IC Mask SemiWiki Webinar Banner
WP_Term Object
(
    [term_id] => 70
    [name] => Dassault Systemes
    [slug] => dassault-systemes
    [term_group] => 0
    [term_taxonomy_id] => 70
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 44
    [filter] => raw
    [cat_ID] => 70
    [category_count] => 44
    [category_description] => 
    [cat_name] => Dassault Systemes
    [category_nicename] => dassault-systemes
    [category_parent] => 157
    [is_post] => 
)

Behind the 3DEXPERIENCE for Silicon

Behind the 3DEXPERIENCE for Silicon
by Don Dingee on 10-31-2016 at 4:00 pm

We’ve been covering the Dassault Systèmes “Silicon Thinking” platform for a while here, but, as I’m often prone to do, I wanted to explore the backstory to uncover more about the concept. With over 25M users of their product lifecycle management (PLM) solutions, why is Dassault Systèmes becoming so interested in semiconductor… Read More


Latest Pinpoint Release Tackles DRC and Trend Lines

Latest Pinpoint Release Tackles DRC and Trend Lines
by Don Dingee on 07-06-2016 at 4:00 pm

After reading previous SemiWiki coverage on Dassault Systèmes and their ENOVIA Pinpoint solution, one big item seemed missing: how does this thing actually work? With all due respect to our other bloggers who covered when Dassault Systèmes acquired Pinpoint from Tuscany Design Automation, why Qualcomm is using Pinpoint, and… Read More


Sustainability, Semiconductor Companies and Software Companies

Sustainability, Semiconductor Companies and Software Companies
by Daniel Payne on 02-25-2016 at 12:00 pm

I certainly want to leave the Earth a better place to live for my children and generations to come, so sustainability is a value that resonates with me. How is a consumer like me to know which companies are the most sustainable in areas that matter, like:… Read More


The Mechanical Reliability of IC Packages

The Mechanical Reliability of IC Packages
by Daniel Payne on 01-31-2016 at 12:00 pm

At Intel back in the late 1970’s we were designing DRAM chips and mounting them in ceramic and plastic packages, however there were problems when some of the die would crack inside of the package because of thermal mismatch issues with how the die was attached to the heat spreader inside the package. Back then we really didn’t… Read More


Semiconductors and Conflict Minerals

Semiconductors and Conflict Minerals
by Daniel Payne on 12-21-2015 at 12:00 pm

Our semiconductor industry uses many different materials and chemicals in the production of chips, boards and electronic systems. But what should we do if the minerals like tantalum, tin, tungsten and gold are coming from the eastern provinces of the Democratic Republic of the Congo where armed bandits are forcing workers against… Read More


An Easier Way to Reach Design Closure for SoC

An Easier Way to Reach Design Closure for SoC
by Daniel Payne on 11-30-2015 at 12:00 pm

It’s really challenging to reach design closure of an SoC by meeting timing constraints, staying within the power budget, tracking progress, communicating within the team, minimizing the floorplan, maximizing manufacturability and eliminating hotspots. Most SoC design teams have EDA tools from multiple vendors,… Read More


How Can Big Data and EDA Tools Help?

How Can Big Data and EDA Tools Help?
by Daniel Payne on 10-30-2015 at 12:00 pm

Big data is a headline phrase that I see appear almost weekly now in my newsfeed, so it’s probably time that I start paying more attention to the growing trend because it does impact how technology-driven, EDA tool flows are being used. From my last trip to DAC I recall only two companies that were really focused on system-level… Read More


Enterprise Design Management Comes of Age

Enterprise Design Management Comes of Age
by Tom Simon on 09-22-2015 at 12:00 pm

The motivations for having a data and process management system in place for semiconductor design have existed for a long time. I am reluctant to admit it, but I remember early efforts to do this back in the 80’s at Valid Logic. Cadence was also developing this capability in house through the early 90’s. Back then designs were much … Read More


Talking Directly to EDA R&D

Talking Directly to EDA R&D
by Daniel Payne on 08-02-2015 at 12:00 pm

Many EDA companies keep their R&D engineers focused on product development and bug fixing, shielding them from any and all direct contact with end-users, mostly for fear of what might be revealed if such direct dialog were allowed. Customer support people are allowed to talk directly with customers, then pass along enhancement… Read More


A Systems Company Update from #52DAC

A Systems Company Update from #52DAC
by Daniel Payne on 07-01-2015 at 12:00 pm

On Sunday night at DAC we heard from Gary Smith that traditional EDA companies need to grow into new market segments in order to stay relevant, and that a systems-level approach to multi-disciplinary engineering was called for. I almost jumped out of my seat and said, “Hey, what about Dassault? They are already doing that … Read More