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GenAlpha Brings a Practical Approach for Analog AI to DAC 2026

GenAlpha Brings a Practical Approach for Analog AI to DAC 2026
by Mike Gianfagna on 08-31-2026 at 10:00 am

GenAlpha Booth

Agentic AI was everywhere at DAC 2026. Various focus areas were presented that covered many parts of the chip design flow. Verification and debug were a popular topic since so much time is spent there. Analog design is another pressure point. Every chip design has analog content. While the size of the analog blocks may not be huge,… Read More


Exploiting agentic automation cost-effectively. Innovation in Verification

Exploiting agentic automation cost-effectively. Innovation in Verification
by Bernard Murphy on 08-31-2026 at 6:00 am

Innovation New

Frontier models (Claude, etc.) are very powerful but becoming expensive for high token counts. Methods to exploit a mix of models, including local open-weight models, are attracting attention. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer… Read More


Will Agentic AI Help the Open-Source EDA Market?

Will Agentic AI Help the Open-Source EDA Market?
by Daniel Nenni on 08-28-2026 at 8:00 am

Will Agentic AI Help the Open Source EDA Market

Agentic artificial intelligence is likely to give the open-source electronic design automation market a meaningful boost. Its biggest contribution will not be the immediate replacement of established commercial platforms from Cadence, Synopsys, or Siemens. Instead, agentic AI can make open-source tools easier to use, … Read More


The End of “Good Enough” Timing Analysis

The End of “Good Enough” Timing Analysis
by Mike Gianfagna on 08-27-2026 at 6:00 am

The End of Good Enough Timing Analysis

Why Advanced-Node Clock Networks Need More Than Timing Closure

Timing closure has been one of the semiconductor industry’s most reliable measures of design readiness for decades. Static timing analysis (STA) is a critical enabler for this process. It allows analysis of enormous designs across millions of paths, multiple… Read More


Bronco AI at DAC 2026, What a Difference a Year Makes

Bronco AI at DAC 2026, What a Difference a Year Makes
by Mike Gianfagna on 08-26-2026 at 6:00 am

Bronco AI at DAC 2026, What a Difference a Year Makes

During my time at DAC 2026 I felt like I was attending two events. One was the traditional DAC where approaches to designing complex chips using the best tools and methodologies were the focus. There was another focus for the conference. This one was like the traditional DAC with an important difference. Here, the discussion centered… Read More


Synopsys Wins the AI Silicon Brain Drain

Synopsys Wins the AI Silicon Brain Drain
by Daniel Nenni on 08-25-2026 at 4:00 pm

Synopsys Wins the AI SIlicon Brain Drain

The reported move of Amit Gupta, Jeff Dyck, and Ryan Silk from Siemens EDA to Synopsys matters because this is more than a routine transfer of experienced executives and engineers. Together, the three represent a concentrated body of expertise in applying artificial intelligence to semiconductor design—one of the most strategically… Read More


Webinar: Warpage has a Timing Problem

Webinar: Warpage has a Timing Problem
by Daniel Nenni on 08-25-2026 at 9:00 am

Thermo mechanical (1)

In advanced packaging, warpage is rarely a modeling problem. It is a timing problem.

JOHN BRUGGEMAN


By the time many advanced packages undergo high-fidelity thermo-mechanical analysis, a long chain of decisions has already been made. Stackup. Materials. Die placement. Package architecture. Each decision constrains the Read More


Optimizing for Thermoelastic in Package and PCB Design from the Outset

Optimizing for Thermoelastic in Package and PCB Design from the Outset
by Bernard Murphy on 08-25-2026 at 6:00 am

Vinci image

Signoff-quality design tools are mandatory for signoff, though not so good for early design exploration. Signoff demands high accuracy in design description and high precision in analysis. The first requirement can’t be met early in design where architecture decisions are still in flux, and the second depends on very detailed… Read More


Avestra: Agentic AI for SystemVerilog Assertion Generation

Avestra: Agentic AI for SystemVerilog Assertion Generation
by Daniel Nenni on 08-24-2026 at 2:00 pm

Avestra Studio Tuple Tech

Modern ASIC, SoC, CPU, and GPU development depends on verification processes that detect subtle functional defects before tapeout. SystemVerilog Assertions (SVA) are particularly important because they encode temporal design intent: how signals, states, and transactions must behave across clock cycles. Unlike conventional… Read More


Synopsys Cloud at DAC 2026

Synopsys Cloud at DAC 2026
by Daniel Payne on 08-24-2026 at 8:00 am

Synopsys Cloud FlexEDA

Cloud-based EDA has been around for awhile now, so at #DAC2026 I met with Vikram Bhatia, Executive Director of Synopsys Cloud to see what’s new with their offering. His background includes stints at Sun, IBM, Microsoft, HP, Oracle and NetApp. The Synopsys Cloud FlexEDA lets designs teams run their EDA solutions inside of a web browser,… Read More