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By Dina Medhat
Three key takeaways
- 3D ICs require fundamentally new ESD verification strategies. Traditional 2D approaches cannot address the complexity and unique connections in stacked-die architectures.
- Classifying external and internal IOs is essential for robust and cost-efficient ESD protection. Proper differentiation
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By Andy Nightingale, VP of Product Management and Marketing
As AI adoption accelerates across markets, including automotive ADAS, large-scale compute, multimedia, and edge intelligence, the foundations of system-on-chip (SoC) designs are being pushed harder than ever. Modern AI engines generate tightly coordinated, … Read More
By Jason Liu, RFIC-GPT Inc.
Radio frequency integrated circuits (RFICs) have become increasingly critical in modern electronic systems, driven by the rapid growth of wireless communication technologies (5G/6G), the Internet of Things (IoT), and advanced radar systems. With the desire for lower power consumption, higher… Read More
By Niranjan Sitapure
Artificial intelligence (AI) is reshaping industries worldwide. Consumer-grade AI solutions are getting significant attention in the media for their creativity, speed, and accessibility—from ChatGPT and Meta’s AI app to Gemini for image creation, Sora for video, Sona for music, and Perplexity for web… Read More
By Nikhil Sharma, Sunghwan Son, Paul Mantey
The semiconductor industry faces an unprecedented crisis that threatens the very foundation of technological innovation. According to the latest Siemens EDA / Wilson Research Study, first-silicon success rates have plummeted to just 14%[1]—the lowest figure in more than twenty… Read More
Murat Eskiyerli, PhD, is the founder of Revolution EDA
Modern software development environments have evolved dramatically. A developer can download Visual Studio Code, install a few plugins, and be productive within minutes. The cost? Perhaps a few hundred dollars per month for cloud development resources. Compare that to… Read More
By Todd Burkholder and Per Viklund, Siemens EDA
The landscape of advanced IC packaging is rapidly evolving, driven by the imperative to support innovation on increasingly complex and high-capacity products. The broad industry trend toward heterogeneous integration of diverse die and chiplets into advanced semiconductor… Read More
By Liyue Yan (lyan1@bu.edu)
Fact 1: In the Computer History Museum, how many artifacts are about Electronic Design Automation (EDA)? Zero.
Fact 2: The average starting base salary for a software engineer at Netflix is $219K, and that number is $125K for Cadence; the starting base salary for a hardware engineer at Cadence is $119K… Read More
By Kamal Khan
The semiconductor world has always been the beating heart of tech innovation, powering everything from our smartphones to the latest AI breakthroughs. However, as chip complexity increases and market demands accelerate, adherence to traditional development cycles may be stagnating design teams and slowing … Read More
By Kamal Khan
In today’s semiconductor industry, success hinges not only on innovation but also on discipline in managing complexity. Every system-on-chip (SoC) is built from hundreds of reusable IP blocks—standard cells, memories, interfaces, and analog components. These IPs are the foundation of the design. But if the foundation… Read More
Quantum Computing Technologies and Challenges