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Shorter, better and easier PCIe and NVM Express Verification flow with advanced technologies

Shorter, better and easier PCIe and NVM Express Verification flow with advanced technologies
by Eric Esteve on 07-19-2012 at 8:05 pm

We have talked about Cadence subsystem IP strategy, illustrated by NVM Express subsystem IP, in a previous blog. What we said was that “A subsystem IP based approach will also speed up the software development and validation phase: if the IP provider is able to propose the right tools, like the associated Verification IP (VIP), … Read More


An Approach to 20nm IC Design

An Approach to 20nm IC Design
by Daniel Payne on 07-17-2012 at 10:10 am

Last month at DAC I learned how IBM, Cadence, ARM, GLOBALFOUNDRIES and Samsung approach the challenges of SoC design, EDA design and fabrication at the 20nm node. Today I followed up by reading a white paper on 20nm IC design challenges authored by Cadence, a welcome relief to the previous marketing mantra of EDA 360.

Here’s… Read More


How has 20nm Changed the Semiconductor Ecosystem?

How has 20nm Changed the Semiconductor Ecosystem?
by Daniel Nenni on 07-15-2012 at 7:30 pm


What does mango beer have to do with semiconductor design and manufacturing? At a table of beer drinkers from around the world I would have never thought fruity beer would pass a taste test, not even close. As it turns out, the mango beer is very good! Same goes for 20nm planar devices. “Will not work”, “Will not yield”, “Will not scale”,… Read More


Cadence at Semicon West Next Week: 2.5D and 3D

Cadence at Semicon West Next Week: 2.5D and 3D
by Paul McLellan on 07-05-2012 at 5:32 pm

Next week it is Semicon West in the Moscone Center from Tuesday to Thursday, July 10-12th. Cadence will be on a panel session during a session entitled The 2.5D and 3D packaging landscape for 2015 and beyond. This starts with 3 short keynotes:

  • 1.10pm to 1.25pm: Dr John Xie of Altera on Interposer integration through chip on wafer on
Read More

Cadence’s NVM Express: fruit from subsystem IP based strategy

Cadence’s NVM Express: fruit from subsystem IP based strategy
by Eric Esteve on 07-02-2012 at 11:24 am

If we look at SoC design evolution, we have certainly successfully passed several steps: from transistor by transistor IC design using Calma up to design methodology based on the integration of 500K + gates IP like PCIe gen-3 Controller, one out of several dozens of IP integrated in today’ SoC for Set-Top-Box or Wireless Application… Read More


Cadence IP Strategy 2012

Cadence IP Strategy 2012
by Daniel Nenni on 06-17-2012 at 7:00 pm

As I mentioned in a previous blog Cadence Update 2012, Martin Lund is now in charge of the Cadence IP strategy. Martin read my first blog and wanted to exchange IP strategies so we met at DAC 2012 for a chat. Not only did Martin connect with me on LinkedIn, he also joined the SemiWiki LinkedIn group, which now has 4,000+ members. So yes,… Read More


Cadence/TSMC 3D

Cadence/TSMC 3D
by Paul McLellan on 06-11-2012 at 5:16 pm

Mark Twain remarked that everyone talks about the weather but nobody does anything about it. 3D ICs seems to be a bit like that. Over the last couple of years there have been lots of people talking about 3D but very little that has actually been manufactured. In addition to the weather, everyone talks about Xilinx’s 3D Virtex… Read More


Collaboration at 28nm, 20nm and 14nm

Collaboration at 28nm, 20nm and 14nm
by Daniel Payne on 06-06-2012 at 11:23 am


Wednesday morning I attended a panel discussion with: ARM, IBM, Cadence, GLOBALFOUNDRIES and Samsung.

The panelists all sang the same song of collaboration between EDA, IP and Foundry to enable 28nm, 20nm and even 14nm.… Read More


CDN Live in Munich: Cadence is back on track!

CDN Live in Munich: Cadence is back on track!
by Eric Esteve on 05-18-2012 at 3:44 am

Before going to Munich to attend to CDN-Live, I took a look at the agenda to figure out which presentations to attend, and I must say it was not so easy to choose: CDN Live agendais dense, with multiple tracks running in parallel (Custom Design, Digital Implementations, Design IP, Functional Verifications and Verification IP, PCB… Read More