Linley Mobile

Linley Mobile
by Paul McLellan on 04-19-2013 at 12:11 pm

I was at the Linley Mobile Microprocessor conference earlier in the week. Well, just the first day since the second day overlapped with the GSA Silicon Summit. The first surprise was seeing Mike Demler in a suit. It turns out that he has joined the Linley Group as a full-time analyst in the mobile space.


Linley Gwennap started the day… Read More


Moore, or More Than Moore?

Moore, or More Than Moore?
by Paul McLellan on 04-19-2013 at 12:05 pm

Yesterday was the 2013 GSA Silicon Summit, which was largely focused on contrasting what advances in delivering systems will depend on marching down the ladder of process nodes, and which will depend on innovations in packaging technology. So essentially contrasting Moore’s Law with what has come to be known as More Than… Read More


Denali+Tensilica+Cosmic = Cadence

Denali+Tensilica+Cosmic = Cadence
by Paul McLellan on 04-17-2013 at 1:00 am

I won’t be able to attend Chris Rowen’s presentation here at the GlobalPress Electronic Summit since I’m going to the first day of the Linley Mobile Microprocessor conference. In fact I wonder if Chris himself will make it since he was running in the Boston marathon on Monday. He finished about 10 minutes before… Read More


Atrenta, Forte and Jasper LOVE DAC

Atrenta, Forte and Jasper LOVE DAC
by Paul McLellan on 04-16-2013 at 8:20 pm

I LOVE DAC is back. This year the sponsors are Atrenta, Jasper and Forte (hey, all semiwiki subscribers). The way it works is that you register on the DAC website here and you get a free three-day exhibit pass. In addition to everything going on in the exhibit hall, including the pavilion panels held there, the pass also gives access… Read More


Wally Rhines: Embedded Software the Next Revolution?

Wally Rhines: Embedded Software the Next Revolution?
by Paul McLellan on 04-16-2013 at 8:10 pm

As seems to be traditional, Wally Rhines gave a keynote here at the GlobalPress Electronics Summit here in sunny Santa Cruz. It was entitled Embedded Software, the Next Revolution in EDA. Unlike Cadence and Synopsys, Mentor has a strong position in embedded software. It has been build up over a long time through a series of acquisitions… Read More


Cavendish Kinetics

Cavendish Kinetics
by Paul McLellan on 04-16-2013 at 8:05 pm

I have spent the last couple of days at the GlobalPress Electronics Summit at the Chaminade Resort in Santa Cruz. Hey, it’s tough, but someone has to do it. One interesting presentation was from Cavendish Kinetics. It is especially interesting because many years ago Cavendish was founded by Mike Beunder, who I know well since… Read More


Xilinx: Hide the RTL

Xilinx: Hide the RTL
by Paul McLellan on 04-16-2013 at 7:30 pm

Tom Feist of Xilinx presented here at the GlobalPress Electronics Summit about their strategy to take design abstraction up another level. In the SoC world, we are still pretty much stuck at the RTL level and have moved to higher abstractions by using an IP strategy. But at least all IC designers are RTL-literate.


Xilinx, in the Vivado… Read More


Altera, Intel, TSMC, ARM: the Plot Thickens

Altera, Intel, TSMC, ARM: the Plot Thickens
by Paul McLellan on 04-16-2013 at 7:15 pm

Vince Hu of Altera presented us her at the GlobalPress Electronics Summit on their process roadmap. Since just a month or two ago they announced that Intel would be their foundry at 14nm, everyone wanted to get a better idea of what was really going on.

At 28nm, Altera use 2 processes, TSMC 28HP (for high end Stratix-5 devices) and TSMC… Read More


Ivo Bolsens’ Keynote on the All-Programmable SoC

Ivo Bolsens’ Keynote on the All-Programmable SoC
by Paul McLellan on 04-13-2013 at 8:00 pm

Ivo Bolsens, the CTO of Xilinx, is giving the opening keynote at the Electronic Design Process Symposium (EDPS) in Monterey on Thursday and Friday this coming week. The title of his keynote is The All Programmable SoC – At the Heart of Next Generation Embedded Systems. He covers a lot of ground but the core of his presentation… Read More


3D IC: Are We There Yet?

3D IC: Are We There Yet?
by Paul McLellan on 04-13-2013 at 4:42 pm

For the last few years, thru silicon via (TSV) based ICs have been looming in the mist of the future. Just how far ahead are they? Xiliinx famously has a high-end gate-array in production on a 2.5D interposer, Micron has a memory cube, TSMC has done various things in 3D that it calls CoWoS (chip on wafer on substrate), Qualcomm have been… Read More