Yes, it means complete hardware and software integration, debugging, verification, optimization of performance and power and all other operational aspects of an electronic system in semiconductor design. In modern SoCs, several IPs, RTL blocks, software modules, firmware and so on sit together on a single chip, hence making… Read More
Author: Pawan Fangaria
Early Test –> Less Expensive, Better Health, Faster Closure
I am talking about the health of electronic and semiconductor design, which if made sound at RTL stage, can set it right for the rest of the design cycle for faster closure and also at lesser cost. Last week was the week of ITC(International Test Conference) for the Semiconductor and EDA community. I was looking forward to what ITC… Read More
Semiconductor Manufacturing in India?
Last week I heard about the Indian Cabinet approving the proposal for setting up of two Fabs in India. One led by IBM, Tower Jazzand JP Associates(an Indian business house), and the other led by HSMC(Hindustan Semiconductor Manufacturing Co.), ST Microelectronicsand Silterra. Indian Semiconductor community including IESA… Read More
Emerging Trend – Choose DRAM as per Your Design Need
Lately I was studying about new innovations in memory world such as ReRAM and Memristor. As DRAM (although it has become a commodity) has found its extensive use in mobile, PC, tablet and so on, that was an inclination too to know more about. While reviewing Cadence’s offering in memory subsystems, I came across this whitepaperwhich… Read More
Rapid Yield Optimization at 22nm Through Virtual Fab
Remember? During DAC2013 I talked about a new kind of innovation: A Virtual Fabrication Platform, SEMulator3D, developed by COVENTOR. Now, to my pleasant surprise, there is something to report on the proven results from this platform. IBM, in association with COVENTOR, has successfully implemented a 3D Virtual Fabrication… Read More
Real Time Concurrent Layout Editing – It’s Possible
Layout editing is a complex task, traditionally done manually by designers, and the layout design productivity largely depends on the designer’s skills and expertise. However, a good tool with features for ease of design is a must. Layout productivity has been an area of focus and various features are constantly being added in… Read More
Reliability sign-off has several aspects – One Solution
Here, I am talking about reliability of chip design in the context of electrical effects, not external factors like cosmic rays. So, the electrical factors that could affect reliability of chips could be excessive power dissipation, noise, EM (Electromigration), ESD (Electrostatic Discharge), substrate noise coupling and… Read More
20nm IC production needs more than a ready Foundry
I think by now all of us know, or have heard about 20nm process node, its PPA (Power, Performance, Area) advantages and challenges (complexity of high design size and density, heterogeneity, variability, stress, lithography complexities, LDEs and so on). I’m not going to get into the details of these challenges, but will ponder… Read More
Innovation + Thoughtful Management = Productive Expansion
After looking at various aspects of this company, to sum up, I couldn’t find any better statement than this; thoughtful management here is actually leadership with passion which achieves tangible results. This reflects in the methodology of doing things in this company which has given it a place among top EDA companies in a span… Read More
Let’s Drive To Dearborn on 19th Sep….
[The VLC developed by Edison2, winner of the Progressive Automotive X-Prize]
Now that we have “The Very Light Car” of the world at more than 100 MPG!! Yes, this is the car developed by Edison2, one among the three winners of the Progressive Insurance Automotive X-Prize, a global competition; Edison2 won in the main stream class. … Read More
Next Generation of Systems Design at Siemens