (ADS) 2027. Agents can help generate and optimize circuits,… Read More
Electronic Design Automation
ChipAgents and NVIDIA Put Autonomous Chip Design to the Test
ChipAgents has introduced Build-A-Chip-Bench, a benchmark developed with NVIDIA to evaluate whether AI agents can complete digital chip design tasks from specification through physical implementation. The initiative measures progress beyond generating hardware code, asking whether autonomous systems can deliver verified… Read More
Podcast EP373: The Impact of yieldHUB Live and Details of Upcoming Show Participation with Gillian O’Donnell
Daniel is joined by Gillian O’Donnell, Director of Growth at yieldHUB, the enterprise yield management platform trusted by semiconductor and photonics manufacturers worldwide. She leads business development, marketing, PR, and partnerships, with a particular focus on yieldHUB Live, the company’s real-time… Read More
The silent killer of analog reliability: Why SPICE misses floating net
By Bhanu Pandey
The semiconductor industry is currently facing a significant challenge in functional verification. According to the most recent Wilson Research Group / Siemens EDA Functional Verification Study, first-silicon success rates have hit a historic low, with nearly 68% of designs requiring two or more spins. While… Read More
Wilson Survey Signals Need for New Understanding of Verification Success
Siemens has again sponsored a Wilson-led survey on the state of (functional) verification in the industry, and this time Harry Foster (Chief Scientist, Verification at Siemens) has condensed his major takeaways from the report. These are intriguing – particularly an apparent revolutionary change in first-silicon trends.… Read More
Podcast EP372: An Overview of Some Important New Sessions at Semicon West with Julie Rogers
Daniel is joined by Julie Rogers, Executive Director, ESD Alliance. Julie brings deep expertise in industry collaboration, technical conferences, and executive engagement. She brings more than 30 years of experience driving growth, visibility, and alignment across complex, highly technical markets. She is widely recognized… Read More
Beyond the Die: Verifying the Connected Chip
One of the standout presentations at the 2026 TSMC OIP Forum highlighted a collaboration between Siemens EDA, Marvell, and TSMC. I always appreciate EDA presentations that bring together customer and foundry perspectives, and this one did not disappoint. We follow 3D IC technology closely and have published more than 150 blogs… Read More
From Faster Proofs to Trusted Silicon with LUBIS EDA
LUBIS EDA is introducing FormalOS, a platform designed to make formal verification more systematic, scalable and predictable. Built on the company’s five-stage methodology, it combines structured workflows, verification playbooks, automation, reusable verification assets and sign-off evidence within customers’ existing… Read More
Podcast EP371: How Vinci is Revolutionizing Hardware Design with John Bruggeman
Daniel is joined by John Bruggeman, Chief Marketing Officer at Vinci, where he leads the company’s market narrative and strategic positioning. His work focuses on translating complex technical advances into clear category definition, industry relevance, and market adoption.
Daniel discusses How Vinci fits into the hardware… Read More
Siemens CTO update on Calibre at DAC 2026
At DAC 2026 I had the opportunity to speak with Juan Rey, CTO Siemens EDA about the Calibre product used for IC physical verification, circuit verification, 3D IC and DFM optimization. Juan has been involved with Calibre since 2001, served on the Board of Directors of Silicon Integration Initiative (SI2), on the Executive Technology… Read More


Rethinking Phase Jitter: An Algorithmic Approach to Signal Integrity