In today’s rapidly advancing technological landscape, semiconductors are at the heart of innovation across diverse industries such as automotive, healthcare, telecommunications, and consumer electronics. As a leader in technology and engineering, Siemens plays a pivotal role in empowering the next generation … Read More
Alphawave Semi Bridges from Theory to Reality in Chiplet-Based AI
GenAI, the most talked-about manifestation of AI these days, imposes two tough constraints on a hardware platform. First, it demands massive memory to serve large language model with billions of parameters. Feasible in principle for a processor plus big DRAM off-chip and perhaps for some inference applications but too slow … Read More
The Data Crisis is Unfolding – Are We Ready?
The rapid advancement of technology, including generative AI, IoT, and autonomous vehicles, is revolutionizing industries and enhancing efficiency. At the same time, such advances also generate huge amounts of data to be transmitted and processed to make sense and provide value to consumers and society as a whole. In essence,… Read More
MZ Technologies Enables Multi-Die Design with GENIO
MZ Technologies is a unique company that enables multi-die design by providing critical planning and analysis tools that sit above the traditional EDA design flow. Chip and package design tools are good at what they do. Given a set of constraints, they will deliver a good result. The question is, what is the right set of constraints? … Read More
Synopsys SNUG Silicon Valley Conference 2024: Powering Innovation in the Era of Pervasive Intelligence
After the leadership transition at the top, Synopsys had just a little more than two months before the company’s flagship event, the Synopsys User Group (SNUG) conference. The Synopsys user community and entire ecosystem were waiting to hear new CEO Sassine Ghazi’s keynote to learn where the company is going and its strategic … Read More
2024 DVCon US Panel: Overcoming the challenges of multi-die systems verification
2024 DVCon was very busy this year. Bernard Murphy and I were in attendance for SemiWiki, he has already written about it. Multi die and chiplets was again a popular topic. Lauro Rizzatti, a consultant specializing in hardware-assisted verification, moderated an engaging panel, sponsored by Synopsys, focusing on the intricacies… Read More
Unleash the Power: NVIDIA GPUs, Ansys Simulation
In the realm of engineering simulations, the demand for faster, more accurate solutions to complex multiphysics challenges is ever-growing.
Simulation is a vital tool for engineers to design, test, and optimize complex systems and products. It helps engineers reduce costs, improve quality, and accelerate innovation. However,… Read More
2024 Outlook with Elad Alon of Blue Cheetah Analog Design
We have been working with Blue Cheetah Analog Design for three years now with great success. With new process nodes coming faster than ever before and with chiplets being pushed to the forefront of technology, the die-to-die interconnect traffic on SemiWiki has never been greater and chiplets is one of our top search terms.
Tell… Read More
Cadence Debuts Celsius Studio for In-Design Thermal Optimization
Continuing the multiphysics theme, I talked recently with Melika Roshandell (Product Management Director at Cadence) on the continuing convergence between MCAD and ECAD. You should know first that Melika has a PhD in mechanical engineering and an extensive background in thermal engineering at Broadcom and Qualcomm, all very… Read More
Chiplet ecosystems enable multi-vendor designs
Chiplets dominate semiconductor industry conversations right now – and after the recent Chiplet Summit, we expect the intensity to go up a couple of notches. One company name often heard is Blue Cheetah, and we had the opportunity to sit down with them recently to discuss their views and their just-announced design win at Tenstorrent.… Read More
The Intel Common Platform Foundry Alliance