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By Ujjwal Negi – Siemens EDA
Multi-die architectures are redefining the limits of chip performance and scalability through the integration of multiple dies into a single package to deliver unprecedented computing power, flexibility, and efficiency. At the heart of this transformation is the Universal Chiplet Interconnect… Read More
In the ever-evolving landscape of computing, Intel’s patent application for “Software Defined Super Cores” (EP 4 579 444 A1) represents a groundbreaking approach to enhancing processor performance without relying solely on hardware scaling. Filed in November 2024 with priority from a U.S. application… Read More
TSMC, the world’s most trusted semiconductor foundry, released its 2024 Sustainability Report, underscoring its commitment to embedding environmental, social, and governance principles into its operations. Founded in 1987 and headquartered in Hsinchu Science Park, TSMC employs 84,512 people globally and operates… Read More
Introduction by Lip-BU Tan:
I’m an engineer at heart. Nothing motivates me more than solving hard problems. Our teams across Intel are driven by this same mindset—inspired by the power of technology to enable new solutions to our customers’ toughest challenges.
I fundamentally believe this will be a catalyst for innovation throughout… Read More
By Thang Tran
For more than half a century, the foundations of computing have stood on a single architecture: the Von Neumann or Harvard model. Nearly all modern chips—CPUs, GPUs, and even many specialized accelerators—rely on some variant of this design. Over time, the industry has layered on complexity and specialization to… Read More
By Zameer Mohammed
Once a chip is taped out, changes in design are not possible – Silicon is unforgiving, does not allow postproduction modifications. In contrast, software can be updated after release, but chips remain fixed. Static Timing Analysis (STA) signoff serves as a crucial safeguard against silicon failures.
In modern… Read More
By Marko Suominen and Slava Zhuchenya of Siemens Digital Industries Software.
It’s often said that an orchestra without a conductor is just a collection of talented individuals making noise. The conductor’s role is to transform that potential cacophony into a unified, beautiful symphony. The same concept holds… Read More
In an era dominated by artificial intelligence (AI), machine learning (ML), and high-performance computing (HPC), the demand for semiconductors that deliver high data throughput, low latency, and energy efficiency has never been greater. Traditional chip designs often struggle to keep pace with these requirements, leading… Read More
Todd Burkholder and Andras Vass-Varnai, Siemens EDA
As semiconductor devices become smaller, more powerful and more densely integrated, thermal management has shifted from an afterthought to a central challenge in modern IC design. In contemporary 3D IC architectures—where multiple chiplets are stacked and closely arrayed—power… Read More
Designing semiconductor chips has traditionally been costly and controlled by a few major Electronic Design Automation (EDA) vendors—Cadence, Synopsys, and Siemens EDA who dominate with proprietary tools protected by NDAs and restrictive licenses. Fabrication also requires expensive, often export-controlled equipment.… Read More
Intel’s Pearl Harbor Moment