EDA CEO Outlook 2017

EDA CEO Outlook 2017
by Daniel Nenni on 04-28-2017 at 7:00 am

A long standing tradition has returned to EDA: The CEO Outlook sponsored by ESDA (formerly EDAC) which alone is worth the price of membership! Not only do you get a free meal, the event included quality networking time with the semiconductor elite. In the past, financial analysts moderated this event holding the CEO’s feet to the… Read More


Machine Learning and EDA!

Machine Learning and EDA!
by Daniel Nenni on 04-21-2017 at 7:00 am

Semiconductor design is littered with complex, data-driven challenges where the cost of error is high. Solido’s new ML (machine learning) Labs, based on Solido’s ML technologies developed over the last 12 years, allows semiconductor companies to collaboratively work with Solido in developing new ML-based EDA products.

Data… Read More


Live from the TSMC Earnings Call!

Live from the TSMC Earnings Call!
by Daniel Nenni on 04-17-2017 at 7:00 am

Last week I was invited to attend the TSMC earnings call at the Shangri-la Hotel in Taipei which was QUITE the experience. I generally listen in on the calls and/or read the transcripts but this was the first one I attended live. I didn’t really know what to expect but I certainly did NOT expect something out of Hollywood. Seriously,… Read More


Machine Learning Accelerates Library Characterization by 50 Percent!

Machine Learning Accelerates Library Characterization by 50 Percent!
by Daniel Nenni on 04-06-2017 at 7:00 am

Standard cell, memory, and I/O library characterization is a necessary, but time-consuming, resource intensive, and error-prone process. With the added complexity of advanced and low power manufacturing processes, fast and accurate statistical and non-statistical characterization is challenging, creating the need … Read More


CEO Interview: Sanjay Keswani of Consensia

CEO Interview: Sanjay Keswani of Consensia
by Daniel Nenni on 04-03-2017 at 7:00 am

Sanjay Keswani founded Consensia in 2013. He has deep experience in the high-tech industry, guiding some of the world’s high profile technology brands through complex innovation and business transformation projects including companies such as Atmel, KLA-Tencor, Hughes Aircraft, and Motorola Mobility. Consensia customers… Read More


SNUG 2017 Keynote: Aart de Geus on EDA Fusion!

SNUG 2017 Keynote: Aart de Geus on EDA Fusion!
by Daniel Nenni on 03-30-2017 at 7:00 am

I spoke with Aart before his SNUG keynote and found him to be very relaxed and upbeat about EDA and our future prospects which reminded me of my first ever (cringe-worthy) blog, “EDA is Dead”. Now, eight years later, we have what Aart calls “EDA Fusion” to thank for the reemergence of EDA as a semiconductor superpower, absolutely.… Read More


eFabless Design Challenge Results!

eFabless Design Challenge Results!
by Daniel Nenni on 03-28-2017 at 7:00 am

Will community engineering work for semiconductors? Will anyone show up? Well, the efabless design challenge is complete and the results are both interesting and encouraging, absolutely!

Efabless completed its low power voltage reference IP design challenge on Monday, March 13. This was a very interesting event that we followed… Read More


Samsung Should Just Buy eSilicon Already!

Samsung Should Just Buy eSilicon Already!
by Daniel Nenni on 03-22-2017 at 12:00 pm

As you all know I’m a big fan of the ASIC business dating back to the start of the fabless semiconductor transformation where anybody could send a design spec to an ASIC company and get a chip back. The ASIC business model also started the smart phone revolution when Samsung built the first Apple SoCs for the iPhones and iPads.

Today … Read More


Succeeding with 56G SerDes, HBM2, 2.5D and FinFET

Succeeding with 56G SerDes, HBM2, 2.5D and FinFET
by Daniel Nenni on 03-17-2017 at 4:00 pm

eSilicon presented their advanced ASIC design capabilities at a seminar last Wednesday evening. This event was closed to the press, bloggers and analysts, but I managed to get some details from a friend who attended. The event title was: “Advanced ASICs for the Cloud-Computing Era: Succeeding with 56G SerDes, HBM2, 2.5D and FinFETRead More