We have talked about Cadence subsystem IP strategy, illustrated by NVM Express subsystem IP, in a previous blog. What we said was that “A subsystem IP based approach will also speed up the software development and validation phase: if the IP provider is able to propose the right tools, like the associated Verification IP (VIP), … Read More
An Approach to 20nm IC Design
Last month at DAC I learned how IBM, Cadence, ARM, GLOBALFOUNDRIES and Samsung approach the challenges of SoC design, EDA design and fabrication at the 20nm node. Today I followed up by reading a white paper on 20nm IC design challenges authored by Cadence, a welcome relief to the previous marketing mantra of EDA 360.
Here’s… Read More
How has 20nm Changed the Semiconductor Ecosystem?
What does mango beer have to do with semiconductor design and manufacturing? At a table of beer drinkers from around the world I would have never thought fruity beer would pass a taste test, not even close. As it turns out, the mango beer is very good! Same goes for 20nm planar devices. “Will not work”, “Will not yield”, “Will not scale”,… Read More
Cadence at Semicon West Next Week: 2.5D and 3D
Next week it is Semicon West in the Moscone Center from Tuesday to Thursday, July 10-12th. Cadence will be on a panel session during a session entitled The 2.5D and 3D packaging landscape for 2015 and beyond. This starts with 3 short keynotes:
- 1.10pm to 1.25pm: Dr John Xie of Altera on Interposer integration through chip on wafer on
Cadence’s NVM Express: fruit from subsystem IP based strategy
If we look at SoC design evolution, we have certainly successfully passed several steps: from transistor by transistor IC design using Calma up to design methodology based on the integration of 500K + gates IP like PCIe gen-3 Controller, one out of several dozens of IP integrated in today’ SoC for Set-Top-Box or Wireless Application… Read More
Cadence IP Strategy 2012
As I mentioned in a previous blog Cadence Update 2012, Martin Lund is now in charge of the Cadence IP strategy. Martin read my first blog and wanted to exchange IP strategies so we met at DAC 2012 for a chat. Not only did Martin connect with me on LinkedIn, he also joined the SemiWiki LinkedIn group, which now has 4,000+ members. So yes,… Read More
Cadence/TSMC 3D
Mark Twain remarked that everyone talks about the weather but nobody does anything about it. 3D ICs seems to be a bit like that. Over the last couple of years there have been lots of people talking about 3D but very little that has actually been manufactured. In addition to the weather, everyone talks about Xilinx’s 3D Virtex… Read More
ST using Cadence IC Tools with Module Generators
Cadence invited Francois Lemery of ST Microelectronics to speak at a luncheon last Monday at DAC about designing for the 20nm node using module generators. Here are my trip report notes:
Collaboration at 28nm, 20nm and 14nm
Wednesday morning I attended a panel discussion with: ARM, IBM, Cadence, GLOBALFOUNDRIES and Samsung.
The panelists all sang the same song of collaboration between EDA, IP and Foundry to enable 28nm, 20nm and even 14nm.… Read More
CDN Live in Munich: Cadence is back on track!
Before going to Munich to attend to CDN-Live, I took a look at the agenda to figure out which presentations to attend, and I must say it was not so easy to choose: CDN Live agendais dense, with multiple tracks running in parallel (Custom Design, Digital Implementations, Design IP, Functional Verifications and Verification IP, PCB… Read More