Next-gen AI accelerators, high-performance processors, and complex computing architectures depend heavily on advanced packaging. Bringing multiple dies, chiplets, high-bandwidth memory, and advanced interconnects together into a single 2.5D or 3D package yields massive performance gains. However, this design evolution… Read More
Podcast EP345: The Impact of the New proteanTecs PVT Plus Sensors with Nir Sever
Daniel is joined by Nir Sever, Senior Director of Business Development at proteanTecs. Nir has over 30 years of experience in advanced VLSI engineering. Before joining proteanTecs, he served for 10 years as the COO of Tehuti Networks, a pioneer in high-speed networking semiconductors. Prior to that, he served for 9 years as Senior… Read More
proteanTecs at Chiplet Summit – Changing the Game for Health & Performance Monitoring of Chiplets
The recent Chiplet Summit 2026 was a great place to learn about new chiplet designs, emerging standards, and a growing array of support technologies to help design and manufacture chiplet-based systems. In my travels at the show, I found a lot of technology that fit these descriptions. But there were also companies at the show that… Read More
Intelligent Networks: Power, Reliability, and Maintenance in Telecom — Webinar Preview
The upcoming webinar “Intelligent Networks: Power, Reliability, and Maintenance in Telecom” will focus on how telecommunications networks are adapting to growing demands for efficiency, resilience, and scalability. As telecom operators expand 5G deployments, integrate cloud-native architectures, and prepare for AI-driven… Read More
Accelerating NPI with Deep Data: From First Silicon to Volume
For decades, semiconductor teams have relied on traditional methods such as corner-based analysis, surrogate monitors, and population-level statistical screening for post-silicon validation. These methods served well when variability was modest, and timing paths behaved predictably. However, today’s advanced nodes… Read More
Failure Prevention with Real-Time Health Monitoring: A proteanTecs Innovation
In the complex world of semiconductors, reliability, availability, and serviceability (RAS) have become paramount, especially as devices shrink to nanoscale geometries like 2nm. At the recent 2025 TSMC OIP Forum Noam Brousard, VP of Solutions Engineering at proteanTecs, presented “Failure Prevention with Real-Time… Read More
Podcast EP313: How proteanTecs Optimizes Production Test
Daniel is joined by Alex Burlak is Vice President of Test & Analytics at proteanTecs. With combined expertise in production testing and data analytics of ICs and system products, Alex joined proteanTecs in October, 2018. Before joining the company, Alex held a Senior Director of Interconnect and Silicon Photonics Product… Read More
Thermal Sensing Headache Finally Over for 2nm and Beyond
By Nir Sever, Senior Director Business Development, proteanTecs
Silicon-proven LVTS for 2nm: a new era of accuracy and integration in thermal monitoring
Effective thermal management is crucial to prevent overheating and optimize performance in modern SoCs. Inadequate temperature control due to inaccurate thermal sensing… Read More
DAC News – proteanTecs Unlocks AI Hardware Growth with Runtime Monitoring
As AI models grow exponentially, the infrastructure supporting them is struggling under the pressure. At DAC, one company stood out with a solution that doesn’t just monitor chips, it empowers them to adapt in real time to these new workload requirements.
Unlike traditional telemetry or post-silicon debug tools, proteanTecs… Read More
Webinar – Power is the New Performance: Scaling Power & Performance for Next Generation SoCs
What if you could reduce power and extend chip lifetime, without compromising performance? We all know the importance of power optimization for advanced SoCs. Thanks to the massive build out of AI workloads, power consumption has gone from a cost or cooling headache to an existential threat to the planet, if current power consumptions… Read More

