You can read all these articles in the latest CEVA Newsletter, if you didn’t read it first in Semiwiki! The blog describing the “Maximum Likelihood MIMO Implementation” is certainly going deep technically, as it introduce a complex Digital Signal Processing technique, Multiple Input Multiple Output (MIMO). MIMO is just like… Read More
Author: Eric Esteve
PCI Express 4 specification just released for PCI-SIG DevCon
I have been alerted by a blog from Moshik Rubin from Cadence: PCI-SIG has finally released the PCIe 4.0 rev 0.3 specification for members’ review, on time for the PCI-SIG developers conference last June in Santa Clara. Since the early days of PCI Express in 2005, Denali (at that time, now Cadence) has positioned the PCIe VIP… Read More
ARC EM DSP supports Always-on Devices
The ARC EM family is the low-power, embedded and low footprint processor part of the larger ARC processor. To target the ultra low-power markets like wearable and IoT, Synopsys has added DSP capabilities to EM5D and EM7D. To be specific, these cores are optimized for ultra low-power control and DSP, thanks to:
- Energy-efficient
IP Accelerated (Bye Bye EDA 360)
Synopsys has been extremely active, during the last 10 years, not only launching new IP products every year, but also running an ambitious acquisition strategy, with no less than 8 acquisitions. Cascade acquisition bring PCI Express (controller only), when Accelerant bring SerDes (the earth of any PHY IP). The MIPS/Chipidea… Read More
CEVA Webinar: DSP solution for mobile and wearable devices
CEVA is well known as DSP IP core provider for Wireless Application Processor, but the Teak-Lite IP family is also very successful for Audio application, with more than 3 billion Audio IC shipped to date. CEVA is proposing a webinar addressing two of the most important IoT needs, a DSP based Audio implementation and CEVA-Bluetooth… Read More
Synopsys Galaxy Platform & Lynx Design System supports FD-SOI
This is a new brick that Synopsys brings to build FD-SOI credibility. We have talked at Semiwiki about FD-SOI technology developed by the LETI and STM, and recently endorsed by Samsung Foundry, offering a more than credible second source to STM. And we have said that the FD-SOI introduction will need to be supported by EDA and IP vendors… Read More
Getting the best from a Radio Spectrum: MIMO
Exchanging data through wireless network is that we are doing every day, every hour if not every minute. Not only we use our smartphone to discuss or exchange Emails, but also to download, or upload, massive amounts of data. Thus, the radio spectrum has become to be busy, and is an expansive piece for carriers. Optimizing this radio… Read More
Cadence Go (war-game) strategy
I was attending to CDN-Live in Munich last week, so I was expecting Cadence to announce new IP related acquisition like Lip-Bu Tan did last year (Cosmic Circuit, Evatronix and Tensilica). In fact, Lip-Bu was not in Munich and Charlie Huang, SVP Worldwide Field Operations and System & Verification Group, was holding the morning… Read More
STM FD-SOI Manufacturing Double Source: Samsung
Let’s start with apologies: when guessing that SMIC would be the 2[SUP]nd[/SUP] source foundry for ST-Microelectronics 28nm FD-SOI, I was wrong. To be honest, if I had made the assumption that Samsung was this double source, I would have generated dozen of comments, calling me “crazy blogger”…for the best. Announcing Samsung… Read More
Selecting the Right Standard Cell & Memory for 28HPM DSP core: real case with CEVA XC4210
Listening to a webinar at your desk, in front of a PC screen will never replace a live presentation, but the lesson learned to time spent ratio can be incredibly higher than when traveling to a conference to listen several presentation. If you are interested by the approach taken by a complex DSP design team to overcome the various … Read More
More Headwinds – CHIPS Act Chop? – Chip Equip Re-Shore? Orders Canceled & Fab Delay