As semiconductor design pushes into increasingly complex territory, driven by Ai, ML, HPC, and heterogeneous system architectures, designers are challenged to balance performance, power, and time-to-market pressures. In this landscape, network-on-chip (NoC) architectures have emerged as a foundational building block… Read More
WEBINAR: Why Network-on-Chip (NoC) Has Become the Cornerstone of AI-Optimized SoCs
By Andy Nightingale, VP of Product Management and Marketing
As AI adoption accelerates across markets, including automotive ADAS, large-scale compute, multimedia, and edge intelligence, the foundations of system-on-chip (SoC) designs are being pushed harder than ever. Modern AI engines generate tightly coordinated, … Read More
Live Webinar: Considerations When Architecting Your Next SoC: NoC with Arteris and Aion Silicon
The explosive growth of AI and accelerated computing is placing unprecedented demands on system-on-chip (SoC) design. Modern AI workloads require extremely high bandwidth, ultra-low latency, and energy-efficient data movement across increasingly heterogeneous architectures. As SoCs scale to incorporate clusters of… Read More
The IO Hub: An Emerging Pattern for System Connectivity in Chiplet-Based Designs
In chiplet-based design we continue the march of Moore’s Law by scaling what we can put in a semiconductor package beyond the boundaries of what we can build on a single die. This style is already gaining traction in AI applications, high performance computing, and automotive, each of which aims to scale out to highly integrated … Read More
Arteris Simplifies Design Reuse with Magillem Packaging
Many know Arteris as the “network-on-chip”, or NoC, company. Through acquisitions and forward-looking development, the footprint for Arteris has grown beyond smart interconnect IP. At DAC this year, Arteris highlighted its latest expansion with a new SoC integration automation product called Magillem Packaging. The announcement… Read More
Arteris at the 2025 Design Automation Conference #62DAC
Key Takeaways:
- Expanded Multi-Die Solution: Arteris showcases its foundational technology for rapid chiplet-based innovation. Check out the multi-die highlights video.
- Ecosystem compatibility: Supported through integration with products from major EDA and foundry partners, including Cadence, Synopsys, and global
Arteris Expands Their Multi-Die Support
I am tracking the shift to multi-die design, so it’s good to see Arteris extend their NoC expertise, connecting chiplets across an interposer. After all, network connectivity needs don’t stop at the boundaries of chiplets. A multi-die package is at a logical level just a scaled-up SoC for which you still need traffic routing and… Read More
How Arteris is Revolutionizing SoC Design with Smart NoC IP
Recently, Design & Reuse held its IP-SoC Days event at the Hyatt Regency in Santa Clara. Advanced IP drives a lot of the innovation we are seeing in chip design. This event provides a venue for IP providers to highlight the latest products and services and share a vision of the future. IP consumers are anxious to hear about all the… Read More
Podcast EP277: How Arteris FlexGen Smart NoC IP Democratizes Advanced Chip Design with Rick Bye
Dan is joined by Rick Bye, director of product management and marketing at Arteris with responsibility for the FlexNoC family of non-coherent Network-on-Chip IP products. Rick joined Arteris from Arm where he was a senior product manager in the Client Line of Business, responsible for a demonstration SoC and compression IP. … Read More
Is Arteris Poised to Enable Next Generation System Design?
The semiconductor ecosystem is changing. Monolithic design is becoming multi-die design. Processors no longer inform software development options. It’s now the other way around with complex AI software informing the design of purpose-built hardware. And all that special-purpose hardware needs drivers to make it come to … Read More

