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WP_Term Object
(
    [term_id] => 157
    [name] => EDA
    [slug] => eda
    [term_group] => 0
    [term_taxonomy_id] => 157
    [taxonomy] => category
    [description] => Electronic Design Automation
    [parent] => 0
    [count] => 4571
    [filter] => raw
    [cat_ID] => 157
    [category_count] => 4571
    [category_description] => Electronic Design Automation
    [cat_name] => EDA
    [category_nicename] => eda
    [category_parent] => 0
    [is_post] => 
)

Interview with David Tester VP of Engineering Mach42

Interview with David Tester VP of Engineering Mach42
by Daniel Nenni on 11-05-2026 at 12:00 pm

Pre Silicon Problems David Tester Interview

David Tester is the VP of Engineering at Mach42, with 30 years of experience in semiconductor development, engineering leadership, and business growth. As Chief Engineer at EnSilica, he helped transform the company from a design consultancy into a publicly listed fabless semiconductor business, scaling the organisation … Read More


The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node Survival

The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node Survival
by Kalar Rajendiran on 11-05-2026 at 6:00 am

The Real Value of Predictable Execution

The philosophy of relying on a single, unified IP stack to lower your total cost of ownership is not a new concept invented just for the AI era. Semiconductor engineering teams have been weighing the trade-offs of piecemeal versus integrated intellectual property sourcing for decades. In previous process generations, veering… Read More


Generating Chip Subsystems Automatically: A New Answer to Manage Chip Design Complexity  

Generating Chip Subsystems Automatically: A New Answer to Manage Chip Design Complexity  
by Admin on 11-04-2026 at 10:00 am

blog picture

By Defacto Staff

Today’s chips are no longer just processors, they are entire systems. A System-on-Chip (SoC) brings together CPU clusters, accelerators, memories, interconnects and dozens of peripherals, often coming from many different teams and vendors. With AI, high-performance computing and IoT driving demand for … Read More


Reimagining 3D IC Design: From Architecture to Signoff

Reimagining 3D IC Design: From Architecture to Signoff
by Admin on 11-04-2026 at 8:00 am

figure1 digital twin creation

By Keith Felton, Andras Vass-Varnai and Todd Burkholder, Siemens EDA

The semiconductor industry is undergoing a fundamental transformation. Heterogeneous integration, the practice of combining multiple chiplets and specialized components into a single advanced packaging platform, has emerged as a powerful alternative… Read More


How Allegro MicroSystems Increased OEE by Several Percentage Points with yieldHUB Live

How Allegro MicroSystems Increased OEE by Several Percentage Points with yieldHUB Live
by Daniel Nenni on 11-03-2026 at 6:00 am

How Allegro MicroSystems Increased OEE by Several Percentage Points with yieldHUB Live

Allegro MicroSystems’ experience with yieldHUB Live shows how better use of production data can translate into measurable manufacturing gains. At its high-volume semiconductor operation in the Philippines, Allegro set out to improve overall equipment effectiveness, or OEE, by one percentage point. According to the customer… Read More


Using AI for Root Cause Analysis of Simulation Failures

Using AI for Root Cause Analysis of Simulation Failures
by Tom Anderson on 11-02-2026 at 8:00 am

RCA Demo

I’ve been working with AMIQ EDA for almost nine years now, writing about their cool technologies and interviewing users about their experiences. I’ve read through more user guides and release notes than I can count. I’ve watched many dozens of video clips showing how to use their products. I’ve even visited their headquarters … Read More


Agentic AI accelerates 3D IC engineering for the AI factory era

Agentic AI accelerates 3D IC engineering for the AI factory era
by Admin on 11-02-2026 at 6:00 am

Agentic AI Reimagines 3D IC Engineering

By Sudarshan Deo, software R&D Manager for 3D IC, Siemens

What if you could completely rethink what an EDA workflow looks like for the increasingly complex 3D ICs powering the next generation of AI factories? Siemens’ expanded agentic AI portfolio is automating the hardest parts of 3D IC engineering.

At NVIDIA GTC Berlin 2026,… Read More


CEO Interview with Dr. Sean Wei of Easy-Logic

CEO Interview with Dr. Sean Wei of Easy-Logic
by Daniel Nenni on 10-30-2026 at 10:00 am

Easy Logic Technology functional ECO profile

Dr. Wei has served as CEO of Easy-Logic since 2020, focusing on building a strong operational foundation for the company. Previously, as CTO, he led the development of the core algorithms and tool architecture for the flagship product EasylogicECO, seamlessly aligning EasylogicECO technology with user needs.

Dr. Wei holds … Read More


SEMICON West 2026: AI Made the Steps Faster. The Time Between Them Is Next.

SEMICON West 2026: AI Made the Steps Faster. The Time Between Them Is Next.
by Joel Jorgensen on 10-29-2026 at 10:00 am

SemiWiki SEMICON West Inline Time Between

The semiconductor industry crossed $1 trillion in annual revenue this year, almost four years ahead of earlier projections. SEMI President and CEO Ajit Manocha opened the CEO Summit at SEMICON West with a chart that told the story. A year ago, the forecast for 2030 was $1 trillion. Now it is $2 trillion, with $3 trillion possible … Read More


PDF Solutions CONNECT 2026 Trip Report

PDF Solutions CONNECT 2026 Trip Report
by Lauro Rizzatti on 10-29-2026 at 8:00 am

PDF Solutions CONNECT 2026 trip report

On October 15–16, at the tail end of SEMICON West 2026, PDF Solutions held its 2026 CONNECT Conference at the Westin St. Francis in San Francisco.

PDF Solutions Vitals
Santa Clara–based PDF Solutions is a semiconductor data, analytics, and connectivity company, founded in 1991. Today, its business rests on three pillars, all … Read More