You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today!
WP_Term Object
(
[term_id] => 497
[name] => Arteris
[slug] => arteris
[term_group] => 0
[term_taxonomy_id] => 497
[taxonomy] => category
[description] =>
[parent] => 178
[count] => 156
[filter] => raw
[cat_ID] => 497
[category_count] => 156
[category_description] =>
[cat_name] => Arteris
[category_nicename] => arteris
[category_parent] => 178
[is_post] =>
)
WP_Term Object
(
[term_id] => 497
[name] => Arteris
[slug] => arteris
[term_group] => 0
[term_taxonomy_id] => 497
[taxonomy] => category
[description] =>
[parent] => 178
[count] => 156
[filter] => raw
[cat_ID] => 497
[category_count] => 156
[category_description] =>
[cat_name] => Arteris
[category_nicename] => arteris
[category_parent] => 178
[is_post] =>
)
By Andy Nightingale, VP of Product Management and Marketing
As AI adoption accelerates across markets, including automotive ADAS, large-scale compute, multimedia, and edge intelligence, the foundations of system-on-chip (SoC) designs are being pushed harder than ever. Modern AI engines generate tightly coordinated, … Read More
The explosive growth of AI and accelerated computing is placing unprecedented demands on system-on-chip (SoC) design. Modern AI workloads require extremely high bandwidth, ultra-low latency, and energy-efficient data movement across increasingly heterogeneous architectures. As SoCs scale to incorporate clusters of… Read More
In chiplet-based design we continue the march of Moore’s Law by scaling what we can put in a semiconductor package beyond the boundaries of what we can build on a single die. This style is already gaining traction in AI applications, high performance computing, and automotive, each of which aims to scale out to highly integrated … Read More
Many know Arteris as the “network-on-chip”, or NoC, company. Through acquisitions and forward-looking development, the footprint for Arteris has grown beyond smart interconnect IP. At DAC this year, Arteris highlighted its latest expansion with a new SoC integration automation product called Magillem Packaging. The announcement… Read More
Key Takeaways:
- Expanded Multi-Die Solution: Arteris showcases its foundational technology for rapid chiplet-based innovation. Check out the multi-die highlights video.
- Ecosystem compatibility: Supported through integration with products from major EDA and foundry partners, including Cadence, Synopsys, and global
…
Read More
I am tracking the shift to multi-die design, so it’s good to see Arteris extend their NoC expertise, connecting chiplets across an interposer. After all, network connectivity needs don’t stop at the boundaries of chiplets. A multi-die package is at a logical level just a scaled-up SoC for which you still need traffic routing and… Read More
Recently, Design & Reuse held its IP-SoC Days event at the Hyatt Regency in Santa Clara. Advanced IP drives a lot of the innovation we are seeing in chip design. This event provides a venue for IP providers to highlight the latest products and services and share a vision of the future. IP consumers are anxious to hear about all the… Read More
Dan is joined by Rick Bye, director of product management and marketing at Arteris with responsibility for the FlexNoC family of non-coherent Network-on-Chip IP products. Rick joined Arteris from Arm where he was a senior product manager in the Client Line of Business, responsible for a demonstration SoC and compression IP. … Read More
The semiconductor ecosystem is changing. Monolithic design is becoming multi-die design. Processors no longer inform software development options. It’s now the other way around with complex AI software informing the design of purpose-built hardware. And all that special-purpose hardware needs drivers to make it come to … Read More
Modern semiconductor devices, a far cry from the chips we once knew, are now highly complex intelligent systems used in datacenters, communications infrastructure, in consumer electronics, automotive, home and office automation, almost everywhere. All such applications build around large subsystems, invariably compute,… Read More