Paul McLellan was on assignment in Hong Kong last week so I attended the Linley Mobile Conference and was not surprised Intel did not present. During the networking sessions I asked more than a dozen people why and the answers were pretty focused on “Intel still does not play well with others” and “Intel’s current mobile offerings… Read More
Author: Daniel Nenni
New Method for Metrology with sub-10 nm Lithrography
NewPath Research will describe their new method for nanoscale carrier profiling in semiconductors on May 19[SUP]th[/SUP] at the Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) in Saratoga Springs, NY. This new method is intended to fill the gap that has been addressed in the Roadmaps for the semiconductor… Read More
TSMC Updates: 20nm, 16nm, and 10nm!
*Spoiler Alert: The Sky is Not Falling*
The TSMC Technology Symposium last month provided a much needed technology refresh to counter aging industry experts (they make their living selling reports) who have been somewhat negative on the future of the fabless semiconductor ecosystem. If the sky wasn’t falling who would… Read More
The Number One ASIC Racing Team!
This weekend I was in the pits for the Flying Lizard Motorsports team at the Monterey Grand Prix. It was an auction item (donated by eSilicon) at EDA’s 50[SUP]th[/SUP] Anniversary party last year, and let me tell you it was an amazing experience and a very interesting story, absolutely. But first let me tell you that if you get a “Hot… Read More
Aldec is Celebrating 30 Years @ #51DAC!
Dr. Stanley Hyduke founded Aldec in 1984 and their first product was delivered in 1985, named SUSIE (Standard Universal Simulator for Improved Engineering), a gate-level, DOS-based simulator. The SUSIE simulator was priced lower than other EDA vendor tools from the big three: Daisy, Mentor and Valid (aka DMV). Today, Aldec … Read More
Kurt Shuler: Arteris Presentation at EDPS 2014
The Electronic Design Process Symposium is an annual workshop run by the IEEE Computer Society of Silicon Valley and the IEEE Council on Electronic Design Automation. I presented there because it’s devoid of product marketing pitches, and is two days of discussion on technical and process issues in SoC design. My slides are here:… Read More
Tanner EDA Helps Customer Productivity Engineering Increase Efficiency and Lower Cost with No Compromise in Performance
Tanner EDA is making waves at their customer’s sites as the mixed-signal design suite from Tanner EDA, Incentia Design Systems, Inc. and Aldec, Inc. helps ASIC Design House lower cost and increase efficiency with no compromise in performance. In today’s ‘always on’, Internet of Things connected world, the demand for high-performance,… Read More
Carey Robertson: Reliability Checks in Advanced Nodes
Last week I had the pleasure of presenting at the Electronic Design Process Symposium (EDPS) workshop. This was my first time attending and I was very impressed. There were good presentations but I learned as much from the Q&A and the side conversations before/after/breakfast/lunch/etc. If you have the opportunity to attend,… Read More
Dr. Bernard Murphy: My presentation at EDPS 2014
First, I wish there were more conferences/workshops like this. This is much more about sharing ideas and brainstorming than the stark commercialism of DAC. I presented Atrenta’s role in enabling 3[SUP]rd[/SUP]-party IP qualification for the TSMC soft IP library.
My presentation slides are located here:
http://www.eda.org/edps/Papers/5-3%20Bernard%20Murphy.pdf… Read More
TSMC Will Own the Internet of Things!
In my quest to uncover the future of the semiconductor industry I was quite impressed by the executive presentations at the TSMC Symposium last week. Rick Cassidy opened the 20[SUP]th[/SUP] Annual TSMC Technology Symposium followed by Dr. Mark Liu, Dr. Jack Sun, Dr. Cliff Hou, J.K Wang, Dr. V.J. Wu, and Suk Lee. A variety of topics… Read More









AI Bubble?