We are all familiar with the tradeoffs between copper and fiber for digital signal transmission. The short version is that fiber is flexible, like copper but supports higher data rates with less loss over longer distances. The bad news is that converting digital signals to light and back again isn’t a trivial process. These kinds… Read More
Author: Mike Gianfagna
How Intel, Samsung and TSMC are Changing the World
Given the changes in the music business, the term “Rock Star” doesn’t really have any relevance to music or its performers anymore. Instead, we use the term to describe leaders, innovators and generally people or organizations of great significance. In the world of semiconductors, the designers of advanced chips were the rock… Read More
A Bold View of Future Product Development with Matt Genovese
Matt Genovese is the founder of Planorama Design, a software requirements and user experience design professional services company. The company designs simple and intuitive software and IoT product user interfaces for complex, technical applications and systems. Its unique and proven approach reduces client development… Read More
A Look at the Winners of the Silicon Catalyst/Arm Silicon Startups Contest
Silicon Catalyst is the world’s only incubator focused exclusively on semiconductor solutions. This unique position puts the organization in the center of many new technology innovations. Recently, a Semiconductor Startups Contest was announced in collaboration with Arm. You can learn more about the details of the… Read More
Wally Rhines Predicts the Future of AI at #60DAC
Dr. Walden Rhines has appeared many times on SemiWiki. His discussions touch on a variety of topics, most recently on the health of EDA and IP. His knowledge of our industry is substantial, and he always seems to have a new take on the trends and technologies that are unfolding around us. So, when Wally took the stage for a keynote address… Read More
Altair’s Jim Cantele Predicts the Future of Chip Design
We all know chip design is changing in substantial ways and at a fast pace. The demands being placed on semiconductor systems are growing dramatically, and the innovation being delivered to address those demands is just as dramatic. Everyone seems to have an opinion on these trends, and a set of predications to make sense out of it… Read More
Intel Enables the Multi-Die Revolution with Packaging Innovation
The trend is undeniable. Highly integrated monolithic chips can no longer handle the demands of next-generation systems. The reasons for this significant shift in design are many. Much has been written on the topic; you can get a good overview of the forces at play in multi-die design here. These changes represent the next chapter… Read More
The Siemens Digital Industries Software View of AI and its Impact on System Design
The impact of AI seems to be everywhere. Products are smarter, doing more of what used to be done by the humans. Complex tasks can be completed quicker and with greater accuracy and failures can now be predicted more reliably and repaired before they even occur. The AI technologies used to make all this happen and how those technologies… Read More
TSMC Redefines Foundry to Enable Next-Generation Products
For many years, monolithic chips defined semiconductor innovation. New microprocessors defined new markets, as did new graphics processors, and cell-phone chips. Getting to the next node was the goal, and when the foundry shipped a working part victory was declared. As we know, this is changing. Semiconductor innovation is… Read More
PCI-SIG DevCon and Where Samtec Fits
PCIe (peripheral component interconnect express) is an interface standard for connecting high-speed components contained in PCs, MACs and other types of processors. Think graphics, storage arrays, Wi-Fi and the like. This communication standard has become incredibly popular. The first version of the standard was released… Read More
More Headwinds – CHIPS Act Chop? – Chip Equip Re-Shore? Orders Canceled & Fab Delay