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Learning from In-House Datasets

Learning from In-House Datasets
by Bernard Murphy on 10-22-2025 at 6:00 am

Training in a Constrained Environment min

At a DAC Accellera panel this year there was some discussion on cross-company collaboration in training. The theory is that more collaboration would mean a larger training set and therefore higher accuracy in GenAI (for example in RTL generation). But semiconductor companies are very protective of their data and reports of copyrighted… Read More


PDF Solutions Calls for a Revolution in Semiconductor Collaboration at SEMICON West

PDF Solutions Calls for a Revolution in Semiconductor Collaboration at SEMICON West
by Mike Gianfagna on 10-21-2025 at 6:00 am

PDF Solutions Calls for a Revolution in Semiconductor Collaboration at SEMICON West

SEMICON West was held in Phoenix, Arizona on October 7-9. This premier event brings the incredibly diverse global electronics supply chain together to address the semiconductor ecosystem’s greatest opportunities and challenges. The event’s tagline this year is:

Stronger Together — Shaping a Sustainable Future in Talent,Read More


The AI PC: A New Category Poised to Reignite the PC Market

The AI PC: A New Category Poised to Reignite the PC Market
by Jonah McLeod on 10-20-2025 at 10:00 am

Fig 1

The PC industry is entering its most significant transformation since the debut of the IBM PC in 1981. That original beige box ushered in a new era of productivity, reshaping how corporations and individuals worked, communicated, and created. More than four decades later, the AI PC is emerging as a new category — one that promises… Read More


Webinar – The Path to Smaller, Denser, and Faster with CPX, Samtec’s Co-Packaged Copper and Optics

Webinar – The Path to Smaller, Denser, and Faster with CPX, Samtec’s Co-Packaged Copper and Optics
by Mike Gianfagna on 10-17-2025 at 6:00 am

Webinar – The Path to Smaller, Denser, and Faster with CPX, Samtec’s Co Packaged Copper and Optics

For markets such as data center, high-performance computing, networking and AI accelerators the battle cry is often “copper is dead”. The tremendous demands for performance and power efficiency often lead to this conclusion. As is the case with many technology topics, things are not always the way they seem. It turns out a lot … Read More


Webinar – IP Design Considerations for Real-Time Edge AI Systems

Webinar – IP Design Considerations for Real-Time Edge AI Systems
by Mike Gianfagna on 10-16-2025 at 10:00 am

Webinar – IP Design Considerations for Real Time Edge AI Systems

It is well-known that semiconductor growth is driven by AI. That simple statement breaks down into many complex use cases, each with its own requirements and challenges. A webinar will be presented by Synopsys on October 23 that focuses on the specific requirements for one of the most popular use cases – AI at the edge. The speaker… Read More


Secure-IC and Silicon Labs Raise the Bar for Hardware Security

Secure-IC and Silicon Labs Raise the Bar for Hardware Security
by Mike Gianfagna on 10-14-2025 at 8:00 am

Secure IC and Silicon Labs Raise the Bar for Hardware Security

Cybersecurity is getting more critical every day. Thanks to sophisticated AI attacks, the need for hardware chip-level security is greater than ever. To fortify hardware against these types of attacks is not easy. There are three key attributes of a successful strategy: a well-designed root-of-trust, collaboration to ensure… Read More


Why Choose PCIe 5.0 for Power, Performance and Bandwidth at the Edge?

Why Choose PCIe 5.0 for Power, Performance and Bandwidth at the Edge?
by Kalar Rajendiran on 10-14-2025 at 6:00 am

PCIe 5.0 Impact Across Markets

Synopsys recently held a webinar session on this topic and Gustavo Pimentel, Principal Product Marketing Manager at the company led the webinar session. Going into the webinar session, I found myself wondering: why focus on PCIe 5.0, eight years after its release? With the industry buzzing about Edge AI, cloud computing, and … Read More


Exploring TSMC’s OIP Ecosystem Benefits

Exploring TSMC’s OIP Ecosystem Benefits
by Daniel Nenni on 10-10-2025 at 6:00 am

TSMC Booth

Now that the dust has settled let’s talk more about TSMC’s Open Innovation Platform. Launched in 2008, OIP represents a groundbreaking collaborative model in the semiconductor industry. Unlike IDMs that controlled the entire supply chain, OIP fosters an “open horizontal” ecosystem uniting TSMC… Read More


Demand Meets Design: RISC-V and the Next Wave of AI Hardware

Demand Meets Design: RISC-V and the Next Wave of AI Hardware
by Kalar Rajendiran on 10-09-2025 at 10:00 am

Optimum Compute Watt Per Layer

Artificial intelligence (AI) is transforming every layer of computing, from hyperscale data centers training trillion-parameter models to battery-powered edge devices performing real-time inference. Hardware requirements are escalating on every front: compute density is increasing, power budgets are tightening, … Read More


Moores Lab(AI): Agentic AI and the New Era of Semiconductor Design

Moores Lab(AI): Agentic AI and the New Era of Semiconductor Design
by Kalar Rajendiran on 10-08-2025 at 10:00 am

Silicon Engineering at the Speed of AI

For decades, chip design has been a delicate balance of creativity and drudgery. Architects craft detailed specifications, engineers read those documents line by line, and teams write and debug thousands of lines of Verilog and UVM code. Verification alone can consume up to 35 percent of a project’s cost and add many months to … Read More