In a significant milestone for the semiconductor industry, Teradyne was honored as the 2025 TSMC Open Innovation Platform® Partner of the Year for TSMC 3DFabric® Testing. This award, announced on September 25, 2025, underscores the deep collaboration between Teradyne, a leader in automated test equipment and robotics, and… Read More
Author: Daniel Nenni
Sofics’ ESD Innovations Power AI and Radiation-Hardened Breakthroughs on TSMC Platforms
In the fast-evolving semiconductor landscape, electrostatic discharge (ESD) protection is pivotal for ensuring chip reliability amid shrinking nodes and extreme applications. Sofics, a Belgian IP provider specializing in ESD solutions for ICs, has cemented its leadership through strategic collaborations showcased … Read More
CEO Interview with Gary Spittle of Sonical
British-born, California-based entrepreneur, Gary Spittle, is the founder of Sonical – a disruptive, forward-thinking audio brand that is currently on the cusp of delivering something quite remarkable: think immersive, wireless, and completely lossless.
Gary holds a PhD. He investigated the use of binaural audio for improving… Read More
Thalia and X-FAB Forge Strategic Partnership to Safeguard Supply and Accelerate IP Migration
In a move that underscores the semiconductor industry’s push toward resilient supply chains and agile innovation, Thalia Design Automation and X-FAB Silicon Foundries have announced a strategic partnership aimed at safeguarding supply continuity and accelerating intellectual property (IP) migration. This collaboration,… Read More
CEO Interview with David Zhi LuoZhang of Bronco AI
David Zhi LuoZhang is Co-Founder and CEO of Bronco AI with extensive experience in building AI systems for mission-critical high-stakes applications. Previously while at Shield AI, he helped train AI pilots that could beat top human F-15 and F-16 fighter pilots in aerial combat. There, he created techniques to improve ML interpretability… Read More
Synopsys and TSMC Unite to Power the Future of AI and Multi-Die Innovation
In a rapidly evolving semiconductor landscape, where AI demands unprecedented computational power and efficiency, Synopsys has deepened its partnership with TSMC to pioneer advancements in AI-driven designs and multi-die systems. Announced during the TSMC OIP Ecosystem Summit last week, this collaboration leverages … Read More
Revolutionizing AI Infrastructure: Alchip and Ayar Labs’ Co-Packaged Optics Breakthrough at TSMC OIP 2025
In the relentless race to power next-generation artificial intelligence (AI) systems, data connectivity has emerged as the critical bottleneck. As AI models balloon in size—from billions to trillions of parameters—compute resources alone are insufficient. According to Ayar Labs, approximately 70% of AI compute time is … Read More
Synopsys Collaborates with TSMC to Enable Advanced 2D and 3D Design Solutions
Synopsys has deepened its collaboration with TSMC certifying the Ansys portfolio of simulation and analysis tools for TSMC’s cutting-edge manufacturing processes including N3C, N3P, N2P, and A16. This partnership empowers chip designers to perform precise final checks on designs, targeting applications in AI acceleration,… Read More
CEO Interview with Jiadi Zhu of CDimension
Jiadi Zhu is the CEO and founder of CDimension, a company rethinking chip design to shape the next generation of computing. Under his leadership, CDimension is creating the next generation of building blocks for chips, starting with materials and scaling up to full systems that can power everything from today’s AI and advanced… Read More
CEO Interview with Howard Pakosh of TekStart
Howard Pakosh is a serial entrepreneur and angel investor. Mr. Pakosh is also Founder & CEO of the TekStart Group, a Toronto-based boutique incubator focusing on Fractional-C business development support, as well as developing, promoting and licensing technology into markets such as blockchain, Internet-of-Things… Read More










Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools