Advancing Semiconductor Design: Intel’s Foveros 2.5D Packaging Technology

Advancing Semiconductor Design: Intel’s Foveros 2.5D Packaging Technology
by Admin on 09-15-2025 at 10:00 am

Intel Foundry Packaging Evolution 2025

In the rapidly evolving landscape of semiconductor manufacturing, the demand for processors that handle increasing workloads while maintaining power efficiency and compact form factors has never been higher. Intel’s Foveros 2.5D packaging technology emerges as a pivotal innovation, enabling denser die integration… Read More


Exploring Cycuity’s Radix-ST: Revolutionizing Semiconductor Security

Exploring Cycuity’s Radix-ST: Revolutionizing Semiconductor Security
by Admin on 09-09-2025 at 6:00 am

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Cycuity’s Radix-ST represents a groundbreaking advancement in semiconductor security, addressing the growing complexity and vulnerability of modern chip designs. Introduced on August 27, 2025, by Cycuity, Inc., Radix-ST leverages static analysis techniques to identify and resolve security weaknesses early in the chip… Read More


Smart Verification for Complex UCIe Multi-Die Architectures

Smart Verification for Complex UCIe Multi-Die Architectures
by Admin on 09-08-2025 at 10:00 am

Figure 1

By Ujjwal Negi – Siemens EDA

Multi-die architectures are redefining the limits of chip performance and scalability through the integration of multiple dies into a single package to deliver unprecedented computing power, flexibility, and efficiency. At the heart of this transformation is the Universal Chiplet Interconnect… Read More


Revolutionizing Processor Design: Intel’s Software Defined Super Cores

Revolutionizing Processor Design: Intel’s Software Defined Super Cores
by Admin on 09-07-2025 at 2:00 pm

Intel European CPU Patent Application

In the ever-evolving landscape of computing, Intel’s patent application for “Software Defined Super Cores” (EP 4 579 444 A1) represents a groundbreaking approach to enhancing processor performance without relying solely on hardware scaling. Filed in November 2024 with priority from a U.S. application… Read More


TSMC’s 2024 Sustainability Report: Pioneering a Greener Semiconductor Future

TSMC’s 2024 Sustainability Report: Pioneering a Greener Semiconductor Future
by Admin on 09-07-2025 at 8:00 am

TSMC Substainability Report 2024 2025

TSMC, the world’s most trusted semiconductor foundry, released its 2024 Sustainability Report, underscoring its commitment to embedding environmental, social, and governance principles into its operations. Founded in 1987 and headquartered in Hsinchu Science Park, TSMC employs 84,512 people globally and operates… Read More


Intel’s Commitment to Corporate Responsibility: Driving Innovation and Sustainability

Intel’s Commitment to Corporate Responsibility: Driving Innovation and Sustainability
by Admin on 09-07-2025 at 6:00 am

Intel Corporate Responsibility Report 2025

Introduction by Lip-BU Tan:

I’m an engineer at heart. Nothing motivates me more than solving hard problems. Our teams across Intel are driven by this same mindset—inspired by the power of technology to enable new solutions to our customers’ toughest challenges.

I fundamentally believe this will be a catalyst for innovation throughoutRead More


Cadence’s Strategic Leap: Acquiring Hexagon’s Design & Engineering Business

Cadence’s Strategic Leap: Acquiring Hexagon’s Design & Engineering Business
by Admin on 09-05-2025 at 8:00 am

Cadence Hexagon

In a bold move that underscores the accelerating convergence of electronic design automation (EDA) and mechanical engineering, Cadence Design Systems announced its agreement to acquire Hexagon AB’s Design & Engineering (D&E) business for approximately €2.7 billion, equivalent to about $3.16 billion. This… Read More


Beyond Von Neumann: Toward a Unified Deterministic Architecture

Beyond Von Neumann: Toward a Unified Deterministic Architecture
by Admin on 09-04-2025 at 6:00 am

Beyond Von Neumann

By Thang Tran

For more than half a century, the foundations of computing have stood on a single architecture: the Von Neumann or Harvard model. Nearly all modern chips—CPUs, GPUs, and even many specialized accelerators—rely on some variant of this design. Over time, the industry has layered on complexity and specialization to… Read More


Static Timing Analysis Signoff – A comprehensive and Robust Approach

Static Timing Analysis Signoff – A comprehensive and Robust Approach
by Admin on 09-02-2025 at 6:00 am

pic2 xtalk circuit

By Zameer Mohammed

Once a chip is taped out, changes in design are not possible – Silicon is unforgiving, does not allow postproduction modifications. In contrast, software can be updated after release, but chips remain fixed. Static Timing Analysis (STA) signoff serves as a crucial safeguard against silicon failures.

In modern… Read More


eBook on Mastering AI Chip Complexity: Pathways to First-Pass Silicon Success

eBook on Mastering AI Chip Complexity: Pathways to First-Pass Silicon Success
by Admin on 09-01-2025 at 8:00 am

MArtering AI Chip Complexity Synopsys

The rapid evolution of artificial intelligence (AI) is transforming industries, from autonomous vehicles to data centers, demanding unprecedented computational power and efficiency. As highlighted in Synopsys’ guide, the global AI chip market is projected to reach $383 billion by 2032, growing at a 38% CAGR. This … Read More